CN100514162C - 大尺寸基板 - Google Patents
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- 239000000758 substrate Substances 0.000 title claims abstract description 105
- 230000003068 static effect Effects 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000010453 quartz Substances 0.000 claims description 6
- 239000004800 polyvinyl chloride Substances 0.000 claims description 5
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 5
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 abstract description 13
- 239000002245 particle Substances 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract description 3
- 230000006872 improvement Effects 0.000 abstract description 2
- 230000007246 mechanism Effects 0.000 abstract description 2
- 230000003746 surface roughness Effects 0.000 description 11
- 238000005498 polishing Methods 0.000 description 8
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 239000000428 dust Substances 0.000 description 4
- 229910001651 emery Inorganic materials 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 241000662429 Fenerbahce Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010410 dusting Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
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Abstract
一种适用于曝光的大尺寸基板,其为具有500-2000mm对角线长度或直径、1-20mm厚度且有0.05-0.4μm粗糙度的周边表面的板形形状。清洗期间从基板释放的微粒数最小,导致清洗步骤中提高产量。能够手工操作基板,无需操作机构实现了基板质量的改善。
Description
技术领域
本发明涉及适用于用在液晶(LC)板制造中的曝光的大尺寸基板。
背景技术
一般,TFT液晶板利用有源矩阵地址设计,其中具有内置TFT器件的阵列侧基板和具有与其连接的颜色滤光片的基板之间密封液晶,并通过用于控制液晶取向的TFT控制电压。
为了制造阵列侧基板,通过经具有线路图案的公知为大尺寸光掩模的原板曝光在无碱玻璃的母玻璃片上重复地印制多层。通过公知为染料浸渗工艺的平版印刷工艺(lithographic process)类似地制造颜色滤色片侧基板。
为了制造阵列侧和颜色滤光片侧基板,大尺寸光掩模是必须的。为了实现精确曝光,常常使用具有低线性膨胀系数的合成石英玻璃基板作为大尺寸光掩模。
当通过斜切机把基板的周边表面斜切成任意形状时,从周边表面起尘(形成粉末)成为决定最终产品表面状态的一个因素,尤其是表面上存在或没有污染物。如果基板的周边表面粗糙,由简单的清洗不能去除沉积在周边表面上的污染物。不但一些污染物迁移和沉积在基板的主表面上,而且相应地基板主表面需要再次清洗或再次抛光以去除那些污染物,导致制造产量的降低。
为了解决上述和其它问题,在IC光掩模基板的情况中应用镜面磨光任意形状基板周边表面的方法(参见JP-A 56-46227)。另一方面,在用于LC的大尺寸基板情况中,它们为不同的尺寸,使得机器难于操作基板(因为如果机器部件与表面接触,在表面上将形成缺陷)。由此通过用手夹住周边表面手工地夹住基板是常见的实践做法。如在IC光掩模基板的情况中,如果对大尺寸基板的周边表面实施镜面磨光,与大尺寸基板的相当的重量结合,常常在操作手套和基板之间发生滑动,导致夹住基板的失败。
需要一种在清洗期间产生最少量灰尘并允许手工操作的大尺寸基板。
发明内容
本发明的一个目的是提供一种适用于曝光的大尺寸基板,其在清洗期间自它的周边表面产生最少量的灰尘并允许手工操作。
对于手工夹住在湿态中的其周边表面的大尺寸基板来说,已经发现如果基板的周边表面设置有防止基板从操作手套滑落的粗糙程度,这不但确保安全地手工夹住基板,而且抑制自周边表面产生灰尘。
