CN100492685C - Light emitting device and illumination instrument using the same - Google Patents

Light emitting device and illumination instrument using the same Download PDF

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Publication number
CN100492685C
CN100492685C CN 200480006869 CN200480006869A CN100492685C CN 100492685 C CN100492685 C CN 100492685C CN 200480006869 CN200480006869 CN 200480006869 CN 200480006869 A CN200480006869 A CN 200480006869A CN 100492685 C CN100492685 C CN 100492685C
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China
Prior art keywords
light
led
light emitting
portion
emitting device
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CN 200480006869
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Chinese (zh)
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CN1762061A (en
Inventor
今井康雄
前川武之
后藤令幸
明道成
村井卓生
田中章人
石井健一
福田秀树
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三菱电机株式会社;三菱电机照明株式会社
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Priority to JP2003407804 priority
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Publication of CN1762061A publication Critical patent/CN1762061A/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/80Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/62Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using mixing chambers, e.g. housings with reflective walls
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/04Optical design
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • F21V7/0008Reflectors for light sources providing for indirect lighting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

本发明的发光装置配备有:安装了发射短波长光的LED元件(12)的多个LED安装基板(4);具有在凹部设有借助LED元件(12)的短波长光发出变换光的波长变换部(3)的反射面(2a)的筐体(2);竖立设置在筐体(2)的凹部底面的中央部的热传导性的基板支撑板(5);反射面(2a)由沿着LED基板支撑板(5)的竖立设置部的两侧形成的抛物面构成;LED安装基板(4)以将LED元件(12)的发光面分别朝向反射面(2a)的方式安装到LED基板支撑板(5)的两个面上。 A light-emitting device of the present invention is provided with: an LED emits short-wavelength light element (12) a plurality of LED mounting board (4) is mounted; the converted light having a wavelength of the light emitted in the recessed portion is provided by means of LED elements (12) in a short wavelength conversion unit (3) of the reflecting surface (2a) of the housing (2); erected thermally conductive substrate support plate (5) the central portion of the bottom of the recess of the housing (2); a reflective surface (2a) made in the formed on both sides of the paraboloid LED substrate support plate (5) constituting the erected portion; mounting LED mounting board (4) to the light emitting surface of the LED element (12), respectively, toward the reflective surface (2a) manner to the LED substrate support two surface plates (5).

Description

发光装置及利用该发光装置的照明器具 Light emitting device and lighting equipment using the light emitting device

技术领域 FIELD

本发明涉及采用由发光二极管构成的光源的高效率的发光装置及利用该发光装里的照明器具, 背景技术 The present invention relates to a light-emitting device of a light source constituted by light emitting diodes and high efficiency in utilizing the light-emitting device of the luminaire, background

到目前为止,有很多与采用发光二极管(LED: Light Emitting Diode)的发光装置以及照明装置相关的发明.其中,例如,对于实现将从LED发出的光变换成第二种光、通过反射将其提取出来的高效率的照明装置的方法,提出了几种方案,其中,作为将短波长LED和荧光体组合起来实现发光装置的例子,如下面所述. So far, there are many light emitting diode with: a light emitting device and a lighting device related (LED Light Emitting Diode) of the invention wherein, for example, to achieve transformation from the light emitted by the LED into a second light, by reflecting it. the method of the lighting device efficiently extracted, several schemes proposed, wherein, as the short-wavelength LED and a phosphor combination examples of the light-emitting device, as described below.

传统的发光二极管,从发光二极管元件发射出来的插射束,其一部分通向与前述发光元件的发光面側的前述发光二极管元件对向的反射面,另外一部分直接透过光透射性构件通向出射面,在反射面处, 借助通过接受来自于前述发光二极管元件的輻射束发射可见光的荧光体,进行主要为500nm以上的可见光波段的发光.另外,在直接通向光透射性构件的表面的辐射束中,400nm以下的紫外波段的成分被干涉膜20反射,再次返回到透明的树脂材料内,照射到粘结层16的荧光体上,被变换成可见光,直接或者在反射面上反射,从出射面由干涉膜中出射(例如,参照专利文献l), Conventional LED, the emitted beam from the light emitting diode element is inserted, which leads to a portion of the light emitting surface side of the light emitting element of the light emitting diode element to the reflecting surface, and the other leading directly from a portion of the light transmissive member exit surface, at the reflecting surface, by means of the phosphor emits visible light by receiving radiation from the beam of the light emitting diode element, for the main or more 500nm visible light emission. in addition, direct access to the light receiving surface of the transmissive member radiation beam, ultraviolet component of 400nm or less is the interference reflection film 20, returned again to the transparent resin material, the adhesive is irradiated onto the phosphor layer 16, is converted into visible light, direct or reflected on the reflecting surface, from the exit surface of the exit from the interference film (e.g., refer to Patent Document L),

专利文献1:特开2001 一345483号公报(笫0020 ~ 0026段,图1 )。 Patent Document 1: Laid-Open Patent Publication 345 483 the 1st 2001 (0026 ~ Zi section 0020, FIG. 1). 发明的内容 Summary of

传统的发光二极管,由于可以有效地充分利用来自于发光二极管元件的輻射束的紫外波段,所以,能够实现利用发光二极管的元件装置的高性能及节能化.另外,由于可以防止由来自于太阳光的紫外线引起的光透射性构件的恶化及变黄,所以,可以提高在室外使用发光二极管的情况下的寿命,特别是,作为室外用图形显示装置是非常合但是,在本结构中,具有电极构件的结构构成障碍,提取出来的光的效率降低的缺点.进而,在为了提高装置主体的发光量利用多个 The conventional light emitting diode, can be utilized effectively due to ultraviolet radiation from a beam of the light emitting diode element, it is possible to realize the light emitting diode element using the high performance and energy saving device. Further, since it is possible to prevent the sunlight from UV-induced deterioration of the light-transmissive member and yellow, it is possible to increase the life of the case of using a light emitting diode outdoors, in particular, outdoor displayed as graphics device is engaged, however, in this configuration, the electrode having a disadvantage of reduced efficiency of the structural member constituting the light barriers extracted. Further, in order to increase the amount of light emitted by a plurality of apparatus body

LED的情况下,其电极面积增加,很难在保持髙的提取效率的情况下提髙发光量。 The case of the LED, the electrode area is increased, the amount of light emission is difficult to mention Gao while maintaining the extraction efficiency Gao.

