CN100521877C - Manufacturing method for electronic controller - Google Patents
Manufacturing method for electronic controller Download PDFInfo
- Publication number
- CN100521877C CN100521877C CNB2005101350569A CN200510135056A CN100521877C CN 100521877 C CN100521877 C CN 100521877C CN B2005101350569 A CNB2005101350569 A CN B2005101350569A CN 200510135056 A CN200510135056 A CN 200510135056A CN 100521877 C CN100521877 C CN 100521877C
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- pcb
- circuit board
- printed circuit
- production method
- jointing material
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
The objective of the invention is to make the reduction of the soldering failure by decreasing the solder amount used for small pitch components and the ensuring of the bonding strength by increasing the solder amount used for lead components compatible. In order to increase the solder amount for bonding a large lead component 11, after a temporary fixing bond 16 for a chip component 14 is applied in the vicinity of the lands 12 of the large lead component 11, flow soldering of a printed wiring board 13 is carried out. Upon the flow soldering, as the temporary fixing bond 16 serves as a barrier, the solder amount for fixing can be increased. Further, as to other location where the temporary fixing bond is not applied, the solder amount for fixing is determined by the flow angles 18, 19 of proper melted solder so that the reduction of the soldering failure by decreasing the solder amount used for the small pitch components can be made compatible with it.
Description
Technical field
The present invention relates to a kind of manufacturing method for electronic controller, more particularly, relate to and a kind of lead elements and production method thereof is soaked the manufacturing method for electronic controller that fluid welding connects with chip component.
Background technology
In the surface-assembled chip component of printed circuit board (PCB), all to use at present to be used for jointing material (adhesive) that chip component is fixed temporarily.Thisly chip component is carried out temporary fixed jointing material be set between the downside and printed circuit board (PCB) of main part of chip component, chip component is bonded on the printed circuit board (PCB) temporarily, up to later lead elements and production method thereof installation procedure and till soaking fluid welding and connecing operation and finish (example wherein can be opened flat 4-196386 with reference to the open communique spy of Japan Patent).
Below with reference to Fig. 4 existing manufacturing method for electronic controller is described.Fig. 4 is the end view of electronic-controlled installation.At first, intending soaking surface one side that fluid welding connects in printed circuit board (PCB) 13 is coated with to apply and is used to realize temporary fixed jointing material 15.Such jointing material 15 is coated on the position that will install chip component 14 in the printed circuit board (PCB) 13 by application of adhesive material devices such as adhesive flush coaters.
Then, use the chip inserting apparatus to install chip component 14; Again printed circuit board (PCB) is sent into heating furnace, printed circuit board (PCB) is heated to about about 150 ℃.At this moment, being used to carry out temporary fixed jointing material 15 will solidify, and the main part of chip component 14 is fixed on the printed circuit board (PCB) 13.Then, use the lead elements and production method thereof fitting machine to install lead elements and production method thereof 17; Next, for those the large-scale lead elements and production method thereof 11 that can't install by the lead elements and production method thereof fitting machine, by manually installing.
At last, use and to soak fluid welding and connect method the chip component on the printed circuit board (PCB) 13 14, lead elements and production method thereof 17 and large-scale lead elements and production method thereof 11 are welded together.
When soaking fluid welding and connect, in order to guarantee weld strength, preferably increase the soldering tin amount that adheres to/be solidificated on the lead elements and production method thereof, and to suppress with quad-flat-pack method for packing such as (QFP) be the failure welding phenomenon of the little distance members of representative.The simplest method that suppresses the failure welding of little distance members is to reduce the soldering tin amount that adheres to/be solidificated on the little distance members.That is to say, preferably increase, reduce simultaneously attached to the soldering tin amount on the little distance members attached to the soldering tin amount on the lead elements and production method thereof.But in above-mentioned existing manufacturing method for electronic controller, the soldering tin amount that adjust on each parts is very difficult, and its reason as shown in Figure 5.The end view that soaks the electronic-controlled installation of stream has been shown among Fig. 5, wherein 20 are solder baths, the 21st, be in the scolding tin of molten condition.When soaking fluid welding and connect, printed circuit board (PCB) 13 moves to the left from the right side of Fig. 5.
The prevailing method that the soldering tin amount on the printed circuit board (PCB) 13 is adhered to/is solidificated in adjustment can be: what the angle 22, two of advancing that) changes printed circuit board (PCB) 13 as shown in Figure 5) change the fusion scolding tin that flows towards the rear side of printed circuit board (PCB) 13 for direction of advance flows to angle 19.The angle 19 of flowing to of the advance angle 22 and the fusion scolding tin of printed circuit board (PCB) 13 is minimum (angle is 0 °) with the horizontal direction.Increase printed circuit board (PCB) advance angle 22 or reduce fusion scolding tin flow to angle 19, the strength that scolding tin is pulled to the rear of printed circuit board (PCB) 13 will increase, the soldering tin amount that adheres to/be solidificated on the whole printed circuit board (PCB) 13 will reduce.On the contrary, reduce the words that flow to angle 19 of the advance angle 22 or the increase fusion scolding tin of printed circuit board (PCB) 13, the strength that scolding tin is pulled to the rear of printed circuit board (PCB) 13 will reduce, and the soldering tin amount that adheres to/be solidificated on the whole printed circuit board (PCB) 13 will increase.
