CN100552513C - 供应、接合驱动电路板用的设备、方法及其盒式外壳 - Google Patents

供应、接合驱动电路板用的设备、方法及其盒式外壳 Download PDF

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Publication number
CN100552513C
CN100552513C CNB2007101086565A CN200710108656A CN100552513C CN 100552513 C CN100552513 C CN 100552513C CN B2007101086565 A CNB2007101086565 A CN B2007101086565A CN 200710108656 A CN200710108656 A CN 200710108656A CN 100552513 C CN100552513 C CN 100552513C
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CN
China
Prior art keywords
substrate
circuit board
drive circuit
worktable
tcp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2007101086565A
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English (en)
Chinese (zh)
Other versions
CN101126875A (zh
Inventor
徐志源
朴永根
朴丙敞
金万济
安廷祐
朴赞庆
白永焕
陈明出
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SFA Engineering Corp
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SFA Engineering Corp
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Publication date
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Publication of CN101126875A publication Critical patent/CN101126875A/zh
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Publication of CN100552513C publication Critical patent/CN100552513C/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
CNB2007101086565A 2006-06-29 2007-06-07 供应、接合驱动电路板用的设备、方法及其盒式外壳 Expired - Fee Related CN100552513C (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR1020060059524 2006-06-29
KR1020060059523 2006-06-29
KR1020060059525 2006-06-29
KR1020060059523A KR100722452B1 (ko) 2006-06-29 2006-06-29 구동용 회로기판 본딩장치 및 그 방법
KR1020060062030 2006-07-03

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2009101355039A Division CN101556391B (zh) 2006-06-29 2007-06-07 供应、接合驱动电路板用的设备、方法及其盒式外壳

Publications (2)

Publication Number Publication Date
CN101126875A CN101126875A (zh) 2008-02-20
CN100552513C true CN100552513C (zh) 2009-10-21

Family

ID=38278405

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2007101086565A Expired - Fee Related CN100552513C (zh) 2006-06-29 2007-06-07 供应、接合驱动电路板用的设备、方法及其盒式外壳
CN2009101355039A Expired - Fee Related CN101556391B (zh) 2006-06-29 2007-06-07 供应、接合驱动电路板用的设备、方法及其盒式外壳

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2009101355039A Expired - Fee Related CN101556391B (zh) 2006-06-29 2007-06-07 供应、接合驱动电路板用的设备、方法及其盒式外壳

Country Status (2)

Country Link
KR (1) KR100722452B1 (ko)
CN (2) CN100552513C (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100983337B1 (ko) 2008-12-03 2010-09-20 주식회사 에스에프에이 구동용 회로기판 본딩 장치
KR101152411B1 (ko) 2009-02-10 2012-06-05 세메스 주식회사 필름 패키지 마운팅 장치
CN102749727B (zh) * 2011-04-18 2014-12-03 京东方科技集团股份有限公司 一种异方性导电胶膜的贴附方法
KR101400087B1 (ko) * 2012-05-18 2014-05-28 주식회사 성진하이메크 패널에 탭 아이씨를 가압착하는 가압착 장치
JP6275818B2 (ja) * 2014-02-21 2018-02-07 富士機械製造株式会社 部品受渡装置及び部品実装機
CN109941747A (zh) * 2019-04-24 2019-06-28 无锡先导智能装备股份有限公司 垫片供给机

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030080876A (ko) * 2002-04-11 2003-10-17 한동희 평판디스플레이장치의 회로기판 본딩장치 및 방법
KR100558564B1 (ko) 2005-05-10 2006-03-13 주식회사 에스에프에이 회로기판 본딩장치

Also Published As

Publication number Publication date
KR100722452B1 (ko) 2007-05-28
CN101556391A (zh) 2009-10-14
CN101556391B (zh) 2011-12-14
CN101126875A (zh) 2008-02-20

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Granted publication date: 20091021

Termination date: 20170607