另外,有一种在透光性构件的上面直接设置干涉膜的方法,因此, 透光性构件当然必须是固体的。 Further, there is a method of setting the interference film directly above the light-transmitting member, and therefore, the light-transmitting member must of course be solid. 因此,例如,不能使用热传导率良好的液体、胶状体作为透明材料。 Thus, for example, good thermal conductivity can not use a liquid, jelly as a transparent material. 另外,特别是,在将发光面作为下面使用的情况下,由于是将LED元件埋在透明光构件内的结构,所以, 存在着在元件的结合部产生的热的散热效率差、从而LED的发光效率降低以及元件的寿命缩短的问题. Further, particularly, in the case where the light-emitting surface as used below, since the LED element is embedded in the transparent optical member structure, therefore, there is a difference in heat dissipation efficiency of the binding portion generating element, so that the LED reduction in the luminous efficiency and lifetime of the element is shortened.

本发明的目的是,获得一种在使用多个像LED元件那样的短波长光源的发光装置的情况下,改进其效率降低及散热性、高效率、长寿命并且低成本的发光装置以及利用该发光装置的照明器具. Object of the present invention is to obtain a device in the case where a plurality of light emitting elements such as LED as a light source of a short wavelength, the light emitting device to improve efficiency and reduce heat dissipation, high efficiency, long life and low cost and the use of the luminaire light emitting device.

根据本发明的发光装置,配备有:安装有发射短波长光的LED元件的多个LED安装基板;筐体,该筐体具有在凹部设有借助前述LED 元件的前述短波长光发出变换光的波长变换部的反射面;竖立设置在前述筐体的凹部底面的中央部的热传导性LED基板支撑板;前述反射面由沿着前述LED基板支撑板的前述竖立设置部的两側形成的抛物面构成,将前述LED安装基板安装到LED基板支撑板的两个面上, 使前述LED元件的发光面分别朝向前述反射面. The light emitting device according to the invention, is provided with: an LED mounting element emits short-wavelength light of a plurality of LED mounting board; housing, the housing having a recess portion is provided by means of the LED elements emitted light of the short wavelength light converted the reflecting surface of the wavelength conversion portion; erected thermally conductive central portion of the bottom of the recess of the housing of the LED substrate support plate; the reflection surface is formed by a paraboloid formed along both sides of the the upright portion of the LED substrate support plate , the LED mounting substrate is mounted to the two surfaces of the LED substrate support plate, the light emitting surface of each LED element toward the reflection surface.

发明的效果 Effects of the Invention

由于本发明包括:具有在凹部设有借助前述LED元件的前述短波长的光发出变换光的波长变换部的反射面的筐体,以及竖立设置在前述筐体的凹部底面的中央部的热传导性的LED基板支撑板,将安装LED元件的LED安装基板安装在前述LED基板支撑板的两个面上, 因此,可以获得即使利用多个LED元件,发光效率也不会降低,并且, 散热性优异,从发光面提取光的效率高,长寿命的发光装置及照明器具,附困说明 Since the present invention comprises: a thermally conductive central portion of the bottom of the recess the housing is provided with a wavelength converter emits converted light by the short-wavelength light the LED element in the recess portion of the housing reflecting surface, and the erected LED substrate support plate, the mounting of LED elements mounted LED mounting substrate on both surfaces of the LED substrate support plate, and therefore, can be obtained even with a plurality of LED elements, light emitting efficiency does not decrease, and excellent heat dissipation properties , high extraction efficiency of light from the light emitting surface, the light emitting device and a long lifetime of the luminaire, with difficulties described

图l是表示本发明的实施形式l的发光装置的剖视困. Figure l is a cross-sectional view showing a light emitting device according trapped embodiment of the present invention is l.

图2是困1的俯视图. FIG 2 is a plan view of FIG. 1 trapped.

图3是表示本发明的实施形式1的发光装置的LED安装基板的俯视图. FIG 3 is a plan view of an LED mounting substrate of the light emitting device of the present embodiment of the invention 1.

困4是表示本发明的实施形式1的发光装置的LED安装基板的剖视图。 4 is a sectional view of a trapped LED mounting substrate of the present embodiment of the light emitting device 1 of the invention.

图5是表示本发明的实施形式1的发光装置的波长变换材料的结构说明图, FIG 5 is an explanatory view showing the structure of a wavelength conversion material in the embodiment of the light emitting device of the present invention 1,

图6是表示本发明的实施形式1的发光装置的剖视困. 图7是表示本发明的实施形式1的发光装置的剖视困. 图8是表示本发明的实施形式2的发光装置的剖视困. 图9是困8的俯视图. FIG 6 is a sectional view of trapped light emitting device embodiment of the present invention. FIG. 7 is a cross-sectional view of trapped light emitting device embodiment of the present invention. Figure 8 is a diagram showing a light emitting apparatus embodiment of the present invention, 2 trapped sectional view. FIG. 9 is a top view of FIG. 8 trapped.

图10是表示本发明的实施形式2的发光装置的俯视图. 图11是表示本发明的实施形式2的发光装置的剖视困. 图12是图11的俯视困. FIG 10 is a plan view showing a light emitting device of the present embodiment 2 of the invention. FIG. 11 is a cross-sectional view showing a light emitting device according trapped embodiment of the present invention. FIG. 12 is a top view of FIG. 11 trapped FIG.

图13是表示本发明的实施形式3的发光装置的剖视困. 困14是困13的俯视困。 FIG 13 is a cross-sectional view showing a light emitting device according trapped embodiment of the present invention. FIG. 14 is trapped trapped trapped plan 13.

图15是表示本发明的实施形式3的发光装置的剖视图. 图16是图15的俯视图, FIG 15 is a cross-sectional view of a light-emitting device of the present embodiment 3 of the invention. FIG. 16 is a plan view of FIG. 15,

图17是表示本发明的实施形式3的发光装置的剖视图. 图18是图17的俯视图。 FIG 17 is a cross-sectional view of a light-emitting device of the present embodiment 3 of the invention. FIG. 18 is a plan view of FIG. 17.

图19是表示本发明的实施形式4的发光装置的剖视困。 FIG 19 is a cross-sectional view showing a light emitting device according trapped embodiment 4 of the invention. 图20是图19的俯视图. FIG 20 is a plan view of FIG. 19.

