JP2016082074A - Electrical device and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrical device capable of reducing the mounting area, while simplifying the manufacturing process, and to provide a method of manufacturing the same.SOLUTION: An electrical device 10 includes a substrate 20 having a circuit pattern 18 on one surface 12, the other surface 14 and an inner layer surface 16, insertion mounting components 22a, 22b, 22c mounted on one surface 12 of the substrate 20, and a surface mounting component 24 mounted on the other surface 14 of the substrate 20. The places to be soldered are provided only on the other surface 14 of the substrate 20. The number of times of soldering is only one, that is smaller than conventional.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electrical device in which various components are mounted on a substrate, and a method for manufacturing the same.

  Conventionally, an inverter device is used to control a compressor built-in motor of an air conditioner. As shown in FIG. 7, the electrical device 100 including the inverter device has various components mounted on a substrate 102. The types of components are classified into surface mounted components 24 and 34 and insertion mounted components 22a, 22b and 22c depending on the mounting form. The surface mount components 24 and 34 are divided into a chip component 34 and other surface mount components 24. The insertion mounting components 22a, 22b, and 22c are divided into a radial component 22a, an axial component 22b, and other insertion mounting components 22c.

  The electrical device 100 is manufactured as follows. (1) The substrate 102 is prepared as shown in FIG. The substrate 102 has a circuit pattern 18 on one surface 12 and the other surface 14 of the resin substrate 26. A through hole 28 is opened at a place where the terminal 32 of the insertion mounting component 22a, 22b, 22c is inserted. The inner wall of the through hole 28 is plated 30.

  (2) As shown in FIG. 8B, the chip component 34 is mounted on the one surface 12 of the substrate 102 with a high-speed mounter and soldered by a reflow apparatus. In addition, another surface mount component 24 is mounted on the first surface 12 of the substrate 102 with a general-purpose mounter. The mounting order of the chip component 34 and other surface mount components 24 may be reversed.

  (3) As shown in FIG. 8C, the terminal 32 of the radial component 22a is inserted into the through hole 28 with a radial insertion machine. The terminal 32 of the axial component 22b is inserted into the through hole 28 with an axial insertion machine. After the terminal 32 is inserted, the terminal 32 is bent so that the terminal 32 of each component 22a, 22b does not fall out of the through hole 28.

  (4) As shown in FIG. 8D, the chip component 34 is mounted on the other surface 14 of the substrate 102 with a high-speed mounter. Further, another surface mount component 24 is mounted on the other surface 14 of the substrate 102 with a general-purpose mounter. The parts 24 and 34 are fixed to the substrate 102 with an adhesive when mounting so that the parts 24 and 34 are not dropped.

  (5) As shown in FIG. 8E, the terminals 32 of the other insertion mounted parts 22c are manually inserted into the through holes 28. Thereafter, the terminal 32 is bent so that the terminal 32 does not fall out of the through hole 28.

  (6) The components 24, 34, and 22c mounted after the above (3) are soldered with a flow pad to complete the electrical device 100 shown in FIG.

  As described above, a large number of processes are required to manufacture the electrical device 100, which increases the manufacturing cost. If the number of manufacturing steps is reduced, manufacturing is simplified and yield can be improved. For example, soldering is performed in steps (2) and (6), and it can be considered that soldering is performed collectively. For that purpose, it is necessary to mount all the surface mounting components 24 and 34 on the other surface 14. However, the board area is increased, and it is impossible to reduce the size required for the general electrical device 100.

  FIG. 5 of Patent Document 1 discloses an inverter device for an air conditioner. Various components are mounted on the substrate. Therefore, as shown in FIG. 8, there are many manufacturing steps and there is a problem that the manufacturing cost increases.

JP 2014-44007 A (see FIG. 5)

  An object of the present invention is to provide an electrical device and a method for manufacturing the electrical device that can simplify the manufacturing process and reduce the mounting area as compared with the related art.

