CN100514162C - 大尺寸基板 - Google Patents

大尺寸基板 Download PDF

Info

Publication number
CN100514162C
CN100514162C CNB2004100712695A CN200410071269A CN100514162C CN 100514162 C CN100514162 C CN 100514162C CN B2004100712695 A CNB2004100712695 A CN B2004100712695A CN 200410071269 A CN200410071269 A CN 200410071269A CN 100514162 C CN100514162 C CN 100514162C
Authority
CN
China
Prior art keywords
substrate
periphery surface
periphery
size
roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2004100712695A
Other languages
English (en)
Other versions
CN1577029A (zh
Inventor
草开大介
柴野由纪夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of CN1577029A publication Critical patent/CN1577029A/zh
Application granted granted Critical
Publication of CN100514162C publication Critical patent/CN100514162C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/02Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery
    • B24D13/10Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by their periphery comprising assemblies of brushes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60Substrates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24777Edge feature
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31Surface property or characteristic of web, sheet or block
    • Y10T428/315Surface modified glass [e.g., tempered, strengthened, etc.]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nonlinear Science (AREA)
  • Sustainable Development (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Surface Treatment Of Glass (AREA)
  • Cleaning In General (AREA)
  • Glass Melting And Manufacturing (AREA)

Abstract

一种适用于曝光的大尺寸基板,其为具有500-2000mm对角线长度或直径、1-20mm厚度且有0.05-0.4μm粗糙度的周边表面的板形形状。清洗期间从基板释放的微粒数最小,导致清洗步骤中提高产量。能够手工操作基板,无需操作机构实现了基板质量的改善。