图21是表示本发明的实施形式4的发光装里的剖视困, 图22是表示本发明的实施形式5的发光装置的剖視图. 困23是表示本发明的实施形式5的发光装置的剖视图. 图24是表示本发明的实施形式5的发光装置的剖视图. 图25是表示本发明的实施形式5的发光装置的剖视图. 21 is a light-emitting device of the present embodiment 4 of the invention trapped in the cross-sectional view, FIG. 22 is a sectional view of a light emitting device according to Embodiment 5 of the present invention, FIG. 23 is a diagram trapped embodiment of the present invention, the light emitting device 5 sectional view. FIG. 24 is a cross-sectional view of a light emitting device according to embodiment 5 of the present invention, FIG. FIG. 25 is a sectional view of a light emitting device according to embodiment 5 of the present invention, FIG.

7图26是表示本发明的实施形式6的照明器具的剖视图. 图27是图26的俯视困。 26 is a cross-sectional view of FIG. 7 embodiment of the present invention is a lighting apparatus 6. FIG. 27 is a plan trapped FIG. 26.

图28是表示本发明的实施形式6的照明器具的剖視图. FIG 28 is a cross-sectional view of the embodiment of the present invention, FIG 6 luminaire.

图29是表示本发明的实施形式6的照明器具的剖视图. FIG 29 is a cross-sectional view of the embodiment of the present invention, FIG 6 luminaire.

图30是表示本发明的实施形式6的照明器具的剖视困. FIG 30 is a cross-sectional view showing embodiments of the present invention trapped luminaire 6.

图31是表示根据本发明的实施形式1的发光装置的基板支撑板的一个结构例的剖视图. FIG 31 is a cross-sectional view showing a configuration example of the light emitting device substrate supporting plate in the embodiment of the present invention 1.

图32是表示根据本发明的实施形式1的发光装置的基板支撑板的一个结构例的剖视图, FIG 32 is a cross-sectional view of a configuration example of the substrate supporting plate in the embodiment of the light emitting device 1 of the present invention is represented,

图33是表示本发明的实施形式1的波长变换部的一个结构例的图 FIG 33 is a diagram showing an exemplary configuration of the wavelength converter of the present embodiment of the invention.

示, Show,

图34是表示本发明的实施形式1的发光装置的剖视困. 图35是表示本发明的实施形式1的发光装置的剖视图。 FIG 34 is a cross-sectional view showing a light emitting device according trapped embodiment of the present invention. Figure 35 is a cross-sectional view of a light emitting device according to an embodiment of the present invention, FIG. 图36是表示本发明的实施形式2的发光装置的剖视围. 图37是表示本发明的实施形式3的发光装置的剖视困. 图38是表示本发明的实施形式7的发光装置的剖视困. 图39是表示本发明的实施形式7的发光装置的俯视困. 图40是表示本发明的实施形式7的发光装置的剖视困。 FIG 36 is a cross-sectional view around the light emitting device of embodiment of the present invention. FIG. 37 is a cross-sectional view of trapped light emitting device embodiment of the present invention. FIG. 38 shows a light emitting apparatus embodiment of the present invention 7 trapped sectional view. FIG. 39 is a plan view showing a light emitting device according trapped embodiment of the present invention. 7. FIG. 40 is a cross-sectional view showing a light emitting device according trapped embodiment 7 of the invention. 图41是表示本发明的实施形式7的发光装置的剖视图, 图42是表示本发明的实施形式7的发光装置的剖视图. 图43是表示本发明的实施形式7的发光装置的剖视图, 图44是表示本发明的实施形式7的发光装置的俯视图. 图45是表示本发明的实施形式7的发光装置的剖视图, 图46是表示本发明的实施形式7的发光装置的剖视困, 图47是利用本发明的实施形式7的发光装置的照明器具的剖视困. FIG 41 is a cross-sectional view of the lighting apparatus embodiment of the present invention. 7, FIG. 42 is a cross-sectional view of the lighting apparatus embodiment of the present invention 7 FIG. 43 is a cross-sectional view of the lighting apparatus embodiment of the present invention. 7, FIG. 44 is a plan view showing a light emitting device of embodiment of the present invention. 7. FIG. 45 is a cross-sectional view of the lighting apparatus embodiment of the present invention. 7, FIG. 46 is a cross-sectional view of trapped light emitting device embodiment of the present invention. 7, FIG. 47 embodiment of the present invention is the use of the luminaire 7 is a sectional view of the light emitting device of the storm.

图48是利用本发明的实施形式7的发光装置的照明器具的剖视困。 FIG 48 is a embodiment of the present invention using the lighting apparatus of the light-emitting device 7 is a cross-sectional view of the storm.

图49是表示本发明的实施形式7的发光装置的剖视图.图50是表示本发明的实施形式7的发光装置的剖视图. 围51是图49、图50的平面困。 FIG 49 is a cross-sectional view of a light emitting device according to Embodiment 7 of the present invention, FIG. FIG. 50 is a cross-sectional view of a light emitting device according to Embodiment 7 of the present invention, FIG. FIG. 49 is around 51, the plane of FIG. 50 trapped. 具体实施方式实施形式l. DETAILED DESCRIPTION embodiment l.

图1是表示本发明的实施形式1的发光装置的剖视图(困2的B 剖视困),困2是发光装置的俯视图,图3是发光装置的LED安装基板的俯视图,图4发光装置的LED安装基板的剖视图(图3的B剖面),图5是发光装置的波长变换材料的说明图, 1 is a cross-sectional view of the lighting apparatus embodiment of the present invention 1 (B trapped 2 a cross-sectional view of the storm), sleepy 2 is a plan view of a light emitting device, FIG. 3 is a plan view of the LED mounting substrate, a light emitting device, the fourth light emitting device of FIG. cross-sectional view (cross section B in FIG. 3) of the LED mounting substrate, FIG. 5 is an explanatory view of a wavelength conversion light emitting device material,