In recent years, the use of Pb-free solder is commonplace, has lead welding tin to compare with existing, and the characteristic of Pb-free solder makes it that failure welding phenomenon (Ru Xiqiao) take place easily.In order to suppress the generation of failure welding phenomenon, the way of generally taking is to put and adjust soaking the fluid welding tipping, increases the angle 22 of advancing of the printed circuit board (PCB) 13 shown in Fig. 5, and that perhaps reduces fusion scolding tin flows to angle 19.But so, the easy problem on the low side of soldering tin amount on the lead elements and production method thereof can take place again.
Summary of the invention
The present invention is intended to address the above problem, and its purpose is: when soaking fluid welding and connect, only at those owing to reasons such as weight is heavier need increase the place, weld zone of the specific lead elements and production method thereof of bond strength especially, make to adhere to/soldering tin amount that solidifies thereon increases.
The manufacturing method for electronic controller that solves the above-mentioned problems in the prior art among the present invention is as follows: the position that will install chip component on to printed circuit board (PCB) is coated with and applies the operation that is used for carrying out temporary fixed jointing material, near the rear side of printed circuit board (PCB) for direction of advance, also be coated with to apply and be used to carry out temporary fixed jointing material, thereby reach the purpose that allows soldering tin amount attached thereto increase.
Adopt after the said method, in soaking the fluid welding termination process, being coated near being used to the originally lead elements and production method thereof weld zone carries out temporary fixed jointing material and will become barrier one, plays the effect that angle increases that flows to of the partial melting scolding tin that flows towards the rear side of printed circuit board (PCB) for direction of advance of allowing.
The technique effect that manufacturing method for electronic controller among the present invention produces is as follows.Being coated near being used to the originally lead elements and production method thereof weld zone carries out temporary fixed jointing material and will become barrier one, making towards the angle that flows to of the mobile partial melting scolding tin of the rear side of printed circuit board (PCB) for direction of advance increases, thereby increases the soldering tin amount in the weld zone that adheres to/be solidificated in lead elements and production method thereof.
The specific embodiment of the present invention is summarized as follows.Manufacturing method for electronic controller in the 1st scheme of the present invention is, soaking fluid welding in use connects mode and chip component and lead elements and production method thereof is welded to together in the electronic-controlled installation on the printed circuit board (PCB), at first in printed circuit board (PCB), will install to be coated with on the position of chip component and apply when being used to carry out temporary fixed jointing material, near the rear side of described lead elements and production method thereof weld zone for direction of advance, also be coated with to apply and be used to carry out temporary fixed jointing material, to increase soldering tin amount attached thereto; Then, described printed circuit board (PCB) being soaked fluid welding connects.Like this, owing to have only the soldering tin amount on the specific lead elements and production method thereof to obtain increase, so, in the electronic-controlled installation that little distance members and lead elements and production method thereof load in mixture, can reduce the soldering tin amount of little distance members, the situation that suppresses failure welding takes place; Can increase the soldering tin amount that adheres to/be solidificated in the lead elements and production method thereof weld zone again, reach the purpose that guarantees weld strength.
The 2nd scheme is, what being used to described in the 1st scheme increased that the jointing material that adheres to soldering tin amount uses is to be used to make chip component to carry out temporary fixed jointing material.Like this, in temporary fixed operation, apply the jointing material that is used to increase the soldering tin amount that adheres to, can reduce work hours, and it is shared that material is realized by near the rear side of lead elements and production method thereof weld zone for direction of advance, being coated with.
The 3rd scheme of the present invention is, being used to described in the 1st scheme increases near the rear side of lead elements and production method thereof weld zone for direction of advance that the jointing material that adheres to soldering tin amount only is coated in regulation.Like this, can only just increase soldering tin amount in heavier lead elements and production method thereof place relatively in weight, only the jointing material with minimum limit just can reach the purpose that strengthens welding.
Description of drawings
Fig. 1 is the end view of the electronic-controlled installation in one embodiment of the present of invention,
The upward view of Fig. 2 for seeing from solder side one side of this electronic-controlled installation,
End view when Fig. 3 connects for this electronic-controlled installation soaks fluid welding,
Fig. 4 is the end view of existing electronic-controlled installation,
End view when Fig. 5 connects for existing electronic-controlled installation soaks fluid welding,
In above-mentioned accompanying drawing, 11 is large-scale lead elements and production method thereof, and 12 is the weld zone, 13 is printed circuit board (PCB), 14 is chip component, and 15 for being used for temporary fixed jointing material, and 16 for being used to increase the jointing material of soldering tin amount, 17 is lead elements and production method thereof, 18,19 the angles that flow to for fusion scolding tin, 20 is solder bath, 21 for being in the scolding tin of molten condition, and 22 are the angle of advancing of printed circuit board (PCB).