Description

大尺寸基板
技术领域
本发明涉及适用于用在液晶(LC)板制造中的曝光的大尺寸基板。
背景技术
一般,TFT液晶板利用有源矩阵地址设计,其中具有内置TFT器件的阵列侧基板和具有与其连接的颜色滤光片的基板之间密封液晶,并通过用于控制液晶取向的TFT控制电压。
为了制造阵列侧基板,通过经具有线路图案的公知为大尺寸光掩模的原板曝光在无碱玻璃的母玻璃片上重复地印制多层。通过公知为染料浸渗工艺的平版印刷工艺(lithographic process)类似地制造颜色滤色片侧基板。
为了制造阵列侧和颜色滤光片侧基板,大尺寸光掩模是必须的。为了实现精确曝光,常常使用具有低线性膨胀系数的合成石英玻璃基板作为大尺寸光掩模。
当通过斜切机把基板的周边表面斜切成任意形状时,从周边表面起尘(形成粉末)成为决定最终产品表面状态的一个因素,尤其是表面上存在或没有污染物。如果基板的周边表面粗糙,由简单的清洗不能去除沉积在周边表面上的污染物。不但一些污染物迁移和沉积在基板的主表面上,而且相应地基板主表面需要再次清洗或再次抛光以去除那些污染物,导致制造产量的降低。
为了解决上述和其它问题,在IC光掩模基板的情况中应用镜面磨光任意形状基板周边表面的方法(参见JP-A 56-46227)。另一方面,在用于LC的大尺寸基板情况中,它们为不同的尺寸,使得机器难于操作基板(因为如果机器部件与表面接触,在表面上将形成缺陷)。由此通过用手夹住周边表面手工地夹住基板是常见的实践做法。如在IC光掩模基板的情况中,如果对大尺寸基板的周边表面实施镜面磨光,与大尺寸基板的相当的重量结合,常常在操作手套和基板之间发生滑动,导致夹住基板的失败。
需要一种在清洗期间产生最少量灰尘并允许手工操作的大尺寸基板。
发明内容
本发明的一个目的是提供一种适用于曝光的大尺寸基板,其在清洗期间自它的周边表面产生最少量的灰尘并允许手工操作。
对于手工夹住在湿态中的其周边表面的大尺寸基板来说,已经发现如果基板的周边表面设置有防止基板从操作手套滑落的粗糙程度,这不但确保安全地手工夹住基板,而且抑制自周边表面产生灰尘。
本发明提供了一种光掩模基板,该基板具有板形形状且具有至少500mm对角线长度或直径、1到20mm厚度,并且具有0.05到0.4μm范围粗糙度Ra的周边表面。
优选存在水时基板的周边表面与由聚氯乙烯或聚乙烯制成的操作手套具有[基板重量(kg)]/2×(0.02到0.03),典型为0.1到0.2范围的静摩擦系数。最常见的是,基板由合成石英制成。
附图说明
图1是示出在不同夹持力静摩擦系数与周边表面粗糙度的曲线图。
图2是示出释放微粒数与周边表面粗糙度的曲线图。
具体实施方式
发明的大尺寸基板具有板形形状并具体体现为大尺寸合成石英玻璃基板,适合为光掩模基板和TFT液晶阵列侧基板。设定基板的尺寸具有至少500mm,优选500到2000mm的对角线长度或直径。基板的平面形状可以是正方形、矩形、圆形或相似形状。基板具有1到20mm,优选5到12mm的厚度。基板具有成对的主表面,且在它们之间具有周边或侧表面。尽管在周边表面手工夹持偏爱四边形板,尤其是矩形板,限定直线形侧表面,但周边表面可以是任意形状。
在按照发明用于曝光的大尺寸基板中,周边或侧表面具有0.05到0.4μm,优选0.05到0.3μm范围的平均表面粗糙度Ra。小于0.05μm的Ra的周边表面太滑,难于操作。大于0.4μm的Ra的周边表面能手工操作,但释放了能污染基板表面的更大量灰尘或微粒。
通过首先斜切(chamfering)原始大尺寸基板的周边制造上述用于曝光的大尺寸基板。一般通过金刚石打磨(diamond grinding),优选使用具有#600到#1500尺寸金刚石研磨剂,进行斜切。
斜切成任何所需形状之后,磨光(lap)基板,并接着处理或研磨(finish)周边表面以改善表面粗糙度。例如通过周边准镜面研磨工具(quasi-mirror finishing tool)刷所有的基板周边进行周边研磨。特别是,旋转尼龙刷,根据需要来回移动基板的周边。随后,对基板主表面进行最后的抛光。注意到典型地是在磨光步骤之后进行周边研磨,但也可以在任何其它步进行。
优选考虑到以下方面。在其周边准镜面研磨之后清洗基板的步骤中,操作湿态的基板时仅用人手在周边表面夹持它。在湿态的周边表面非常滑。操作者戴上公知为操作手套(handling gloves)的特别手套。在操作干态或湿态的基板时仅用戴手套的手夹住周边表面,根据周边表面的粗糙度,特别是当粗糙度大约为镜面研磨时,基板能从戴手套的手滑落。那么不可能操作控制。