The electrical device of the present invention has a circuit pattern on one surface, the other surface, and the inner layer surface, the chip component is mounted on the inner layer surface, and terminals are inserted into through-holes penetrating the substrate, and mounted on the substrate. Insertion mounting components, and solder for connecting the insertion mounting components to the circuit pattern on the other surface,
Is provided. Only the insertion mounting component is mounted on one surface of the substrate.

At least a surface mounting component is mounted on the other surface of the substrate. Further, on the other surface of the substrate, only surface mount components may be mounted and connected to the circuit pattern with solder. Furthermore, an insertion mounting component may be mounted on the other surface of the substrate.

  The chip component is connected to a circuit pattern on one surface, the other surface, or the inner layer surface by soldering or plating.

  The method for manufacturing an electrical device according to the present invention includes a step of preparing a substrate having a circuit pattern on one surface, the other surface, and an inner layer surface, and chip components mounted on the inner layer surface, and a through hole penetrating the substrate. A step of inserting a terminal of the insertion mounting component from one side, a step of fixing the surface mounting component to the other side of the substrate with an adhesive, and a step of soldering the terminal of the insertion mounting component to the circuit on the other side Prepare.

  The method includes a step of fixing a surface mounting component to the other surface of the substrate with an adhesive, and the soldering step solders the terminals of the insertion mounting component and the terminals of the surface mounting component together to the circuit pattern on the other surface.

  Connecting the chip component to a circuit pattern on one surface, the other surface, or the inner layer surface by soldering or plating.

  In the present invention, since the soldering portion is only on the other surface of the substrate, the number of times of soldering can be reduced to one, which is smaller than the conventional one. Compared to the conventional method, the number of manufacturing steps is reduced, and the manufacturing cost can be reduced. Yield is also improved by reducing the number of manufacturing processes. Since the chip component is mounted in the substrate, the area of the substrate can be reduced, and the demand for downsizing of the electrical equipment can be met.

It is sectional drawing which shows the structure of the electrical equipment of this application. 2A and 2B are diagrams illustrating a method of manufacturing the electrical device of FIG. 1, in which FIG. 1A is a diagram in which a substrate having a chip component built therein is prepared, FIG. 2B is a diagram in which an insertion mounting component is inserted into a through hole; ) Is a diagram with a surface-mounted component mounted thereon, and (d) is a diagram in which the insertion-mounted component is manually inserted into the through hole. It is a figure which shows the manufacturing method of a board | substrate, (a) is the figure which mounted the chip components on the circuit pattern of one resin board, (b) is the figure which made the 3 resin board 1 sheet by heating. (C) is a view in which a through hole is opened and the inner wall thereof is plated, and (d) is a view in which circuit patterns are formed on one surface and the other surface of the substrate. It is a figure which shows the other manufacturing method of a board | substrate, (a) is the figure which mounted the chip components on the circuit pattern of one resin board, (b) is a sheet by heating three resin boards. (C) A through hole is opened and the inner wall thereof is plated, and (d) a circuit pattern is formed on one surface and the other surface of the substrate. It is a figure which shows the other manufacturing method of a board | substrate, (a) is the figure which mounted the chip component on the one resin board, (b) is the figure which made the 3 resin board 1 sheet by heating. (C) is a view in which a through hole is opened and the inner wall is plated, and (d) a circuit pattern is formed on one surface and the other surface of the substrate. It is a figure which shows the other manufacturing method of a board | substrate, (a) is the figure which mounted the chip component on the one resin board, (b) is the figure which made the 3 resin board 1 sheet by heating. (C) is a view in which a through hole is opened and the inner wall is plated, and (d) a circuit pattern is formed on one surface and the other surface of the substrate. It is sectional drawing which shows the structure of the conventional electrical equipment. FIG. 8 is a diagram illustrating a method of manufacturing the electrical device of FIG. 7, (a) is a diagram in which a substrate is prepared, (b) is a diagram in which surface-mounted components are mounted on one surface of the substrate, and (c) is a through hole. (D) is a diagram in which a surface mount component is mounted on the other surface of the substrate, and (e) is a diagram in which the insert mount component is manually inserted into the through hole.

  The electrical equipment of the present invention and the manufacturing method thereof will be described with reference to the drawings. Although the electrical equipment includes an inverter device used for an air conditioner, the present application is not limited thereto.

