CN100524644C - 减小电解抛光工艺中的金属凹槽的虚拟结构 - Google Patents

减小电解抛光工艺中的金属凹槽的虚拟结构 Download PDF

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Publication number
CN100524644C
CN100524644C CNB028165098A CN02816509A CN100524644C CN 100524644 C CN100524644 C CN 100524644C CN B028165098 A CNB028165098 A CN B028165098A CN 02816509 A CN02816509 A CN 02816509A CN 100524644 C CN100524644 C CN 100524644C
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China
Prior art keywords
metal layer
semiconductor structure
dummy
dummy structures
structures
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Expired - Fee Related
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CNB028165098A
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English (en)
Chinese (zh)
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CN1547763A (zh
Inventor
王晖
易培豪
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ACM Research Inc
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ACM Research Inc
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Publication of CN1547763A publication Critical patent/CN1547763A/zh
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Publication of CN100524644C publication Critical patent/CN100524644C/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CNB028165098A 2001-08-23 2002-08-16 减小电解抛光工艺中的金属凹槽的虚拟结构 Expired - Fee Related CN100524644C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31461701P 2001-08-23 2001-08-23
US60/314,617 2001-08-23

Publications (2)

Publication Number Publication Date
CN1547763A CN1547763A (zh) 2004-11-17
CN100524644C true CN100524644C (zh) 2009-08-05

Family

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CNB028165098A Expired - Fee Related CN100524644C (zh) 2001-08-23 2002-08-16 减小电解抛光工艺中的金属凹槽的虚拟结构

Country Status (8)

Country Link
US (1) US20040253810A1 (enExample)
EP (1) EP1419523A4 (enExample)
JP (1) JP2005501412A (enExample)
KR (1) KR101055564B1 (enExample)
CN (1) CN100524644C (enExample)
CA (1) CA2456301A1 (enExample)
TW (1) TW573324B (enExample)
WO (1) WO2003019641A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1505653A1 (en) * 2003-08-04 2005-02-09 STMicroelectronics S.r.l. Layout method for dummy structures and corresponding integrated circuit
US20050045993A1 (en) * 2003-08-28 2005-03-03 Sanyo Electric Co., Ltd. Semiconductor device with concave patterns in dielectric film and manufacturing method thereof
US7074710B2 (en) * 2004-11-03 2006-07-11 Lsi Logic Corporation Method of wafer patterning for reducing edge exclusion zone
JP5401135B2 (ja) * 2009-03-18 2014-01-29 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画方法、荷電粒子ビーム描画装置及びプログラム
KR101067207B1 (ko) 2009-04-16 2011-09-22 삼성전기주식회사 트렌치 기판 및 그 제조방법
US20130075268A1 (en) * 2011-09-28 2013-03-28 Micron Technology, Inc. Methods of Forming Through-Substrate Vias
CN103692293B (zh) * 2012-09-27 2018-01-16 盛美半导体设备（上海）有限公司 无应力抛光装置及抛光方法
US8627243B1 (en) * 2012-10-12 2014-01-07 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for optimizing conductor patterns for ECP and CMP in semiconductor processing
US9496172B2 (en) 2012-11-27 2016-11-15 Acm Research (Shanghai) Inc. Method for forming interconnection structures
US11328992B2 (en) * 2017-09-27 2022-05-10 Intel Corporation Integrated circuit components with dummy structures
US20230335534A1 (en) * 2022-04-13 2023-10-19 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated Circuit Packages and Methods of Forming the Same
JP2023183338A (ja) * 2022-06-15 2023-12-27 日本メクトロン株式会社 導電パターン形成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5885856A (en) * 1996-08-21 1999-03-23 Motorola, Inc. Integrated circuit having a dummy structure and method of making
CN1264162A (zh) * 1999-02-13 2000-08-23 国际商业机器公司 用于铝化学抛光的虚拟图形
US6232231B1 (en) * 1998-08-31 2001-05-15 Cypress Semiconductor Corporation Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPS59182541A (ja) * 1983-04-01 1984-10-17 Hitachi Ltd 半導体装置の製造方法
US5677244A (en) * 1996-05-20 1997-10-14 Motorola, Inc. Method of alloying an interconnect structure with copper
US6017437A (en) * 1997-08-22 2000-01-25 Cutek Research, Inc. Process chamber and method for depositing and/or removing material on a substrate
US6309956B1 (en) * 1997-09-30 2001-10-30 Intel Corporation Fabricating low K dielectric interconnect systems by using dummy structures to enhance process
US6052375A (en) * 1997-11-26 2000-04-18 International Business Machines Corporation High speed internetworking traffic scaler and shaper
TW396524B (en) * 1998-06-26 2000-07-01 United Microelectronics Corp A method for fabricating dual damascene
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
US6709565B2 (en) * 1998-10-26 2004-03-23 Novellus Systems, Inc. Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
US6259115B1 (en) * 1999-03-04 2001-07-10 Advanced Micro Devices, Inc. Dummy patterning for semiconductor manufacturing processes
US6239023B1 (en) * 1999-05-27 2001-05-29 Taiwan Semiconductor Manufacturing Company Method to reduce the damages of copper lines
US6459156B1 (en) * 1999-12-22 2002-10-01 Motorola, Inc. Semiconductor device, a process for a semiconductor device, and a process for making a masking database
JP2002158278A (ja) * 2000-11-20 2002-05-31 Hitachi Ltd 半導体装置およびその製造方法ならびに設計方法
US6486066B2 (en) * 2001-02-02 2002-11-26 Matrix Semiconductor, Inc. Method of generating integrated circuit feature layout for improved chemical mechanical polishing
US6852630B2 (en) 2001-04-23 2005-02-08 Asm Nutool, Inc. Electroetching process and system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5885856A (en) * 1996-08-21 1999-03-23 Motorola, Inc. Integrated circuit having a dummy structure and method of making
US6232231B1 (en) * 1998-08-31 2001-05-15 Cypress Semiconductor Corporation Planarized semiconductor interconnect topography and method for polishing a metal layer to form interconnect
CN1264162A (zh) * 1999-02-13 2000-08-23 国际商业机器公司 用于铝化学抛光的虚拟图形

Also Published As

Publication number Publication date
JP2005501412A (ja) 2005-01-13
TW573324B (en) 2004-01-21
KR101055564B1 (ko) 2011-08-08
WO2003019641A1 (en) 2003-03-06
KR20040027990A (ko) 2004-04-01
CA2456301A1 (en) 2003-03-06
EP1419523A1 (en) 2004-05-19
CN1547763A (zh) 2004-11-17
EP1419523A4 (en) 2007-12-19
US20040253810A1 (en) 2004-12-16

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Granted publication date: 20090805

Termination date: 20180816