在图1、困2中,本发光装置由以下部分构成:安装有在近紫外波段具有峰值的短波长LED元件12的LED安装基板4;在内侧具有表面构成反射面2a的凹部的筐体2;设置在筐体2内側的反射面2a 上、以LED元件12发出的光作为激发光变换波长并发出作为变换光的笫二种光的波长变换部3;竖立设置在凹部的反射面2a的底部的中央、将LED安装基板4支撑在两个面上、具有热传导性的基板支撑板5;装配于筐体2的开口部的透光性板1;以及设置在筐体2的背面中央部的高热传导性构件40。 In Figure 1, sleepy 2, the light emitting device is configured by: a mounted short-wavelength LED element having a peak in the near-ultraviolet LED mounting board 412; a housing recess surface constituting the reflecting surface 2a of the inner member 2 ; a reflective surface provided on the second inner casing of the 2a, the light LED element 12 is emitted as excitation light converted wavelength and emits wavelength converting portion as the undertaking of two kinds of optical conversion of light 3; erected reflecting surface of the concave portion 2a of center of the bottom, the LED mounting substrate 4 is supported on both faces, having a thermal conductivity of the substrate supporting plate 5; a translucent housing mounted on the opening portion 2 of the plate 1; a central portion and a back surface provided on the housing body 2 the high thermal conductivity member 40. 并且,两个LED安装基板4以各自的LED 元件12的发光中心轴指向筐体凹部的反射面a的側面方向的方式安装在基板支撑板5的两个侧面上,透光性板1成为使从筐体内部发出的光发射到外部的发光面,例如用玻璃或树脂等透光性板构成. And, two LED mounting board 4 to the central axis of the light emitting element of each LED 12 is directed in a side surface direction of the reflection surface of the housing recess portion is mounted on both sides of the substrate supporting plate 5, so that the light-transmissive plate 1 becomes emitted from the light emitter inside the housing to outside of the light emitting surface, such as glass or a resin constituting a light-transmissive plate.

凹部的反射面2a由以下部分构成:形成在底部中央的棱线部2al, 沿着该棱线部2al的两侧具有谷部的两个在俯视图中呈长方形的抛物面所构成的反射面2a2,以及该抛物面的两端的侧面2a4,基板支撑板5配合到设于棱线部2al上的槽内并竖立设置,基板支撑板5的一侧的端面,其一部分与高热传导性构件40接触. Reflecting surface of the concave portion 2a is constituted by: a ridge line formed at the center of the bottom portion 2Al, valley portion having two rectangular shape parabolic reflecting surfaces 2a2 formed along both sides of the ridge line portion 2Al in plan view, and both ends of the side surface 2A4 paraboloid, the substrate supporting plate 5 is provided on the ridge line fitted to the groove portion 2al and erected, one end surface of the substrate supporting plate 5, which is in contact with a portion of the high thermal conductivity member 40.

另夕卜,从加工性能好的角度出发,筐体2用耐热性好的树脂构成, 但从散热性的角度出发,也可以用金属等高热传导性的构件构成. Another Bu Xi, from the viewpoint of good processability, the casing 2 constituting the heat-resistant resin is good, but from the viewpoint of heat dissipation, can be configured with a conductive member such as a metal heat.

其次,图3、图4表示LED安装基板4的结构,在本实施形式中, 以提高与LED元件12的寿命及发光效率相关的LED元件12的散热性为目的,对于LED基板IO使用金属基板.为了保持金属基板的电绝缘性,在基板上设置绝缘层15,在绝緣层15上设置导电困形11, 在导电图形11上安装LED元件12,而且,形成在除去导电困形11 上的LED元件12的安装部分之外的部分中设置绝缘层15的结构. Next, FIG. 3, 4 showing the structure of the LED mounting substrate 4 in FIG, in the present embodiment, in order to improve LED elements associated with the life and light emitting efficiency of the LED element 12 of heat dissipation 12 for the purpose of the LED board IO metal substrate on order to maintain an electrically insulating metal substrate, an insulating layer 15 provided on the conductive substrate 11 stuck-shaped insulating layer 15, the conductive pattern 11 in the LED element 12 is mounted, and formed in the shape removing the conductive trapped 11 portions other than the mounting portion of the LED elements 12 provided in the structure of the insulating layer 15.

进而,将LED安装基板上板13经由粘结层16结合到LEDi^L 10上,其中,所述LED安装基板上板13用于将从LED元件12向側面方向发射的前述短波长光以具有LED安装基板4的前面方向的光度分布特性提取出来,在LED安装基板上板13上,与LED12的配置位置相一致地设置反射孔14,反射孔14的侧面构成漫射或者镜面状的高反射率的面,以便使从LED元件12发出的光高效率地向前面发射。 Further, the plate is mounted on the LED substrate 13 bonded via the adhesive layer 16 to LEDi ^ L 10, wherein said substrate is mounted on the LED board 13 for short-wavelength emission from the LED element 12 toward the side direction of the light to have a the light distribution characteristics of the LED mounting direction of the front substrate 4 are extracted, the LED 13 is mounted on the upper substrate, the reflection hole 14 is provided in correspondence with the arrangement position LED12, holes 14 constituting the side reflector diffuse reflection or mirror-like high surface ratio, the light to be efficiently emitted from the LED element 12 emits toward the front. LED安装基板上板13,例如用金属或者树脂等构成,为了提髙照明效率,实施用高反射率的涂料涂布除反射孔14之外的表面、或者在表面上蒸镀高反射材料等的处理. LED mounting plate 13 on a substrate, such as a metal or a resin or the like, to provide illumination efficiency Gao, coated with a coating embodiment high reflectance reflection surface other than the hole 14, or vapor deposition on the surface of a highly reflective material such as deal with.

进而,为了提高从LED元件12的光提取效率,在LED安装基板上板13的反射孔14处以復盖LED元件的方式模塑透明性的模塑材料17.这里,透明性的模塑材料17,由于LED元件12是短波长的,所以,例如用具有耐光性的有机硅树脂、玻璃等材料构成,LED元件12 也可以是棵露状态的,但是通过制成这种结构,可以提高光提取效率。 Furthermore molding material, in order to improve the light extraction efficiency from the LED element 12, the LED reflector aperture plate 13 is mounted on a substrate 14 molded impose transparency overlay mode LED element 17. Here, the transparency of the molding material 17 Since the LED element 12 is a short wavelength, so that, for example, a silicone resin, glass and other materials having light resistance, LED elements 12 may be exposed state of trees, but by making such a configuration, it is possible to improve the light extraction effectiveness.