本发明提供了一种光掩模基板,该基板具有板形形状且具有至少500mm对角线长度或直径、1到20mm厚度,并且具有0.05到0.4μm范围粗糙度Ra的周边表面。
优选存在水时基板的周边表面与由聚氯乙烯或聚乙烯制成的操作手套具有[基板重量(kg)]/2×(0.02到0.03),典型为0.1到0.2范围的静摩擦系数。最常见的是,基板由合成石英制成。
附图说明
图1是示出在不同夹持力静摩擦系数与周边表面粗糙度的曲线图。
图2是示出释放微粒数与周边表面粗糙度的曲线图。
具体实施方式
发明的大尺寸基板具有板形形状并具体体现为大尺寸合成石英玻璃基板,适合为光掩模基板和TFT液晶阵列侧基板。设定基板的尺寸具有至少500mm,优选500到2000mm的对角线长度或直径。基板的平面形状可以是正方形、矩形、圆形或相似形状。基板具有1到20mm,优选5到12mm的厚度。基板具有成对的主表面,且在它们之间具有周边或侧表面。尽管在周边表面手工夹持偏爱四边形板,尤其是矩形板,限定直线形侧表面,但周边表面可以是任意形状。
在按照发明用于曝光的大尺寸基板中,周边或侧表面具有0.05到0.4μm,优选0.05到0.3μm范围的平均表面粗糙度Ra。小于0.05μm的Ra的周边表面太滑,难于操作。大于0.4μm的Ra的周边表面能手工操作,但释放了能污染基板表面的更大量灰尘或微粒。
通过首先斜切(chamfering)原始大尺寸基板的周边制造上述用于曝光的大尺寸基板。一般通过金刚石打磨(diamond grinding),优选使用具有#600到#1500尺寸金刚石研磨剂,进行斜切。
斜切成任何所需形状之后,磨光(lap)基板,并接着处理或研磨(finish)周边表面以改善表面粗糙度。例如通过周边准镜面研磨工具(quasi-mirror finishing tool)刷所有的基板周边进行周边研磨。特别是,旋转尼龙刷,根据需要来回移动基板的周边。随后,对基板主表面进行最后的抛光。注意到典型地是在磨光步骤之后进行周边研磨,但也可以在任何其它步进行。
优选考虑到以下方面。在其周边准镜面研磨之后清洗基板的步骤中,操作湿态的基板时仅用人手在周边表面夹持它。在湿态的周边表面非常滑。操作者戴上公知为操作手套(handling gloves)的特别手套。在操作干态或湿态的基板时仅用戴手套的手夹住周边表面,根据周边表面的粗糙度,特别是当粗糙度大约为镜面研磨时,基板能从戴手套的手滑落。那么不可能操作控制。
如果确定基板周边表面粗糙度与用戴手套手操作的关系,可能通过周边准镜面研磨工具控制基板周边表面的粗糙度来产生适当的周边表面状态以便能进行手工处理操作。该周边表面状态也是足够防止基板周边起尘(dusting)的程度。
为了确定允许操作者用戴手套的手仅在周边表面夹住湿基板的周边表面粗糙程度,发明人研究了基板的重量与基板周边表面粗糙程度的关系,在该基板周边表面粗糙程度以下用戴手套的手不能在周边表面夹住湿基板,结果在图1的图解中绘出。确切地说,配备了具有给定重量和在其周边表面的给定粗糙度Ra的基板。在湿态(存在水)中,在成对的弹簧之间安装基板,手套介于基板周边表面和弹簧之间。横过弹簧的相对端施加特定的力以在它们之间夹持基板。向上提升处于这种状态的基板。通过弹簧型张力计测量当基板开始滑动时施加的提升力。计算提升力与夹持力的比值作为静摩擦系数。注意到在图1中的手工夹持力在4.5到5.0kg的范围。通过探针型表面粗糙度计测量表面粗糙度(Ra)。
从图1的描绘可以看出能进行处理操作的基板周边表面粗糙程度基本上被确定为单独取决于基板重量的固定值。表达这些关系以揭示在其周边表面基板的静摩擦系数等于[基板重量]/2×(0.02到0.03)。应理解一旦已知任意基板的重量,从图1的图解能估算出能手工操作控制的基板周边表面粗糙度的值。
只要基板周边的表面粗糙度等于或大于由此确定的值,无论基板是干的或湿的都能用戴手套的手操作基板。为了在其周边表面夹住处于湿态的基板,与操作手套类型相比静摩擦系数值更主要受基板周边表面粗糙度的影响。
只要把基板周边处理成被控制的表面粗糙度,能手工地操作任何基板,并能抑制从周边表面起尘。
至于清洗期间自基板周边表面产生微粒,与基板夹持器一起把520mm×800mm×10mm(厚)尺寸的基板浸在槽中,施加36kHz和200W的超声波10分钟,并通过微粒计数器计数释放的微粒数。图2中绘出了结果。在纵坐标绘出了释放的微粒数作为根据对0.6μm周边表面粗糙度为100的相对值。释放的微粒数随着周边表面粗糙度的增加而增加,随着表面变光滑而减少。通过把Ra设定到0.3μm或更低基本上抑制了微粒释放。注意到从微粒总数减去从基板夹持器释放的微粒数。
实例
为说明发明以下给出实例和比较例,但发明不限于此。
实例1
使用#1200金刚砂通过斜切机(chamfering machine)斜切具有9.2kg重量520mm×800mm×10.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。在处理周边表面之前进行磨光和初步的抛光。通过探针型粗糙度计测量周边表面粗糙度,发现Ra=0.05μm。
最后抛光基板的主表面并接着清洗。在清洗步骤中,用戴手套的手操作基板,确保可以手工操作。估算静摩擦系数为0.12。所用的手套由聚氯乙烯和聚乙烯构成。无论在干或湿态都能同等地操作基板。清洗的基板具有满意的清洁度,表现为释放很少的微粒。