  An electrical device 10 shown in FIG. 1 includes a substrate 20 having a circuit pattern 18 on one surface 12, another surface 14 and an inner layer surface 16, insertion mounting components 22 a, 22 b and 22 c mounted on the one surface 12 of the substrate 20, and the substrate 20. A surface mount component 24 mounted on the other surface 14 is provided.

  The substrate 20 is a multilayer substrate in which a plurality of resin substrates 26 are stacked. A circuit pattern 18 is provided on one surface 12, the other surface 14, and the inner layer surface 16 of the substrate 20. Examples of the resin substrate 26 include glass cloth impregnated epoxy resin and prepreg. The thickness of the resin substrate 26 per layer is, for example, 0.8 to 2.0 mm, but is not limited to this range.

  The circuit pattern 18 is composed of a thin film conductor such as a copper foil. The circuit pattern 18 in FIG. 1 has four layers, which is the same as a multi-layer substrate having a general minimum number of layers. The number of circuit patterns 18 may be appropriately changed depending on the number of laminated resin substrates 26. Any one of the circuit patterns 18 may have a grounding function. The thickness of the circuit pattern 18 is, for example, 18 μm, 35 μm, or 70 μm, but is not limited to these thicknesses.

  A through-hole 28 that penetrates from one surface 12 to the other surface 14 is opened in the substrate 20. The inner wall of the through hole 28 is plated 30. The terminals 32 of the insertion mounting components 22a, 22b, and 22c are inserted into the through holes 28. The diameter of the through hole 28 is not less than the diameter of the terminal 32, for example, 0.6 to 2.0 mm, but is not limited to this range.

  A chip component 34 is mounted on the inner layer surface 16 of the substrate 20. The chip component 34 includes a chip resistor, a chip capacitor, and a chip inductor. The chip component 34 is soldered to the circuit pattern 18 on the inner layer surface 16. The size of the chip component 34 is not limited as long as it can be mounted on the inner layer surface 16 of the substrate 20.

  The insertion mounting components 22a, 22b, and 22c include passive components such as resistors, capacitors, and coils. The insertion mounting parts 22a, 22b, and 22c are parts having terminals 32, and include a radial part 22a, an axial part 22b, and other parts 22c. The radial part 22a is a part in which the terminal 32 is inserted into the through hole 28 by a radial insertion machine, and the axial part 22b is a part in which the terminal 32 is inserted into the through hole 28 by an axial insertion machine. The other parts 22c cannot be used with an insertion machine, are parts for inserting the terminals 32 into the through holes 28 by hand, and are large parts such as a troidal core.

  The insertion mounting components 22a, 22b, and 22c are mounted only on the one surface 12 of the substrate 20. All the tips of the terminals 32 of the insertion mounting components 22a, 22b, and 22c are on the other surface 14 and are soldered on the other surface 14.

  The surface mounting component 24 includes a semiconductor package such as an IC (Integrated Circuit) or an LED (Light Emitting Diode).

  The surface mounting component 24 is mounted by being soldered to the circuit pattern 18 on the other surface 14 of the substrate 20. On the other surface 14 of the substrate 20, the insertion mounting components 22 a, 22 b, 22 c and the surface mounting component 24 are electrically connected to the circuit pattern 18 with solder 38. There is no solder 38 on one surface 12 of the substrate 20.

  The surface mounting component 24 is fixed to the other surface 14 of the substrate 20 with an adhesive 36. The adhesive 36 can be an epoxy or acrylic adhesive. The reason for fixing with the adhesive 36 is to fix the surface mount component 24 from falling off the substrate 20 during the manufacturing process.

  Next, a method for manufacturing the electrical device 10 will be described. (1) The substrate 20 is prepared as shown in FIG. As described above, the substrate 20 includes the circuit pattern 18 on the one surface 12, the other surface 14, and the inner layer surface 16, and the chip component 34 is mounted on the inner layer surface 16. A through hole 28 penetrates from one surface 12 to the other surface 14 of the substrate 20, and an inner wall of the through hole 28 is plated 30.