如果确定基板周边表面粗糙度与用戴手套手操作的关系,可能通过周边准镜面研磨工具控制基板周边表面的粗糙度来产生适当的周边表面状态以便能进行手工处理操作。该周边表面状态也是足够防止基板周边起尘(dusting)的程度。
为了确定允许操作者用戴手套的手仅在周边表面夹住湿基板的周边表面粗糙程度,发明人研究了基板的重量与基板周边表面粗糙程度的关系,在该基板周边表面粗糙程度以下用戴手套的手不能在周边表面夹住湿基板,结果在图1的图解中绘出。确切地说,配备了具有给定重量和在其周边表面的给定粗糙度Ra的基板。在湿态(存在水)中,在成对的弹簧之间安装基板,手套介于基板周边表面和弹簧之间。横过弹簧的相对端施加特定的力以在它们之间夹持基板。向上提升处于这种状态的基板。通过弹簧型张力计测量当基板开始滑动时施加的提升力。计算提升力与夹持力的比值作为静摩擦系数。注意到在图1中的手工夹持力在4.5到5.0kg的范围。通过探针型表面粗糙度计测量表面粗糙度(Ra)。
从图1的描绘可以看出能进行处理操作的基板周边表面粗糙程度基本上被确定为单独取决于基板重量的固定值。表达这些关系以揭示在其周边表面基板的静摩擦系数等于[基板重量]/2×(0.02到0.03)。应理解一旦已知任意基板的重量,从图1的图解能估算出能手工操作控制的基板周边表面粗糙度的值。
只要基板周边的表面粗糙度等于或大于由此确定的值,无论基板是干的或湿的都能用戴手套的手操作基板。为了在其周边表面夹住处于湿态的基板,与操作手套类型相比静摩擦系数值更主要受基板周边表面粗糙度的影响。
只要把基板周边处理成被控制的表面粗糙度,能手工地操作任何基板,并能抑制从周边表面起尘。
至于清洗期间自基板周边表面产生微粒,与基板夹持器一起把520mm×800mm×10mm(厚)尺寸的基板浸在槽中,施加36kHz和200W的超声波10分钟,并通过微粒计数器计数释放的微粒数。图2中绘出了结果。在纵坐标绘出了释放的微粒数作为根据对0.6μm周边表面粗糙度为100的相对值。释放的微粒数随着周边表面粗糙度的增加而增加,随着表面变光滑而减少。通过把Ra设定到0.3μm或更低基本上抑制了微粒释放。注意到从微粒总数减去从基板夹持器释放的微粒数。
实例
为说明发明以下给出实例和比较例,但发明不限于此。
实例1
使用#1200金刚砂通过斜切机(chamfering machine)斜切具有9.2kg重量520mm×800mm×10.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。在处理周边表面之前进行磨光和初步的抛光。通过探针型粗糙度计测量周边表面粗糙度,发现Ra=0.05μm。
最后抛光基板的主表面并接着清洗。在清洗步骤中,用戴手套的手操作基板,确保可以手工操作。估算静摩擦系数为0.12。所用的手套由聚氯乙烯和聚乙烯构成。无论在干或湿态都能同等地操作基板。清洗的基板具有满意的清洁度,表现为释放很少的微粒。
实例2
使用#800金刚砂通过斜切机斜切具有9.9kg重量700mm×800mm×8.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。接着像实例1那样处理基板,在周边表面到达Ra=0.09μm的粗糙度。如在实例1中那样,为清洗操作基板,发现等同的结果。估算静摩擦系数为0.13。
实例3
使用#1200金刚砂通过斜切机斜切具有13.0kg重量800mm×920mm×10.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。接着像实例1那样处理基板,在周边表面到达Ra=0.16μm的粗糙度。如在实例1中那样,为清洗操作基板,发现等同的结果。估算静摩擦系数为0.16。
比较例
(在周边表面没有处理)
使用#800金刚砂通过斜切机斜切具有9.9kg重量700mm×800mm×8.0mm(厚)尺寸的矩形合成石英基板,配备原始基板。进行磨光和初步的抛光,但省略随后的周边表面处理。通过探针型粗糙度计测量周边表面粗糙度,发现Ra=0.5μm。
最后抛光基板的主表面并接着清洗。在清洗步骤中,用戴手套的手操作基板,确保可以手工操作。估算静摩擦系数为0.24。所用的手套由聚氯乙烯构成。无论在干或湿态都能同等地操作基板。清洗的基板具有不满意的清洁度,表现为释放很多的微粒。
本发明用于曝光的大尺寸基板具有清洗期间从基板周边释放微粒数最小的优点,导致在清洗步骤中改善产量。能够手工地操作基板,实现无需操作机构基板质量的改善。

