CN100535178C - 溅射方法及其装置 - Google Patents

溅射方法及其装置 Download PDF

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Publication number
CN100535178C
CN100535178C CNB2005100563642A CN200510056364A CN100535178C CN 100535178 C CN100535178 C CN 100535178C CN B2005100563642 A CNB2005100563642 A CN B2005100563642A CN 200510056364 A CN200510056364 A CN 200510056364A CN 100535178 C CN100535178 C CN 100535178C
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CN
China
Prior art keywords
target
substrate
mentioned
magnet
magnetic flux
Prior art date
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CNB2005100563642A
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English (en)
Chinese (zh)
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CN1670243A (zh
Inventor
新井真
石桥晓
小松孝
谷典明
清田淳也
太田淳
中村久三
中村肇
田口信一郎
大石祐一
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Ulvac Inc
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Ulvac Inc
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Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of CN1670243A publication Critical patent/CN1670243A/zh
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Publication of CN100535178C publication Critical patent/CN100535178C/zh
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    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
    • E06B3/70—Door leaves
    • E06B3/72—Door leaves consisting of frame and panels, e.g. of raised panel type
    • E06B3/76—Door leaves consisting of frame and panels, e.g. of raised panel type with metal panels
    • E—FIXED CONSTRUCTIONS
    • E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
    • E05Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES E05D AND E05F, RELATING TO CONSTRUCTION ELEMENTS, ELECTRIC CONTROL, POWER SUPPLY, POWER SIGNAL OR TRANSMISSION, USER INTERFACES, MOUNTING OR COUPLING, DETAILS, ACCESSORIES, AUXILIARY OPERATIONS NOT OTHERWISE PROVIDED FOR, APPLICATION THEREOF
    • E05Y2900/00—Application of doors, windows, wings or fittings thereof
    • E05Y2900/10—Application of doors, windows, wings or fittings thereof for buildings or parts thereof
    • E05Y2900/13—Type of wing
    • E05Y2900/132—Doors
    • E05Y2900/134—Fire doors

Landscapes

  • Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physical Vapour Deposition (AREA)
CNB2005100563642A 2004-03-19 2005-03-18 溅射方法及其装置 Active CN100535178C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004079750 2004-03-19
JP2004079750 2004-03-19
JP2005043618A JP4580781B2 (ja) 2004-03-19 2005-02-21 スパッタリング方法及びその装置
JP2005043618 2005-02-21

Publications (2)

Publication Number Publication Date
CN1670243A CN1670243A (zh) 2005-09-21
CN100535178C true CN100535178C (zh) 2009-09-02

Family

ID=35041676

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100563642A Active CN100535178C (zh) 2004-03-19 2005-03-18 溅射方法及其装置

Country Status (4)

Country Link
JP (1) JP4580781B2 (ja)
KR (1) KR101135389B1 (ja)
CN (1) CN100535178C (ja)
TW (1) TW200538569A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102191470A (zh) * 2010-03-09 2011-09-21 北京北方微电子基地设备工艺研究中心有限责任公司 一种磁控溅射源及等离子体处理设备

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8500975B2 (en) 2004-01-07 2013-08-06 Applied Materials, Inc. Method and apparatus for sputtering onto large flat panels
JP4781964B2 (ja) * 2006-10-27 2011-09-28 信越化学工業株式会社 マグネトロンスパッタ装置
JP4707693B2 (ja) * 2007-05-01 2011-06-22 株式会社アルバック スパッタリング装置及びスパッタリング方法
JP5291907B2 (ja) * 2007-08-31 2013-09-18 株式会社アルバック スパッタリング装置
CN101970713B (zh) * 2008-03-04 2012-08-29 国立大学法人东北大学 旋转磁铁溅射装置
WO2010044269A1 (ja) 2008-10-17 2010-04-22 株式会社アルバック 太陽電池の製造方法
CN102071403B (zh) * 2011-01-30 2012-09-05 东莞市汇成真空科技有限公司 一种平面磁控溅射靶
US10106883B2 (en) 2011-11-04 2018-10-23 Intevac, Inc. Sputtering system and method using direction-dependent scan speed or power
KR20140071058A (ko) * 2012-12-03 2014-06-11 코닝정밀소재 주식회사 롤투롤 스퍼터링 장치
CN110177898B (zh) * 2017-11-01 2021-01-01 株式会社爱发科 溅射装置及成膜方法
KR102376098B1 (ko) * 2018-03-16 2022-03-18 가부시키가이샤 알박 성막 방법
CN115058695B (zh) * 2022-08-11 2022-11-04 广州粤芯半导体技术有限公司 溅射方法及半导体器件的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1157335A (zh) * 1996-02-13 1997-08-20 王福贞 新型永磁控平面阴极电弧源
CN1572900A (zh) * 2003-05-23 2005-02-02 株式会社爱发科 溅射源、溅射装置和溅射方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0421775A (ja) * 1990-05-14 1992-01-24 Fujitsu Ltd スパッタリング装置のカソード
JP3514488B2 (ja) * 1993-06-30 2004-03-31 株式会社アルバック マグネトロンスパッタ方法及び装置
JP3344318B2 (ja) * 1998-05-27 2002-11-11 日本電気株式会社 スパッタ装置
JP2003239069A (ja) * 2002-02-15 2003-08-27 Ulvac Japan Ltd 薄膜の製造方法及び装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1157335A (zh) * 1996-02-13 1997-08-20 王福贞 新型永磁控平面阴极电弧源
CN1572900A (zh) * 2003-05-23 2005-02-02 株式会社爱发科 溅射源、溅射装置和溅射方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102191470A (zh) * 2010-03-09 2011-09-21 北京北方微电子基地设备工艺研究中心有限责任公司 一种磁控溅射源及等离子体处理设备

Also Published As

Publication number Publication date
CN1670243A (zh) 2005-09-21
JP2005298966A (ja) 2005-10-27
TW200538569A (en) 2005-12-01
KR101135389B1 (ko) 2012-04-17
JP4580781B2 (ja) 2010-11-17
TWI377263B (ja) 2012-11-21
KR20060044372A (ko) 2006-05-16

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