LED基板10即使是环氣玻璃钢基板对于作为发光装置的功能也不会造成妨碍,但是,如前面所述,为了提高LED元件12所发出的热量的散热性,使用金属基板,作为其它散热性基板,也可以使用将高热传导性的薄膜基板粘贴在金属板上的基板,或者使用陶资材料, LED board 10 even when the gas ring to the fiberglass substrate as a function of the light emitting device is not hindrance, however, as described above, in order to improve the heat dissipation of the heat emitted by the LED elements 12, a metal substrate, a heat-radiating substrate as another may be used highly heat conductive paste film substrate in the substrate metal plate, or the use of ceramic material resources,

这里,LED元件12并不特别限定于面朝上型、倒装片型的发光型的种类.而且,以提高反射孔14内的整体的反射率为目的,用髙反射率的涂料等涂布作为金属基板的LED基板10上的表面绝缘层, Here, LED element 12 is not particularly limited to the face-up type light-emitting-type flip-chip type. Furthermore, to enhance the overall reflectivity of the reflective object within the aperture 14, the reflectance coating and the like coating Gao an LED substrate having a metal surface of the substrate 10 on the insulating layer,

另外,作为与本实施例的LED安装基板4类似的结构,存在有LED基板和LED基板上板一体化的以陶瓷及高热传导性树脂作为主要材料的市售LED组件.本发光装置,在发光部使用装置市售的组件的情况下,也不会丧失其本质的功能,可以获得和本实施例同样的效果.这里,通过利用本实施例的反射孔14及市售组件的反射孔相对于LED发射的短波长光具有高反射率、而且LED基板上板13的表面及市售组件的表面相对于通过波长变换部变换的变换波长的光具有高反射率的构件构成,可以获得在这些部位光损失少、发光效率高的发光装置。 Further, as a similar structure to the LED mounting substrate of the present embodiment 4, there is on the LED substrate and the LED board and the ceramic plate integrated heat conductive resin material as the main component of commercially available LED The present light emitting device, the light emitting means the case where the unit used is a commercially available component, does not lose its essential function, and the same effects can be obtained according to the present embodiment. here, by using the present embodiment of the reflection bore hole 14 and the reflector assembly with respect to the embodiment of the commercially available short-wavelength LED emits light having a high reflectance, and commercially available components and surfaces on the LED board 13 with respect to the plate member configured by light having a high reflectance wavelength converter converting a wavelength conversion can be obtained at these sites less light loss, the light emitting device of high luminous efficiency.

波长变换部3,例如,如围5所示,作为三种混合荧光体构成, 所述三种荧光体分别具有以短波长LED发光光谦Sl作为激发光谦进行发光的青色发光光谦S2,绿色发光光谦S3,红色发光光谦S4。 The wavelength conversion unit 3, for example, around 5 as shown, a mixed phosphor composed of three kinds, the three kinds of phosphors each having a short-wavelength LED light emitting cyan light emission Qian Sl emitting light as excitation light S2 Qian Qian, green light emitting Qian S3, the red light emitting Qian S4. 借助这种结构,实现白色的发光,但是,在荧光体混合时,以提高发光效率同时提高彩色再现性的比例来实现三种荧光体的混合比. With this structure, to achieve white light emission, However, when the phosphor is mixed, to improve luminous efficiency while increasing the proportion of color reproducibility is achieved than three combined phosphors.

通过这样构成波长变换部3,与过去的利用青色发光LED元件和利用其波长激发、进行黄色发光的YAG系荧光体(钇•铝•柘榴石系荧光体)实现白色发光的方法相比较,由于在变换光波段发光光详的光谦成分是连续的,所以,可以获得彩色再现性髙的发光装置. Method 3, and past use of blue light emitting LED elements and the use of its wavelength excitation, a yellow light emission by this configuration of the wavelength conversion portion YAG phosphor (yttrium • aluminum • garnet-based phosphor) to achieve white light emission is compared, since the Qian light emitting component light converted light wavelength band is continuous in detail, it is possible to obtain color reproducibility of the light emitting device Gao.

但是,构成本发光装置的短波长LED是发出紫外线、近紫外线或者紫色、青色光的LED,并不以上述内容限制利用青色发光LED和YAG荧光体来实现.进而,在短波长LED的光利用具有紫外光、紫色、青紫色的近紫外光的情况下,由其激发的荧光体的种类,以青、 绿、红为首,存在着具有多种发光颜色的荧光体,从而,通过荧光体的选择、组合,可以获得白色之外的任意颜色的光,并且,例如通过对图5的S2、 S3、 S4选择具有窄的波段的光镨的荧光体,例如,可以获得能够适用于液晶显示装置的照明的颜色再现波段宽的发光装置。 However, the configuration of the present light-emitting device emits short-wavelength LED is a UV, violet or near ultraviolet light, blue light LED, not to limit the use of the above blue-emitting LED and a YAG phosphor to achieve. In addition, short-wavelength LED light utilized the case of a UV, violet, purple near ultraviolet light excitation type phosphor therefrom to blue, green, red led, there is a phosphor having a plurality of emission colors, so that, by the phosphor any color other than the selection, combination, white light can be obtained, and, for example, in S2 of FIG. 5, S3, S4 select the phosphor light having a narrow wavelength band of praseodymium, e.g., be obtained can be applied to the liquid crystal display device broad-band light-emitting device illumination color reproduction.