Claims (4)

1.一种光掩模基板,该基板具有板形形状且具有至少500mm对角线长度或直径、1到20mm厚度,并且具有0.05到0.4μm范围粗糙度Ra的周边表面。
2.如权利要求1的基板,其中存在水时基板的周边表面与由聚氯乙烯或聚乙烯制成的操作手套具有[基板重量(kg)]/2×(0.02到0.03)的静摩擦系数。
3.如权利要求1的基板,其中存在水时基板的周边表面与由聚氯乙烯或聚乙烯制成的操作手套具有0.1到0.2的静摩擦系数。
4.如权利要求1的基板,其由合成石英制成。
CNB2004100712695A 2003-07-18 2004-07-16 大尺寸基板 Expired - Lifetime CN100514162C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003199004A JP4206850B2 (ja) 2003-07-18 2003-07-18 露光用大型合成石英ガラス基板の製造方法
JP199004/2003 2003-07-18

Publications (2)

Publication Number Publication Date
CN1577029A CN1577029A (zh) 2005-02-09
CN100514162C true CN100514162C (zh) 2009-07-15

Family

ID=33475522

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100712695A Expired - Lifetime CN100514162C (zh) 2003-07-18 2004-07-16 大尺寸基板

Country Status (7)

Country Link
US (1) US8012563B2 (zh)
EP (1) EP1498775B1 (zh)
JP (1) JP4206850B2 (zh)
KR (1) KR100853613B1 (zh)
CN (1) CN100514162C (zh)
DE (1) DE602004029223D1 (zh)
TW (1) TW200510260A (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4362732B2 (ja) * 2005-06-17 2009-11-11 信越化学工業株式会社 フォトマスク用大型ガラス基板及びその製造方法、コンピュータ読み取り可能な記録媒体、並びにマザーガラスの露光方法
JP5484649B2 (ja) * 2006-01-27 2014-05-07 古河電気工業株式会社 薄板ガラスの製造方法
JP5414079B2 (ja) * 2006-05-15 2014-02-12 Hoya株式会社 Fpdデバイス製造用マスクブランク、フォトマスク、及びfpdデバイス製造用マスクブランクの設計方法
EP2075237B1 (en) * 2006-10-10 2019-02-27 Nippon Electric Glass Co., Ltd. Reinforced glass substrate
US7666508B2 (en) * 2007-05-22 2010-02-23 Corning Incorporated Glass article having a laser melted surface
US8062732B2 (en) * 2007-05-22 2011-11-22 Corning Incorporated Glass article having improved edge
US8722189B2 (en) * 2007-12-18 2014-05-13 Hoya Corporation Cover glass for mobile terminals, manufacturing method of the same and mobile terminal device
KR101168712B1 (ko) * 2009-02-13 2012-09-13 호야 가부시키가이샤 마스크블랭크용 기판, 마스크블랭크 및 포토마스크
CN102341214B (zh) * 2009-03-10 2015-01-28 日本电气硝子株式会社 玻璃基板及其制造方法
JP2014023196A (ja) * 2012-07-13 2014-02-03 Denso Corp モータ制御装置
JP6727170B2 (ja) * 2017-06-30 2020-07-22 クアーズテック株式会社 フォトマスク用基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643365A (en) * 1996-07-25 1997-07-01 Ceram Optec Industries Inc Method and device for plasma vapor chemical deposition of homogeneous films on large flat surfaces
US5816897A (en) * 1996-09-16 1998-10-06 Corning Incorporated Method and apparatus for edge finishing glass
JP2000218481A (ja) * 1999-01-27 2000-08-08 Nippon Sheet Glass Co Ltd ガラス板表面の筋状凹凸の除去方法および筋状凹凸を減じたガラス板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5646227A (en) 1979-09-21 1981-04-27 Shin Etsu Chem Co Ltd Mask substrate for electronic device
JPH02204345A (ja) 1989-01-31 1990-08-14 Hoya Corp ガラス基板
ES2120467T3 (es) * 1992-11-19 1998-11-01 Shinetsu Quartz Prod Procedimiento para fabricar un tubo de vidrio de cuarzo de gran tamaño, una preforma y una fibra optica.
US5773126A (en) * 1994-12-22 1998-06-30 Dai Nippon Printing Co., Ltd. Composite film having a surface slip property
US5961197A (en) * 1995-12-14 1999-10-05 Enplas Corporation Surface light source device
JP2000267253A (ja) 1999-03-12 2000-09-29 Seiko Epson Corp 露光マスクの形成方法および液晶装置の製造方法
US6506289B2 (en) * 2000-08-07 2003-01-14 Symmorphix, Inc. Planar optical devices and methods for their manufacture
JP3516233B2 (ja) * 2000-11-06 2004-04-05 日本板硝子株式会社 情報記録媒体用ガラス基板の製造方法
JP4561950B2 (ja) * 2001-08-08 2010-10-13 信越化学工業株式会社 角形基板
JP2003089550A (ja) * 2001-09-13 2003-03-28 Fujikura Ltd ガラス材の研磨方法およびそれを用いたファイバ母材の製造方法
JP2003173015A (ja) 2001-09-28 2003-06-20 Hoya Corp グレートーンマスクの製造方法
TWI250133B (en) * 2002-01-31 2006-03-01 Shinetsu Chemical Co Large-sized substrate and method of producing the same
JP3934115B2 (ja) 2003-03-26 2007-06-20 Hoya株式会社 フォトマスク用基板、フォトマスクブランク、及びフォトマスク
US7323276B2 (en) * 2003-03-26 2008-01-29 Hoya Corporation Substrate for photomask, photomask blank and photomask
US6910953B2 (en) * 2003-07-24 2005-06-28 Corning Incorporated Methods and apparatus for edge finishing glass sheets

