CN100556495C - 气体回收装置、测试头及ic器件测试装置 - Google Patents

气体回收装置、测试头及ic器件测试装置 Download PDF

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Publication number
CN100556495C
CN100556495C CNB2004800184847A CN200480018484A CN100556495C CN 100556495 C CN100556495 C CN 100556495C CN B2004800184847 A CNB2004800184847 A CN B2004800184847A CN 200480018484 A CN200480018484 A CN 200480018484A CN 100556495 C CN100556495 C CN 100556495C
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China
Prior art keywords
cooling fluid
gas
host body
concentration unit
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2004800184847A
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English (en)
Chinese (zh)
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CN1812826A (zh
Inventor
西浦孝英
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Advantest Corp
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Advantest Corp
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Publication of CN1812826A publication Critical patent/CN1812826A/zh
Application granted granted Critical
Publication of CN100556495C publication Critical patent/CN100556495C/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CNB2004800184847A 2003-06-30 2004-06-25 气体回收装置、测试头及ic器件测试装置 Expired - Fee Related CN100556495C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPPCT/JP03/08299 2003-06-30
PCT/JP2003/008299 WO2005004571A1 (ja) 2003-06-30 2003-06-30 発熱素子冷却用カバー、発熱素子実装装置およびテストヘッド

Publications (2)

Publication Number Publication Date
CN1812826A CN1812826A (zh) 2006-08-02
CN100556495C true CN100556495C (zh) 2009-11-04

Family

ID=33549064

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800184847A Expired - Fee Related CN100556495C (zh) 2003-06-30 2004-06-25 气体回收装置、测试头及ic器件测试装置

Country Status (9)

Country Link
US (1) US7072180B2 (enExample)
EP (1) EP1645318A4 (enExample)
JP (1) JP4275668B2 (enExample)
KR (1) KR100813125B1 (enExample)
CN (1) CN100556495C (enExample)
AU (1) AU2003246165A1 (enExample)
MY (1) MY131476A (enExample)
TW (1) TW200511923A (enExample)
WO (1) WO2005004571A1 (enExample)

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WO2007057959A1 (ja) 2005-11-17 2007-05-24 Advantest Corporation デバイス実装装置、テストヘッド及び電子部品試験装置
WO2009031415A1 (ja) * 2007-09-06 2009-03-12 Advantest Corporation 電子部品冷却装置、それを備えたテストヘッド及び電子部品試験装置
US8391006B2 (en) * 2007-09-14 2013-03-05 Advantest Corporation Water jacket for cooling an electronic device on a board
JP4703633B2 (ja) * 2007-12-04 2011-06-15 株式会社東芝 冷却プレート構造
CN102197313B (zh) 2008-10-28 2016-05-18 爱德万测试株式会社 测试装置及电路模块
US8289039B2 (en) * 2009-03-11 2012-10-16 Teradyne, Inc. Pin electronics liquid cooled multi-module for high performance, low cost automated test equipment
CN103093848B (zh) * 2011-10-28 2015-12-09 原子高科股份有限公司 85Kr源的制备及回收工艺
US20160081220A1 (en) * 2014-09-15 2016-03-17 Cisco Technology, Inc. Reduction of Intake Resistance for Air Flow Enhancement
JP2016188780A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
KR20160117082A (ko) 2015-03-31 2016-10-10 최민석 인터넷 검색 시스템
US10309732B2 (en) * 2015-12-11 2019-06-04 Hanon Systems Internal degas feature for plate-fin heat exchangers
JP7412277B2 (ja) * 2020-06-02 2024-01-12 東京エレクトロン株式会社 検査装置及び検査方法
CN112015253A (zh) * 2020-09-14 2020-12-01 深圳比特微电子科技有限公司 一种液冷板散热器和计算设备
CN114705972B (zh) * 2022-05-06 2023-05-09 中国软件评测中心(工业和信息化部软件与集成电路促进中心) 一种集成电路性能测试装置及其测试方法
US20240084821A1 (en) * 2022-09-13 2024-03-14 Us Hybrid Corporation Self-priming cooling jacket
TWI891269B (zh) * 2024-03-05 2025-07-21 英業達股份有限公司 電路板測試系統與電路板測試裝置

Citations (2)

* Cited by examiner, † Cited by third party
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JP2002280507A (ja) * 2001-03-19 2002-09-27 Advantest Corp 発熱素子冷却装置および発熱素子実装装置
CN1093733C (zh) * 1996-08-06 2002-10-30 株式会社爱德万测试 安装有电子器件的印刷电路板

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CN1093733C (zh) * 1996-08-06 2002-10-30 株式会社爱德万测试 安装有电子器件的印刷电路板
JP2002280507A (ja) * 2001-03-19 2002-09-27 Advantest Corp 発熱素子冷却装置および発熱素子実装装置

Also Published As

Publication number Publication date
TW200511923A (en) 2005-03-16
WO2005004571A1 (ja) 2005-01-13
US7072180B2 (en) 2006-07-04
WO2005002294A3 (ja) 2005-03-03
US20050056102A1 (en) 2005-03-17
WO2005002294A2 (ja) 2005-01-06
TWI353211B (enExample) 2011-11-21
EP1645318A4 (en) 2009-05-13
EP1645318A2 (en) 2006-04-12
KR20060023569A (ko) 2006-03-14
CN1812826A (zh) 2006-08-02
KR100813125B1 (ko) 2008-03-17
JPWO2005002294A1 (ja) 2006-08-10
MY131476A (en) 2007-08-30
JP4275668B2 (ja) 2009-06-10
AU2003246165A1 (en) 2005-01-21

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Granted publication date: 20091104

Termination date: 20110625