  (2) As shown in FIG. 2B, the radial parts 22 a and the terminals 32 of the axial parts 22 b are inserted into the through holes 28 from the one surface 12 of the substrate 20. The terminal 32 of the radial part 22a is inserted with a radial insertion machine, and the terminal 32 of the axial part 22b is inserted with an axial insertion machine. The order of insertion is arbitrary. Moreover, you may insert the terminal 32 of both components 22a and 22b in the through-hole 28 with a compound insertion machine. The terminal 32 of the other insertion mounting component 22c is not inserted into the through hole 28 in this step.

  Each terminal 32 is bent after being inserted so that the terminal 32 does not fall out of the through hole 28. If the terminal 32 does not fall out, the bending angle is arbitrary.

  (3) As shown in FIG. 2C, the surface mount component 24 is mounted on the other surface 14 of the substrate 20 by a general-purpose mounter. The surface mount component 24 is fixed to the other surface 14 of the substrate 20 with an adhesive 36. The substrate 20 may be turned over when the surface mount component 24 is mounted.

  The insertion mounting components 22 a and 22 b and the surface mounting component 24 have the terminals 32 bent or fixed with an adhesive 36 so as not to be detached from the substrate 20. The steps (2) and (3) can be performed in any order.

  (4) As shown in FIG. 2D, the terminal 32 of another insertion mounting component 22c is manually inserted into the through hole 28. It is mounted on one surface 12 of the substrate 20 in the same manner as the insertion mounting components 22a and 22b. If the other insertion / mounting component 22c is large, it is likely to be detached from the substrate 20, so that it is mounted last. It should be noted that this step is omitted if all the insertion mounted components 22a, 22b, and 22c can insert the terminals 32 into the through holes 28 with an insertion machine.

  (5) The insertion mounting components 22a, 22b, 22c and the surface mounting component 24 are soldered. The soldering method is arbitrary such as a flow method, a reflow method, or a manual operation. Unlike the conventional method, the soldering process is performed once.

  After the soldering, the terminals 32 of the insertion mounting components 22a, 22b, and 22c are cut at the end side from the soldered position. Through the above steps, the electrical device 10 of FIG. 1 is completed.

  As described above, in the present invention, the soldering portion is provided only on the other surface 14 of the substrate 20. Therefore, the number of times of soldering can be reduced to one, which is smaller than the conventional one. Compared to the conventional method, the number of manufacturing steps is reduced, and the manufacturing cost can be reduced. Yield is also improved by reducing the number of manufacturing processes.

  Since the chip component 34 is mounted in the substrate 20, the areas of the one surface 12 and the other surface 14 of the substrate 20 can be reduced. The demand for downsizing of the electrical equipment 10 can be met.

  As mentioned above, although one embodiment was described about the present invention, the present invention is not limited to the above-mentioned embodiment. For example, although three types of insertion mounting components 22a, 22b, and 22c have been described, at least one type may be used.

  Jumper wires may be included in the insertion mounting components 22a, 22b, and 22c. Terminals at both ends of the jumper wire are inserted into the through hole 28 from one surface 12 of the substrate 20 and soldered on the other surface 14.

  The chip component 34 is also a kind of the surface mount component 24. It is also possible to include a chip component 34 in the surface mounting component 24 mounted on the other surface 14 of the substrate 20. In this case, the chip component 34 is mounted on the other surface 14 and the inner layer surface 16 of the substrate 20.

  The electrical device 10 may be configured such that the surface mounting components 24 are all chip components 34. In this case, the surface mounting component 24 on the other surface 14 can be eliminated, and the manufacturing process can be reduced.

  The insertion mounting components 22a and 22b and the surface mounting component 24 are automatically mounted using an insertion machine or mounter, but may be manually performed.

  Some of the through holes 28 may be ones into which the terminals 32 are not inserted. The plating 30 of the through hole 28 only connects the circuit pattern 18 on the one surface 12 and the other surface 14. There will be a through hole 28 into which the terminal 32 of the insertion mounting component 22a, 22b, 22c is inserted and a through hole 28 into which the terminal 32 is not inserted.