实例2
使用#800金刚砂通过斜切机斜切具有9.9kg重量700mm×800mm×8.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。接着像实例1那样处理基板,在周边表面到达Ra=0.09μm的粗糙度。如在实例1中那样,为清洗操作基板,发现等同的结果。估算静摩擦系数为0.13。
实例3
使用#1200金刚砂通过斜切机斜切具有13.0kg重量800mm×920mm×10.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。接着像实例1那样处理基板,在周边表面到达Ra=0.16μm的粗糙度。如在实例1中那样,为清洗操作基板,发现等同的结果。估算静摩擦系数为0.16。
比较例
(在周边表面没有处理)
使用#800金刚砂通过斜切机斜切具有9.9kg重量700mm×800mm×8.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。进行磨光和初步的抛光,但省略随后的周边表面处理。通过探针型粗糙度计测量周边表面粗糙度,发现Ra=0.5μm。
最后抛光基板的主表面并接着清洗。在清洗步骤中,用戴手套的手操作基板,确保可以手工操作。估算静摩擦系数为0.24。所用的手套由聚氯乙烯构成。无论在干或湿态都能同等地操作基板。清洗的基板具有不满意的清洁度,表现为释放很多的微粒。
本发明用于曝光的大尺寸基板具有清洗期间从基板周边释放微粒数最小的优点,导致在清洗步骤中改善产量。能够手工地操作基板,实现无需操作机构基板质量的改善。
Claims (4)
1.一种光掩模基板,该基板具有板形形状且具有至少500mm对角线长度或直径、1到20mm厚度,并且具有0.05到0.4μm范围粗糙度Ra的周边表面。
2.如权利要求1的基板,其中存在水时基板的周边表面与由聚氯乙烯或聚乙烯制成的操作手套具有[基板重量(kg)]/2×(0.02到0.03)的静摩擦系数。
3.如权利要求1的基板,其中存在水时基板的周边表面与由聚氯乙烯或聚乙烯制成的操作手套具有0.1到0.2的静摩擦系数。
4.如权利要求1的基板,其由合成石英制成。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003199004A JP4206850B2 (ja) | 2003-07-18 | 2003-07-18 | 露光用大型合成石英ガラス基板の製造方法 |
JP199004/2003 | 2003-07-18 |
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CN1577029A CN1577029A (zh) | 2005-02-09 |
CN100514162C true CN100514162C (zh) | 2009-07-15 |
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CNB2004100712695A Expired - Lifetime CN100514162C (zh) | 2003-07-18 | 2004-07-16 | 大尺寸基板 |
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US (1) | US8012563B2 (zh) |
EP (1) | EP1498775B1 (zh) |
JP (1) | JP4206850B2 (zh) |
KR (1) | KR100853613B1 (zh) |
CN (1) | CN100514162C (zh) |
DE (1) | DE602004029223D1 (zh) |
TW (1) | TW200510260A (zh) |
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JP4362732B2 (ja) * | 2005-06-17 | 2009-11-11 | 信越化学工業株式会社 | フォトマスク用大型ガラス基板及びその製造方法、コンピュータ読み取り可能な記録媒体、並びにマザーガラスの露光方法 |
JP5484649B2 (ja) * | 2006-01-27 | 2014-05-07 | 古河電気工業株式会社 | 薄板ガラスの製造方法 |
JP5414079B2 (ja) * | 2006-05-15 | 2014-02-12 | Hoya株式会社 | Fpdデバイス製造用マスクブランク、フォトマスク、及びfpdデバイス製造用マスクブランクの設計方法 |
EP2075237B1 (en) * | 2006-10-10 | 2019-02-27 | Nippon Electric Glass Co., Ltd. | Reinforced glass substrate |
US7666508B2 (en) * | 2007-05-22 | 2010-02-23 | Corning Incorporated | Glass article having a laser melted surface |