另外,当用具有紫或者音紫色的发光波长(360~430nm左右) 的作为近紫外线发光的荧光体构成短波长LED的发光波长时,与紫外发光的愔况相比, 一般地,尽管在该波长区域的荧光体的激发效率低, 但是LED元件12本身的光吸收少,具有发光效率变高的特征,因此, 通过利用近紫外LED,可以获得在维持高的发光效率的同时,像利用紫外线的情况中那样的构件的恶化减少,对生物体方向的恶劣影响小的发光装置.进而,如上所述,由于存在着很多在该波长区域具有激发带的荧光体,所以,具有可以任意设计发光颜色的优点, Further, when a near ultraviolet or violet light emission having a wavelength (about 360 ~ 430nm) tone purple light emission wavelength of the phosphor constituting the emission of short-wavelength LED, as compared with the ultraviolet light emitting serene condition, generally, although the low excitation efficiency of the phosphor of the wavelength range, the LED elements 12 light absorption itself is small, a light-emitting efficiency becomes high characteristics, and therefore, by using a near-ultraviolet LED, can be obtained while maintaining high light emission efficiency, as by ultraviolet in the case of reducing the deterioration of members such as small adverse effects on the living body of the lighting device. Further, as described above, since there are many phosphors having excitation bands in the wavelength region, having a light emission can be arbitrarily designed color advantage,

另夕卜,LED元件12, 一般地,当元件内部温度及周围温度变高时, 会导致发光效率降低,但是,在将本发光装置作为照明装置使用的情况下,在大多数情况下将本发光装置的发光面朝下使用,在这种情况下,考虑到散热性的本发明的结构,对于LED发光效率和元件的寿命起着非常有效的作用. Another Bu Xi, LED element 12, in general, when the internal temperature of the element and the ambient temperature increases, the light emission efficiency leads to decrease, however, in the case where the present light-emitting device is used as an illumination device, in most cases this emitting light-emitting device using the face, in this case, considering the heat dissipation structure of the present invention, for the life of the LED luminous efficiency and device plays an effective role.

特别是,在用金属等热传导性良好的材料构成基板支撑板5的同时,使设置在筐体2的背面的单面与采用置于空气中的结构的髙热传导性构件40接触,通过确保由LED元件12产生的热的散热通路,可以提高散热性。 In particular, at the same time forms the substrate supporting plate 5 with good thermal conductivity material such as metal, so arranged housing-sided back surface of body 2 employing the contact structure is placed in the air Gao heat conductive member 40, by ensuring that the cooling passage 12 of heat generated by the LED element, heat dissipation can be improved. 对于热传导性材料,采用使用热传导率高的铝、铜、 金属陶瓷等。 For the thermally conductive material, the use of high heat conductivity of aluminum, copper, and cermet.

另外,如图2所示,通过将基板支撑板5的短边側的至少一端与筐体2的内側的凹部的側面2a4连接的方式构成(围2的虚线上的A 点),将接触端作为上側作为側面发光装置使用的情况下,由于可以确保沿着基板支撑板5的散热路径,所以可以获得高的散热效果. Further, as shown in FIG. 2, constituted by at least one end (A surrounded by broken lines on the point 2) and the inner side surface of the concave portion 2a4 is connected to the housing 2 of the short side of the substrate supporting plate 5, the contact end as a case where the upper side surface of the light emitting apparatus used, since the heat dissipation path can be ensured along the substrate supporting plate 5, it is possible to obtain a high heat dissipation effect.

在这种结构中,从安装在竖立地设置在篋体2的凹部中央的LED 基板支撑板5的两个面上的LED安装基板4的LED元件12发射作为激发光的短波长光,由设置在筐体2的凹部的发射面2a上的波长变换部3变换波长所发出的变换光,经由透光性板l被发射. In this configuration, installed in an upright manner from the emission LED mounting board disposed at both surfaces of the LED substrate support plate trunk body 2 of the central recess 5 of the LED elements 12 of the 4 short-wavelength light as excitation light is provided by a converting the wavelength converted light conversion unit 3 on the emission surface 2a in the concave portion of the housing body 2 emitted wavelength, it is transmitted through the light-transmissive plate l.

这时,由LED元件产生的热量,经由LED安装基板4、基板支撑板5、高热传导性构件40散热, In this case, the heat generated by the LED elements via the LED mounting substrate 4, the substrate supporting plate 5, a high thermal conductive heat dissipating member 40,

如上所述,由于配备有在凹部具有设置了借助LED元件12的短波长光发出变换光的波长变换部3的反射面2a的箧体2、和竖立设置在该筐体2的凹部底面中央部的热传导性的LED基板支撑板5,将安装LED元件12的LED安装基板4装配在LED基板支撑板5的两个面上,所以,可以提高LED安装基板4的散热性,即使在使用由多个LED元件构成的大输出功率的LED安装基板的情况下,也可以抑制LED元件温度的上升,从而可以获得效率高寿命长的大光束发光装 As described above, it provided with having a trunk is provided by means of LED elements short wavelength 12 is a wavelength conversion of the light emitted converted light reflecting surface 3 2a of the recess 2, and the erected bottom of the recess a central portion thereof in the housing 2 the thermal conductivity of the LED substrate support plate 5, the mounting board mounting the LED 4 LED elements 12 fitted on both surfaces of the LED substrate support plate 5, it is possible to improve the heat dissipation of the LED mounting substrate 4, even in a multi- the case where output power of the LED elements constituting the LED mounting substrate, LED elements can be suppressed temperature rise, so that a large long life can be obtained a high efficiency of light beam emitting means

12置.另外,根据本发明的效果,在LED元件是单数的情况下,也是有效的. 12 is set. Further, the effect according to the present invention, the LED element in the singular case is also effective.

进而,作为LED元件,有近年来加速开发的大电流驱动、大的光输出型的LED元件,与之相关的发热量也大的LED元件(大功率元件)的装入也是可能的. Further, as the LED elements, have accelerated in recent years, the development of large current drive, a large light output type LED elements, loaded with a large amount of heat associated LED elements (power elements) are also possible.

另外,在本实施形式中,以与基板支撑板5接触的方式将高热传导性构件40安装到筐体2的背面上,但是,也可以不安装高热传导性构件40,而是用高热传导性构件至少构成安装有基板支撑板5的筐体2的凹部底面中央部, Further, in the present embodiment, the substrate in contact with the support plate 5 of high thermal conductivity member 40 is mounted to the back of the housing 2, however, may not be a high thermal conductivity member 40 is mounted, but with high thermal conductivity at least a member constituting the bottom of the recess portion is attached to the center housing 5 of the substrate support plate 2,

另外,如图6所示,代替与基板支撑板5的端部接触的高热传导性构件40,通过设置散热翅24等散热性构件,可以进一步给予散热效果。 Further, as shown in Figure 6, the end portion of the support plate and the substrate 5 instead of the high thermal conductivity of the contact member 40, and the like by providing the heat radiating fin member 24, the heat dissipation effect can be further administered. 另外,上面所述是用金属板形成筐体2的例子,但是,由于来自于基板支撑板5的热传递到散热翅24上,所以,图1所示的筐体2 的构成材料也可以是像树脂、塑料等这样的非金属性材料. Further, the above is an example of the housing 2 is formed with a metal plate, but, since the heat from the substrate support plate 5 is transmitted to the radiating fin 24, therefore, the basket 1 illustrated in FIG. 2 constituent material of the body may be non-metallic material such as resin, plastic or the like.