  In the above description, the insertion mounting components 22 a, 22 b, and 22 c are mounted only on the first surface 12, and the surface mounting component 24 is mounted only on the other surface 14. A part of the insertion mounting components 22a, 22b, and 22c may be mounted on the other surface 14. When the insertion mounting components 22a, 22b, and 22c must be mounted on the other surface 14 in terms of circuit design, the number of processes can be increased if soldering can be easily performed in a short time and manually compared to other processes. I do not think so.

  Although the substrate 20 including the chip component 34 is prepared in the above (1), the substrate 20 may be started from the point where the substrate 20 is manufactured. Although the manufacturing method of the board | substrate 20 is arbitrary, the following methods are mentioned, for example.

Substrate manufacturing method 1 (FIG. 3)
(A1) Two resin substrates 26 each having a copper foil laminated on both sides are prepared, and the circuit pattern 18 is formed by etching only on one side. The circuit patterns 18 of the two resin substrates 26 are arranged on the inner layer surface 16.

  (B1) As shown in FIG. 3A, the chip component 34 is mounted on the circuit pattern 18 of one resin substrate 26 by soldering.

  (C1) The resin substrate 26 not having the circuit pattern 18 is disposed between the two resin substrates 26 described above, and a single substrate 40 including the chip component 34 is formed as shown in FIG. 3B. . In order to make one substrate 40, all the resin substrates 26 are overlapped and heated and pressed. Separately, the resin substrate 26 may be integrated using an adhesive. At this time, the one surface 12 and the other surface 14 of the substrate 40 are covered with the copper foil 42, and the circuit pattern 18 is formed on the inner layer surface 16.

  (D1) As shown in FIG. 3C, the through hole 28 penetrating the substrate 40 is opened, and plating 30 is applied to the inner wall of the through hole 28.

  (E1) As shown in FIG. 3D, etching is performed so that the one surface 12 and the other surface 14 of the substrate 40 become a desired circuit pattern 18, and the substrate 20 is completed.

Substrate manufacturing method 2 (FIG. 4)
(A2) A resin substrate 26 having both surfaces covered with copper foil is prepared, and a circuit pattern 18 is formed by etching. The circuit pattern 18 is disposed on the inner layer surface 16.

  (B2) As shown in FIG. 4A, the chip part 34 is mounted on the circuit pattern 18 by soldering. The chip component 34 is mounted on the circuit pattern 18 on one surface 44, the other surface 46, or both surfaces 44, 46 of the resin substrate 26.

  (C2) As shown in FIG. 4B, the resin substrate 26 having one surface covered with the copper foil 42 is laminated on both surfaces 44 and 46 of the resin substrate 26 on which the chip component 34 is mounted, and is heated and pressed. A single substrate 40 containing 34 is formed. As the resin substrate 26, a prepreg or a glass cloth impregnated epoxy substrate can be used, and a separate adhesive layer may be provided.

  The subsequent steps shown in FIGS. 4C and 4D are the same as the above steps (d1) and (e1), and the substrate 20 is formed by completing the through holes 28 and the circuit pattern 18.

Substrate manufacturing method 3 (FIG. 5)
(A3) A resin substrate 26 whose both surfaces are covered with copper foil is prepared, and a circuit pattern 18 is formed by etching.

  (B3) The chip component 34 is mounted on the resin substrate 26 with an adhesive 48 as shown in FIG. The chip component 34 is mounted on one surface 44, the other surface 46, or both surfaces 44, 46 of the resin substrate 26.

  (C3) As shown in FIG. 5B, the resin substrate 26 having one surface covered with the copper foil 42 is laminated on both surfaces 44 and 46 of the resin substrate 26 on which the chip component 34 is mounted, and the chip component is heated and pressed. A single substrate 40 containing 34 is formed. In order to make a plurality of resin substrates into one sheet, a separate adhesive layer may be provided.

  (D3) A via hole is opened from one surface 12, the other surface 14, or both surfaces 12, 14 of the substrate 40 to the terminal of the chip component 34. The via hole is opened with a laser or drill. Also, a through hole 28 penetrating the substrate 40 is opened.

