CN100499940C - 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 - Google Patents
基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 Download PDFInfo
- Publication number
- CN100499940C CN100499940C CNB2006100367143A CN200610036714A CN100499940C CN 100499940 C CN100499940 C CN 100499940C CN B2006100367143 A CNB2006100367143 A CN B2006100367143A CN 200610036714 A CN200610036714 A CN 200610036714A CN 100499940 C CN100499940 C CN 100499940C
- Authority
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- China
- Prior art keywords
- powder
- rare earth
- silver
- palladium
- electrode slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910052761 rare earth metal Inorganic materials 0.000 title claims abstract description 56
- 150000002910 rare earth metals Chemical class 0.000 title claims abstract description 56
- 239000011267 electrode slurry Substances 0.000 title claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 title claims abstract description 18
- 238000005516 engineering process Methods 0.000 title claims description 18
- 238000002360 preparation method Methods 0.000 title claims description 15
- 239000011521 glass Substances 0.000 claims abstract description 37
- 239000000843 powder Substances 0.000 claims abstract description 35
- 239000002002 slurry Substances 0.000 claims abstract description 27
- 239000003960 organic solvent Substances 0.000 claims abstract description 26
- 239000002131 composite material Substances 0.000 claims abstract description 21
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 20
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 11
- 238000005096 rolling process Methods 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract 3
- 239000000758 substrate Substances 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 19
- 239000007790 solid phase Substances 0.000 claims description 14
- UBQALOXXVZQHGR-UHFFFAOYSA-N palladium yttrium Chemical compound [Y].[Pd] UBQALOXXVZQHGR-UHFFFAOYSA-N 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 11
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 10
- 239000001856 Ethyl cellulose Substances 0.000 claims description 8
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 8
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 8
- 229920001249 ethyl cellulose Polymers 0.000 claims description 8
- 239000002893 slag Substances 0.000 claims description 7
- 238000003723 Smelting Methods 0.000 claims description 6
- 239000004359 castor oil Substances 0.000 claims description 6
- 235000019438 castor oil Nutrition 0.000 claims description 6
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 6
- 238000005984 hydrogenation reaction Methods 0.000 claims description 6
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 6
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 235000010445 lecithin Nutrition 0.000 claims description 5
- 239000000787 lecithin Substances 0.000 claims description 5
- 229940067606 lecithin Drugs 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 5
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 4
- 238000000498 ball milling Methods 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000020 Nitrocellulose Substances 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 229920001220 nitrocellulos Polymers 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000003595 mist Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- 239000000156 glass melt Substances 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 4
- 239000013081 microcrystal Substances 0.000 abstract description 4
- 229910052763 palladium Inorganic materials 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229910052709 silver Inorganic materials 0.000 abstract 3
- 239000004332 silver Substances 0.000 abstract 3
- 239000007787 solid Substances 0.000 abstract 1
- 239000011343 solid material Substances 0.000 abstract 1
- 238000005245 sintering Methods 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 238000005485 electric heating Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