另外,除散热翅24之外,作为给予高的散热效果的构件,也可以利用冷却导管及珀耳帖(Peltier)元件,与散热翅24同样地以与LED 基板支撑板5的端部接触的方式构成. Further, in addition to cooling ribs 24 outside the high heat dissipation effect of a given component may also be utilized and Peltier cooling conduit (a Peltier) element, and the heat dissipation fins 24 contacting the same manner as the end portion of the LED substrate support plate 5 constitute manner.

另外,如图31所示,也可以按照使LED安装基板4相对于反射面2a位于斜上方的位置上的方式制成基板支撑板5的基板安装部分5a,通过这种结构,从透光性板1的表面側不会直接看到LED元件12的光源的像。 Further, as shown in FIG. 31, according to the LED may be mounted on the board 4 with respect to the embodiment of the reflecting surface 2a is located obliquely above the position of the substrate support plate 5 made of a substrate mounting portion 5a, this structure, the light-transmitting surface side of the plate 1 does not directly see the light source image 12 of the LED elements. 另外,如图32所示,也可以将LED基板支撑板5的LED基板安装部分5a制成倒三角形状,LED安装基板4的背面具有较大的厚度,可以使散热效果更好.在这种结构中,优选地,LED基板安装部分5a的倒三角形的表面(图的上侧)是高反射率的反射面, 另外,也可以连接到透光性板l上. Further, as shown in FIG. 32, may be the LED 5 LED board substrate supporting plate mounting portion 5a is made of an inverted triangle shape, mounted LED back substrate 4 having a large thickness can make better heat dissipation. In this configuration, preferably, LED board inverted triangle portion 5a of the surface (upper side in the drawing) of high reflectivity reflecting surface is mounted, additionally, may be connected to the light-transmissive plate l.

另外,也可以不是图1、困6所示的那样的壁厚大的筐体2,而是如图7所示那样制成用薄的金属板构成的形状.在图7中,除筐体2 之外,设置波长变换部3的反射部29也用同样的金属板构成.另外, 通过用LED支撑板压板41支承由高热传导性材料构成的基板支撑板5、将其安装到金属筐体2上,可以提髙散热效果。 Further, in FIG. 1 may not be, as shown in FIG. 6 trapped large wall thickness of the housing 2, but as shown in the shape of a thin metal plate made of a configuration shown in FIG. 7. In FIG. 7, in addition to housing 2 addition, the reflecting portion 29 of the wavelength conversion portion 3 is also constituted by the same metal plate. Further, a press plate 41 supporting LED support substrate supporting plate 5 made of a highly thermally conductive material, which is mounted to the metal casing 2, the heat dissipation effect can be improved Gao. 另外,通过在筐体2的背面安装散热翅24等高散热性构件,可以进一步使散热特性更好。 Further, the housing is mounted to the back surface of the radiating fin 2 high heat dissipation member 24, heat dissipation properties can be further better.

进而,提高LED元件12的散热性的结果,可以将LED特有的波长偏移抑制在相当低的范围内,从而,即使在使用多个荧光体的情况下,它们各自的发光光谦的变动也极小,可以获得穗定的发光颜色。 Further, to improve the heat dissipation of the LED element 12 results, the LED can be suppressed specific wavelength shift within a relatively low range, so that, even in the case where a plurality of phosphors, each emitting light fluctuates Qian very small, can be obtained ear set emission color.

另外,除将波长变换部3直接设置到筐体2的凹部的反射面2a 上之外,也可以采用在图7所示的附加波长变换材料用的柔性片上预先涂布波长变换部3,将其粘结到反射部29上的方法。 Further, in addition to the wavelength conversion portion 3 is directly provided to the outside of the reflecting surface of the concave portion 2a 2 of the housing, may be employed on a flexible sheet attached wavelength converting material shown in FIG. 7 previously coated with wavelength converter 3, the which is bonded onto a reflecting portion 29. 通过制成这种结构,可以消除在直接涂布波长变换部3的情况下、由于反射面2a 及反射部29的形状复杂而引起的涂布膜厚的匀称都变差等现象,另外,制造方法简单,可以提高发光效率. By such a configuration is made, it can be eliminated in the case of direct coating of the wavelength converting portion 3, due to the symmetrical shape of the reflective coating film thickness and the reflecting surface 2a portion 29 are caused by complex phenomena such as deterioration in addition, manufacturing The method is simple, light emission efficiency can be improved.

这时,如图33所示,波长变换部3,将作为主要结构材料的单一或者多种荧光体60包含在将它们固定用的粘结刑61内。 In this case, as shown, the wavelength conversion portion 3, to be embraced within their fixing adhesive 6133 as a single sentence or a plurality of phosphors 60 of the main structural material. 这种粘结刑的主要材料例如是树脂及水,以与荧光体之间不发生化学变化及不对光功能造成障碍作为前提进行选择.在本实施形式中,利用加工性能、 耐气候性、透光性良好,并且具有能够适应于弯曲的反射面2a的形状的柔软性的材料,例如有机硅材料形成. This primary bonding material is a resin, for example, criminal and water, and a chemical change does not occur between the light function and the phosphor obstacle to the premise selected. In the present embodiment, by the processing properties, weather resistance, transparency excellent light, and a material having flexibility can be adapted to the shape of the curved reflecting surface 2a, for example a silicone material.