  (E3) As shown in FIG. 5C, the via hole 50 and the through hole 28 are plated 52 and 28 simultaneously. The chip component 34 is electrically connected to the copper foil 42 on the one surface 12 or the other surface 14. Since the terminals of the chip component 34 are plated, the terminals of the chip component 34 are made of copper. The through hole 28 is also electrically connected to the copper foil 42 on the one surface 12 or the other surface 14.

  (F3) As shown in FIG. 5D, etching is performed so that the one surface 12 and the other surface 14 of the substrate 26 become the desired circuit pattern 18, and the substrate 20 is completed. The chip component 34 is connected to the circuit pattern 18 on the one surface 12, the other surface 14, or both surfaces by plating 52.

Substrate manufacturing method 4 (FIG. 6)
(A4) Similarly to (a1) above, two resin substrates 26 are prepared, and the circuit pattern 18 is formed by etching only on one side.

  (B4) As shown in FIG. 6A, the chip component 34 is mounted with an adhesive 48 on the etched surface of one resin substrate 26.

  (C4) Similarly to the above (c1), the resin substrate 26 not having the circuit pattern 18 is disposed between the two resin substrates 26 described above, heated and pressed, and one substrate 40 having the chip component 34 incorporated therein. Form.

  Thereafter, as in the above (d3) to (f3), the via hole 50 and the through hole 28 are opened, plating 52 and 30 is performed as shown in FIG. 6C, and the circuit pattern 18 is formed as shown in FIG. Form.

  The method for manufacturing the substrate 20 has been described above, but is not limited to the described method. For example, if the number of stacked layers increases, the number of resin substrates 26 is increased accordingly. If the number of resin substrates 26 increases, the chip component 34 may be connected to the circuit pattern 18 on the different inner layer surface 16 by plating 52. On the inner layer surface 16, the layer on which the chip component 34 is mounted may be changed as appropriate.

  In addition, the present invention can be carried out in a mode in which various improvements, modifications, and changes are added based on the knowledge of those skilled in the art without departing from the spirit of the present invention.

10: Electrical equipment 12: One side 14: Other side 16: Inner layer side 18: Circuit pattern 20: Substrate 22a, 22b, 22c: Insert mounting component 24: Surface mounting component 26: Resin substrate 28: Through hole 30: Plating 32: Terminal 34: Chip part 36: Adhesive 38: Solder

Claims (8)

A circuit board having a circuit pattern on one surface, the other surface and the inner layer surface, and chip components mounted on the inner layer surface;
A terminal is inserted into a through hole penetrating the board, and an insertion mounting component mounted on the board,
Solder for connecting the insertion mounted component to a circuit pattern;
With
An electrical equipment in which only an insertion mounting component is mounted on one surface of the substrate. The electrical equipment according to claim 1, wherein at least a surface mounting component is mounted on the other surface of the substrate. The electrical equipment according to claim 1 or 2, wherein only the surface-mounted components are mounted on the other surface of the substrate and connected to the circuit pattern with solder. The electrical equipment according to claim 1, wherein an insertion mounting component is mounted on the other surface of the substrate. 5. The electrical device according to claim 1, wherein the chip component is connected to a circuit pattern on one surface, the other surface, or the inner layer surface by soldering or plating. Preparing a substrate having a circuit pattern on one surface, the other surface and the inner layer surface, and chip components mounted on the inner layer surface;
Inserting a terminal of an insertion mounting component from one surface of the substrate into a through hole penetrating the substrate;
In the other surface, the step of soldering the terminal of the insertion mounting component to the circuit pattern;
The manufacturing method of the electrical equipment provided with. Including a step of fixing a surface mounting component to the other surface of the substrate with an adhesive;
The method of manufacturing an electrical equipment according to claim 6, wherein the soldering step collectively solders the terminals of the insertion mounting component and the surface mounting component to the circuit pattern on the other surface. 8. The method of manufacturing an electrical device according to claim 6, further comprising a step of connecting the chip component to a circuit pattern on one surface, the other surface, or the inner layer surface by soldering or plating.

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