Embodiment
Fig. 1～3 show the manufacturing method for electronic controller in one embodiment of the present of invention.Wherein, Fig. 1 is the end view of electronic-controlled installation, and Fig. 2 is near the schematic diagram the weld zone 12 of large-scale lead elements and production method thereof 11 that see from solder side, Fig. 1, and Fig. 3 is for soaking the end view of the electronic-controlled installation of stream.
At first, as shown in fig. 1, be coated with earlier to apply on the position of main part that will installation sheet linear element 14 in printed circuit board (PCB) 13 and be used to carry out temporary fixed jointing material 15; Simultaneously, near the rear side of the weld zone 12 of large-scale lead elements and production method thereof 11 for direction of advance, be coated with and apply the temporary fixed jointing material 16 of using that is used to increase soldering tin amount.The above-mentioned jointing material 16 that is used to increase scolding tin preferably is positioned at printed circuit board (PCB) 13 rear side for direction of advance when soaking fluid welding and connect, with the distance of the rear end of weld zone 12 be 1～3mm, and with the perpendicular direction of the direction of advance of printed circuit board (PCB) 13 on the width of the width of (see figure 2) and weld zone 12 basic identical.When soaking fluid welding and connect, printed circuit board (PCB) 13 advances to the left from the right side of Fig. 1.
Next, use the chip inserting apparatus to install chip component 14, then printed circuit board (PCB) is delivered to heating furnace, printed circuit board (PCB) 13 is heated to about 150 ℃.Like this, being used to carry out temporary fixed jointing material 15 will solidify, and the main part of chip component 14 is clinged on printed circuit board (PCB) 13.Meanwhile, the jointing material 16 that is used to increase soldering tin amount also on printed circuit board (PCB) 13, solidify, fastening.Then, by lead elements and production method thereof machinery is installed and is installed lead elements and production method thereof 17, the large-scale lead elements and production method thereof that the lead elements and production method thereof fitting machine is not installed is then by the manual plug-in mounting that carries out.
At last, use and to soak fluid welding and connect method the chip component on the printed circuit board (PCB) 13 14, lead elements and production method thereof 17 and large-scale lead elements and production method thereof 11 are welded together.
Below operational circumstances in the manufacturing method for electronic controller with above step and effect are elaborated.
As shown in Figure 3, when soaking fluid welding and connecing, the rear side of jointing material 16 in the weld zone 12 of large-scale lead elements and production method thereof 11 that is used to increase scolding tin forms a barrier, and what make the fusion scolding tin that flows to the rear side of printed circuit board (PCB) 13 for direction of advance flows to angle 18 greater than original fusion scolding tin angle of current degree 19.The soldering tin amount at 12 places, weld zone that are coated with the jointing material 16 that is used to increase scolding tin is increased.
In addition, because adhering to/be solidificated in other locational soldering tin amounts that are not coated with the jointing material 16 that is applied to increase scolding tin is determined by original fusion scolding tin angle of current degree 19, therefore, can also reduce the soldering tin amount on the little distance members simultaneously, suppress the generation of situations such as failure welding.
In sum, manufacturing method for electronic controller among the present invention can increase the soldering tin amount on some parts that is installed on the printed circuit board (PCB) selectively, is provided with by in the electronic equipment that soaks the full length film linear element that stream mode welds so can also be applicable to printed circuit board (PCB).
Claims (3)
1. manufacturing method for electronic controller is characterized in that: soaks fluid welding in use and connects mode and chip component and lead elements and production method thereof are welded in the electronic-controlled installation on the printed circuit board (PCB) with mixing,
At first, near the rear side of described lead elements and production method thereof weld zone for the direction of advance of printed circuit board (PCB), be coated with and apply the jointing material that is used to increase the adhesion soldering tin amount,
Then, described printed circuit board (PCB) being soaked fluid welding connects.
2. manufacturing method for electronic controller as claimed in claim 1 is characterized in that: what the described jointing material that is used to make the soldering tin amount that adheres to or solidify to increase used is to be used to make chip component to carry out temporary fixed jointing material.
3. manufacturing method for electronic controller as claimed in claim 1 is characterized in that: describedly be used to increase near the rear side of lead elements and production method thereof weld zone for the direction of advance of printed circuit board (PCB) that the jointing material that adheres to soldering tin amount only is coated in regulation.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004372822A JP2006179755A (en) | 2004-12-24 | 2004-12-24 | Manufacturing method for electronic controller |
| JP2004372822 | 2004-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1832665A CN1832665A (en) | 2006-09-13 |
| CN100521877C true CN100521877C (en) | 2009-07-29 |
Family
ID=36733554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101350569A Expired - Fee Related CN100521877C (en) | 2004-12-24 | 2005-12-23 | Manufacturing method for electronic controller |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006179755A (en) |
| CN (1) | CN100521877C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016082074A (en) * | 2014-10-17 | 2016-05-16 | ダイキン工業株式会社 | Electrical device and method of manufacturing the same |
-
2004
- 2004-12-24 JP JP2004372822A patent/JP2006179755A/en active Pending
-
2005
- 2005-12-23 CN CNB2005101350569A patent/CN100521877C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1832665A (en) | 2006-09-13 |
| JP2006179755A (en) | 2006-07-06 |
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Granted publication date: 20090729 Termination date: 20121223 |