CN100521877C - 电子控制装置制造方法 - Google Patents
电子控制装置制造方法 Download PDFInfo
- Publication number
- CN100521877C CN100521877C CNB2005101350569A CN200510135056A CN100521877C CN 100521877 C CN100521877 C CN 100521877C CN B2005101350569 A CNB2005101350569 A CN B2005101350569A CN 200510135056 A CN200510135056 A CN 200510135056A CN 100521877 C CN100521877 C CN 100521877C
- Authority
- CN
- China
- Prior art keywords
- solder
- amount
- circuit board
- printed circuit
- increase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 49
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000005476 soldering Methods 0.000 claims abstract description 34
- 229910000679 solder Inorganic materials 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 10
- 230000001070 adhesive effect Effects 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 abstract description 27
- 230000004888 barrier function Effects 0.000 abstract description 4
- 239000011295 pitch Substances 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 47
- 239000012530 fluid Substances 0.000 description 17
- 238000009434 installation Methods 0.000 description 13
- 238000002791 soaking Methods 0.000 description 12
- 230000004927 fusion Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004372822 | 2004-12-24 | ||
| JP2004372822A JP2006179755A (ja) | 2004-12-24 | 2004-12-24 | 電子制御装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1832665A CN1832665A (zh) | 2006-09-13 |
| CN100521877C true CN100521877C (zh) | 2009-07-29 |
Family
ID=36733554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101350569A Expired - Fee Related CN100521877C (zh) | 2004-12-24 | 2005-12-23 | 电子控制装置制造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006179755A (ja) |
| CN (1) | CN100521877C (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016082074A (ja) * | 2014-10-17 | 2016-05-16 | ダイキン工業株式会社 | 電装装置およびその製造方法 |
-
2004
- 2004-12-24 JP JP2004372822A patent/JP2006179755A/ja active Pending
-
2005
- 2005-12-23 CN CNB2005101350569A patent/CN100521877C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006179755A (ja) | 2006-07-06 |
| CN1832665A (zh) | 2006-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090729 Termination date: 20121223 |