CN100509951C - 热固性树脂组合物以及使用该组合物的多层印刷电路板 - Google Patents
热固性树脂组合物以及使用该组合物的多层印刷电路板 Download PDFInfo
- Publication number
- CN100509951C CN100509951C CNB2005100674965A CN200510067496A CN100509951C CN 100509951 C CN100509951 C CN 100509951C CN B2005100674965 A CNB2005100674965 A CN B2005100674965A CN 200510067496 A CN200510067496 A CN 200510067496A CN 100509951 C CN100509951 C CN 100509951C
- Authority
- CN
- China
- Prior art keywords
- resin composition
- thermosetting resin
- compound
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G17/00—Coffins; Funeral wrappings; Funeral urns
- A61G17/08—Urns
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G33/00—Religious or ritual equipment in dwelling or for general use
- A47G33/02—Altars; Religious shrines; Fonts for holy water; Crucifixes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G17/00—Coffins; Funeral wrappings; Funeral urns
- A61G17/007—Coffins; Funeral wrappings; Funeral urns characterised by the construction material used, e.g. biodegradable material; Use of several materials
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP129141/2004 | 2004-04-26 | ||
| JP2004129141A JP4620967B2 (ja) | 2004-04-26 | 2004-04-26 | 永久穴埋め用熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1690119A CN1690119A (zh) | 2005-11-02 |
| CN100509951C true CN100509951C (zh) | 2009-07-08 |
Family
ID=35345891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100674965A Expired - Lifetime CN100509951C (zh) | 2004-04-26 | 2005-04-26 | 热固性树脂组合物以及使用该组合物的多层印刷电路板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4620967B2 (enExample) |
| KR (1) | KR101212389B1 (enExample) |
| CN (1) | CN100509951C (enExample) |
| TW (1) | TW200604246A (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568574B (zh) | 2006-11-29 | 2011-11-02 | 东洋纺织株式会社 | 含有氧杂环丁烷的树脂、使用该树脂的粘接剂以及抗蚀剂 |
| JP5221893B2 (ja) * | 2007-05-07 | 2013-06-26 | 協立化学産業株式会社 | 積層フィルムの製造方法 |
| JP5344394B2 (ja) * | 2008-07-10 | 2013-11-20 | 山栄化学株式会社 | 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板 |
| JP2010180355A (ja) | 2009-02-06 | 2010-08-19 | Taiyo Ink Mfg Ltd | 熱硬化性樹脂組成物、ドライフィルムおよびプリント配線板とその製造方法 |
| JP5889568B2 (ja) | 2011-08-11 | 2016-03-22 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | 酸化タングステン膜形成用組成物およびそれを用いた酸化タングステン膜の製造法 |
| JP5876758B2 (ja) * | 2012-03-23 | 2016-03-02 | 東京応化工業株式会社 | インク組成物およびパターン形成方法 |
| US9315636B2 (en) | 2012-12-07 | 2016-04-19 | Az Electronic Materials (Luxembourg) S.A.R.L. | Stable metal compounds, their compositions and methods |
| US9201305B2 (en) | 2013-06-28 | 2015-12-01 | Az Electronic Materials (Luxembourg) S.A.R.L. | Spin-on compositions of soluble metal oxide carboxylates and methods of their use |
| US9296922B2 (en) | 2013-08-30 | 2016-03-29 | Az Electronic Materials (Luxembourg) S.A.R.L. | Stable metal compounds as hardmasks and filling materials, their compositions and methods of use |
| US9409793B2 (en) * | 2014-01-14 | 2016-08-09 | Az Electronic Materials (Luxembourg) S.A.R.L. | Spin coatable metallic hard mask compositions and processes thereof |
| US9418836B2 (en) | 2014-01-14 | 2016-08-16 | Az Electronic Materials (Luxembourg) S.A.R.L. | Polyoxometalate and heteropolyoxometalate compositions and methods for their use |
| JP6374434B2 (ja) * | 2016-04-21 | 2018-08-15 | 山栄化学株式会社 | 熱硬化性樹脂組成物及び電子部品搭載基板 |
| TWI755564B (zh) | 2017-09-06 | 2022-02-21 | 德商馬克專利公司 | 含有旋轉塗佈無機氧化物的組合物、製造電子裝置之方法以及在矽基板上塗佈硬遮罩組合物之方法 |
| CN107960035A (zh) * | 2017-11-13 | 2018-04-24 | 广东欧珀移动通信有限公司 | 壳体制作方法、壳体及移动终端 |
| CN112126274A (zh) * | 2020-09-16 | 2020-12-25 | 四川乐凯新材料有限公司 | 含链烯基醚和/或氧杂环丁烷类化合物的pcb用光固化性组合物 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4177013B2 (ja) * | 2002-04-03 | 2008-11-05 | ダイセル化学工業株式会社 | 熱硬化型エポキシ樹脂組成物の硬化方法、硬化物及びその用途 |
| JP4204814B2 (ja) * | 2002-06-28 | 2009-01-07 | ヘンケル コーポレイション | 熱硬化性液状樹脂組成物 |
| JP2004285125A (ja) * | 2003-03-19 | 2004-10-14 | Daicel Chem Ind Ltd | エポキシ樹脂組成物及びその硬化物 |
| JP4492070B2 (ja) * | 2003-09-12 | 2010-06-30 | 住友化学株式会社 | 硬化性樹脂組成物及び該組成物からなる保護膜 |
-
2004
- 2004-04-26 JP JP2004129141A patent/JP4620967B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-02 TW TW094106326A patent/TW200604246A/zh not_active IP Right Cessation
- 2005-04-25 KR KR1020050033855A patent/KR101212389B1/ko not_active Expired - Lifetime
- 2005-04-26 CN CNB2005100674965A patent/CN100509951C/zh not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP4620967B2 (ja) | 2011-01-26 |
| TW200604246A (en) | 2006-02-01 |
| KR101212389B1 (ko) | 2012-12-13 |
| TWI367226B (enExample) | 2012-07-01 |
| CN1690119A (zh) | 2005-11-02 |
| JP2005307101A (ja) | 2005-11-04 |
| KR20060047455A (ko) | 2006-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: TAIYO HOLDING CO., LTD. Free format text: FORMER NAME: TAIYO INK MANUFACTURING CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan Patentee after: TAIYO HOLDINGS Co.,Ltd. Address before: Tokyo, Japan Patentee before: TAIYO INK MFG. Co.,Ltd. |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20051102 Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO HOLDINGS Co.,Ltd. Contract record no.: 2011990000116 Denomination of invention: Thermoset resin composition and multi-layer printed circuit board used thereof Granted publication date: 20090708 License type: Common License Record date: 20110302 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090708 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: TAIYO INK (SUZHOU) Co.,Ltd. Assignor: TAIYO HOLDINGS Co.,Ltd. Contract record no.: 2011990000116 Date of cancellation: 20250512 |