US8062732B2 (en) * | 2007-05-22 | 2011-11-22 | Corning Incorporated | Glass article having improved edge |
US8722189B2 (en) * | 2007-12-18 | 2014-05-13 | Hoya Corporation | Cover glass for mobile terminals, manufacturing method of the same and mobile terminal device |
KR101168712B1 (ko) * | 2009-02-13 | 2012-09-13 | 호야 가부시키가이샤 | 마스크블랭크용 기판, 마스크블랭크 및 포토마스크 |
CN102341214B (zh) * | 2009-03-10 | 2015-01-28 | 日本电气硝子株式会社 | 玻璃基板及其制造方法 |
JP2014023196A (ja) * | 2012-07-13 | 2014-02-03 | Denso Corp | モータ制御装置 |
JP6727170B2 (ja) * | 2017-06-30 | 2020-07-22 | クアーズテック株式会社 | フォトマスク用基板 |
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- 2003-07-18 JP JP2003199004A patent/JP4206850B2/ja not_active Expired - Lifetime
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2004
- 2004-07-15 US US10/891,028 patent/US8012563B2/en not_active Expired - Lifetime
- 2004-07-16 KR KR1020040055461A patent/KR100853613B1/ko active IP Right Grant
- 2004-07-16 CN CNB2004100712695A patent/CN100514162C/zh not_active Expired - Lifetime
- 2004-07-16 TW TW093121379A patent/TW200510260A/zh not_active IP Right Cessation
- 2004-07-19 DE DE602004029223T patent/DE602004029223D1/de not_active Expired - Lifetime
- 2004-07-19 EP EP04254320A patent/EP1498775B1/en not_active Expired - Lifetime
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US5643365A (en) * | 1996-07-25 | 1997-07-01 | Ceram Optec Industries Inc | Method and device for plasma vapor chemical deposition of homogeneous films on large flat surfaces |
US5816897A (en) * | 1996-09-16 | 1998-10-06 | Corning Incorporated | Method and apparatus for edge finishing glass |
JP2000218481A (ja) * | 1999-01-27 | 2000-08-08 | Nippon Sheet Glass Co Ltd | ガラス板表面の筋状凹凸の除去方法および筋状凹凸を減じたガラス板 |
Also Published As
Publication number | Publication date |
---|---|
US20050013972A1 (en) | 2005-01-20 |
KR100853613B1 (ko) | 2008-08-22 |
CN1577029A (zh) | 2005-02-09 |
DE602004029223D1 (de) | 2010-11-04 |
EP1498775B1 (en) | 2010-09-22 |
KR20050009690A (ko) | 2005-01-25 |
TW200510260A (en) | 2005-03-16 |
JP4206850B2 (ja) | 2009-01-14 |
TWI353968B (zh) | 2011-12-11 |
EP1498775A3 (en) | 2006-10-04 |
JP2005037580A (ja) | 2005-02-10 |
EP1498775A2 (en) | 2005-01-19 |
US8012563B2 (en) | 2011-09-06 |
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