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643365A (en) * 1996-07-25 1997-07-01 Ceram Optec Industries Inc Method and device for plasma vapor chemical deposition of homogeneous films on large flat surfaces
US5816897A (en) * 1996-09-16 1998-10-06 Corning Incorporated Method and apparatus for edge finishing glass
JP2000218481A (ja) * 1999-01-27 2000-08-08 Nippon Sheet Glass Co Ltd ガラス板表面の筋状凹凸の除去方法および筋状凹凸を減じたガラス板

Also Published As

Publication number Publication date
US20050013972A1 (en) 2005-01-20
KR100853613B1 (ko) 2008-08-22
CN1577029A (zh) 2005-02-09
DE602004029223D1 (de) 2010-11-04
EP1498775B1 (en) 2010-09-22
KR20050009690A (ko) 2005-01-25
TW200510260A (en) 2005-03-16
JP4206850B2 (ja) 2009-01-14
TWI353968B (zh) 2011-12-11
EP1498775A3 (en) 2006-10-04
JP2005037580A (ja) 2005-02-10
EP1498775A2 (en) 2005-01-19
US8012563B2 (en) 2011-09-06

Similar Documents

Publication Publication Date Title
CN100514162C (zh) 大尺寸基板
TW308561B (zh)
US6099389A (en) Fabrication of an optical component
CN1330797A (zh) 处理半导体晶片内置后表面损伤的方法
KR102046662B1 (ko) 각형 금형용 기판
JP2004096112A (ja) 半導体ウェーハの処理法
KR20120074328A (ko) 반사형 마스크용 저팽창 유리 기판과 반사형 마스크
JP2002124490A (ja) 半導体ウェーハの製造方法
EP1145296B1 (en) Semiconductor wafer manufacturing method
TWI280454B (en) Substrate for photomask, photomask blank and photomask
WO2019043895A1 (ja) シリコンウェーハの両面研磨方法
JP3934115B2 (ja) フォトマスク用基板、フォトマスクブランク、及びフォトマスク
JPS57170538A (en) Polishing method for one side of semiconductor wafer
JPH08197400A (ja) 半導体ウェーハの面取り部研磨方法
JP3618220B2 (ja) 薄板の研磨方法および薄板保持プレート
JP2002025950A (ja) 半導体ウェーハの製造方法
JP2000233354A (ja) ウェーハノッチ部ポリッシング加工装置
JP2008280245A (ja) 露光用大型合成石英ガラス基板
JPH0957584A (ja) ウェーハの加工方法
JPH10315107A (ja) 半導体基板の面取加工装置
JP2001205553A (ja) 石英ガラス基板の研磨剤及び研磨方法
JP2003238939A (ja) 研磨砥粒
JPH0957585A (ja) ウェーハ面取り部仕上げ加工方法および加工装置
JPH08112740A (ja) 窒化アルミニウムの研磨方法
CN115443206A (zh) 研磨系统

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20090715