- H01C17/06546—Oxides of zinc or cadmium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Glass Compositions (AREA)
- Conductive Materials (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100367143A CN100499940C (zh) | 2006-07-28 | 2006-07-28 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
| PCT/CN2007/002223 WO2008014677A1 (fr) | 2006-07-28 | 2007-07-23 | Boue d'électrode de terres rares destinée à un circuit à couche épaisse de terres rares basé sur un substrat métallique et procédé de production correspondant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100367143A CN100499940C (zh) | 2006-07-28 | 2006-07-28 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1909748A CN1909748A (zh) | 2007-02-07 |
| CN100499940C true CN100499940C (zh) | 2009-06-10 |
Family
ID=37700710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100367143A Active CN100499940C (zh) | 2006-07-28 | 2006-07-28 | 基于金属基板的稀土厚膜电路稀土电极浆料及其制备工艺 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100499940C (fr) |
| WO (1) | WO2008014677A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101923911A (zh) * | 2010-04-27 | 2010-12-22 | 电子科技大学 | 基于不锈钢基板的ybco厚膜电阻浆料及其制备方法 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101106842B (zh) * | 2007-07-24 | 2011-12-21 | 王晨 | 基于微晶玻璃基板的厚膜电路电热元件及其制备工艺 |
| CN101436441B (zh) * | 2008-12-09 | 2011-06-15 | 彩虹集团公司 | 一种厚膜纳米金电极浆料及其制备方法 |
| SG189537A1 (en) * | 2010-10-28 | 2013-06-28 | Heraeus Precious Metals North America Conshohocken Llc | Solar cell metallizations containing metal additive |
| CN102136308B (zh) * | 2010-11-23 | 2012-11-14 | 湖南威能新材料科技有限公司 | 银浆料用有机载体及其制备方法和含该有机载体的银浆料及含该银浆料制造的太阳能电池 |
| CN102290117B (zh) * | 2011-04-25 | 2013-03-06 | 深圳市唯特偶新材料股份有限公司 | 一种低温烧结纳米银浆及其制备方法 |
| CN102568704B (zh) * | 2012-03-16 | 2015-01-21 | 广东羚光新材料股份有限公司 | 一种环保型无铅半导体陶瓷电容电极银浆及其制备方法 |
| CN102646459A (zh) * | 2012-05-23 | 2012-08-22 | 湖南利德电子浆料有限公司 | 混合银粉晶体硅基太阳能电池正面银浆料及其制备方法 |
| CN102685942B (zh) * | 2012-05-29 | 2014-05-07 | 王克政 | 一种ptc稀土厚膜电路智能电热元件及其制备方法 |
| CN104318979A (zh) * | 2014-09-19 | 2015-01-28 | 王晨 | 复合材料基厚膜电路稀土介质浆料及其制备工艺 |
| CN106205773B (zh) * | 2016-07-06 | 2018-04-24 | 东莞珂洛赫慕电子材料科技有限公司 | 一种基于不锈钢基材的厚膜电路稀土电极浆料及其制备方法 |
| CN106409380A (zh) * | 2016-09-27 | 2017-02-15 | 东莞珂洛赫慕电子材料科技有限公司 | 一种铝合金基板厚膜电路中温烧结电阻浆料及其制备方法 |
| CN107068238A (zh) * | 2016-12-09 | 2017-08-18 | 东莞珂洛赫慕电子材料科技有限公司 | 一种铝合金基板用厚膜电路中温烧结全银电极浆料及其制备方法 |
| CN110690010A (zh) * | 2019-10-18 | 2020-01-14 | 泰阳电子(东莞)有限公司 | 一种微晶玻璃板用稀土高温碳浆的制备方法 |
| CN114009856A (zh) * | 2021-09-30 | 2022-02-08 | 江苏国瓷泓源光电科技有限公司 | 抽吸设备的改性电极浆料及制备工艺 |
| CN113724914B (zh) * | 2021-11-01 | 2022-02-25 | 西安宏星电子浆料科技股份有限公司 | 一种耐硫化油位传感器用银钯浆料 |
| CN114360762B (zh) * | 2022-03-14 | 2022-06-10 | 西安拓库米电子科技有限公司 | 一种片式电阻用抗银迁移银导体浆料及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0589718A (ja) * | 1991-01-16 | 1993-04-09 | Sumitomo Metal Mining Co Ltd | 導体ペースト |
| US5277844A (en) * | 1993-03-29 | 1994-01-11 | Rainey Clifford S | Resistor composition |
| JP3684430B2 (ja) * | 1994-12-28 | 2005-08-17 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 厚膜抵抗体組成物 |
| JP2002367804A (ja) * | 2001-06-11 | 2002-12-20 | K-Tech Devices Corp | 抵抗器 |
| KR100855169B1 (ko) * | 2001-09-06 | 2008-08-29 | 가부시키가이샤 노리타케 캄파니 리미티드 | 도체 조성물 및 그 제조방법 |
| CN1215484C (zh) * | 2002-12-30 | 2005-08-17 | 中国人民解放军国防科学技术大学 | 基于不锈钢基板的大功率厚膜电路用介质浆料及其制备工艺 |
| CN1216381C (zh) * | 2002-12-30 | 2005-08-24 | 中国人民解放军国防科学技术大学 | 基于不锈钢基板的大功率厚膜电路用导电浆料及其制备工艺 |
| CN1216380C (zh) * | 2002-12-30 | 2005-08-24 | 中国人民解放军国防科学技术大学 | 基于不锈钢基板的大功率厚膜电路用电阻浆料及其制备工艺 |
| CN100386829C (zh) * | 2004-07-28 | 2008-05-07 | 王克政 | Ptc厚膜电路可控电热元件 |
-
2006
- 2006-07-28 CN CNB2006100367143A patent/CN100499940C/zh active Active
-
2007
- 2007-07-23 WO PCT/CN2007/002223 patent/WO2008014677A1/fr active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101923911A (zh) * | 2010-04-27 | 2010-12-22 | 电子科技大学 | 基于不锈钢基板的ybco厚膜电阻浆料及其制备方法 |
| CN101923911B (zh) * | 2010-04-27 | 2011-11-02 | 电子科技大学 | 基于不锈钢基板的ybco厚膜电阻浆料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1909748A (zh) | 2007-02-07 |
| WO2008014677A1 (fr) | 2008-02-07 |
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