另外,利用至少相对于LED元件12发射的短波长光具有高反射率的镜面或者漫射性的材料,构成附加波长变换材料用片25的表面。 Further, at least with respect to the use of short-wavelength LED 12 is a light emitting element having a specular or diffusive material having a high reflectivity, a wavelength conversion material constituting the surface of the additional sheet 25. 借助这种结构,利用该附加波长变换材料用片25的表面,高效率地使一次穿过波长变换部3的光(UV11)再次向粘结剂入射(UV12),可以给予再次进行波长变换的机会,从而,可以提髙波长变换效率.如果这时所使用的材料是附加波长变换材料用片25的表面反射率相对于波长变换后的光也具有高的反射率的材料的话,由于可以将在粘结剂内被进行过波长变换的光高效率地向装置内反射,所以,可以进一步获得发光效率更高的发光装置.另外,作为附近波长变换材料用片25,例如,可以使用由PET、铝、银等的多层结构制成的片, With this structure, the additional use of wavelength converting material of the surface of the sheet 25, so that a high efficiency of light through the wavelength converting portion (UV11) incident to the binder (UV12), may be administered through wavelength conversion again 3 again opportunities to be put Gao wavelength conversion efficiency. If the material at this time is used is the additional wavelength converting material surface reflectance of sheet 25 relative to light after the wavelength conversion is also a material having high reflectance, then, since the in the binder is subjected to light through the wavelength conversion with high efficiency into the reflecting means, it is possible to obtain further higher luminous efficiency light emitting device. in addition, sheet 25, e.g., made of PET can be used as a wavelength conversion material near , made of aluminum, silver or the like of a multilayer structure sheet,

这样可以获得和在将波长变换部3直接设置在筐体2的凹部的反射面2a时,通过用髙反射率材料形成至少涂敷有波长变换部3的部分的愔况同样的效果。 This can be obtained in the wavelength converting portion and arranged directly at the housing 3 when 2a, coated with at least the same effect as the wavelength converting portion yin case portion 3 is formed by a reflective material Gao reflecting surface of the concave portion 2. 本髙反射率材料可以和筐体是同一种材料,或者 Gao reflectance material may be present and the housing is of the same material, or

也可以在筐体2上通过金属蒸镀及金属镀敷铝及银等形成, It may be deposited by the metal body 2 and the metal plating of aluminum and silver formed in the housing,

另外,发光装置的波长变换部3,可以在波长变换部3的配置部上直接涂布或者喷雾混有荧光体的粘结刑材料,或者,在所述配置部上蒸镀形成荧光体,这时,和上面所述一样,通过用高反射率材料形成波长变换部3的配置部,可以获得具有高发光效率的发光装置, Further, the wavelength conversion light emitting device portion 3, can be directly applied or sprayed on the mixed portion of the wavelength conversion portion 3 disposed fluorescent body, the adhesive material sentence, or vapor deposition is formed on the phosphor portions arranged, which when, and as described above, by forming the wavelength conversion portion 3 disposed portion of material with high reflectance can be obtained a light emitting device having high luminous efficiency,

进而,如图7所示,由于通过在透光性板l的内側背面上设置反射LED12的发光波长、使除此之外的波长区域的光透射的薄膜及蒸镀膜等的LED发射光反射部26,可以作为不使LED元件12发射的光直接发射到外部、而是再次对来自于波长变换部3的发射光作出贡献的构件使用,所以,可以提高发光效率. Further, as shown in FIG. 7, since the emission wavelength of the reflected LED12 is provided on the back surface of the inner side of the light-transmissive plate l, and a light transmissive film vapor-deposited film and the like other than the wavelength region emitted by the LED light reflecting portion 26, can not be used as the LED light emitting element 12 is directly emitted to the outside, but contribute to the emitted light from the wavelength converting portion 3 of the member used again, it is possible to improve the luminous efficiency.

另外,不管有无LED发射光发射部26,也可以用透光性板l将篋体2的表面完全封闭,进而通过在筐体2内部封入氮气,或者抽成真空状态等,制成提高气密性的结构.另外,本透光性板l具有防止触及装置内部的部件的接触保护功能及提高耐气候性的功能,但根据使用条件,对于本发光装置的基本功能的实现而言,并不一定安装所述透光性板l。 Further, regardless of whether the LED emits a light emitting portion 26 may be a light-transmitting plate 2 l of the trunk completely closed surface, and further by enclosing nitrogen gas inside the casing 2, or the like evacuated state, made to improve the gas tightness of the structure. Further, the present light-transmissive member inner plate l reach preventing means increase the contact protection and weather resistance function, but according to the conditions for achieving the basic function of the present light-emitting device concerned, and mounting the light-transmissive plate is not necessarily l.

另外,通过在筐体2的开口部使用透镜系统27,可以容易地改变光度分布.透镜用耐光性好的光学玻璃或有机硅材料构成,根据不同的目的,可以将透镜的形状制成凸型或者凹型形状(在图中,是将光在某种程度上集中到装置前面的中央的透镜). Further, through the opening portion 2 of the housing in a lens system 27, luminous intensity distribution can be easily changed. Good lightfastness lens optical glass or a silicone material, depending on the purpose, it may be formed in the convex shape of the lens or a concave shape (in the drawing, the light is focused in a way to the front of the center of the lens apparatus).

另外,通过在基板支撑板S上设置高反射率的漫反射性遮光板28, 可以消除从发光面側观察时的LED元件12的光源像,同时,也可以减弱漫反射性遮光板28本身的像, Further, by providing the high reflectivity on the substrate support plate S diffusely reflecting light-blocking plate 28 may be eliminated source like LED elements 12 when viewed from the luminous plane side, but can also reduce diffusely reflecting light-blocking plate 28 itself image,

另外,在困1、 6、 7中,将筐体2的凹部的形状制成弯曲状,但是,例如,凹部底面也可以形成平面,本发光装置的功能不会因凹部的形状而丧失.作为例子,在图34中表示将凹部底面及侧面制成平面状时的结构图,在困35中表示将凹部的一部分底面制成平面、将侧面制成弯曲状时的结构困,反射面2a优选地为抛物面,但是,也可以将抛物面的至少一部分抛物面用与前述抛物面近似的平面代替,可以提高加工性能, Furthermore, in the stranded 1, 6, 7, the housing shape of the concave portion 2 of the body is made curved, but, for example, bottom of the recess may be formed in a plane, the function of the present light-emitting device without depending on the shape of the recess is lost. As example, a structural view of the flat bottom of the recess formed and the side in FIG. 34, showing a portion of the bottom of the recess formed in the plane, the structures formed when trapped in trapped in the curved side surface 35, the reflecting surface 2a is preferably be parabolic, however, may be parabolic with at least a portion of a paraboloid with a plane instead of the parabolic approximation, we can improve the processing performance,

另外,在上面的描迷中,将基板支撑板作为单独的结构部件进行了说明,但是,也可以将其制成与热传导性的筐体2成一整体的结构, 或者,将其制成与设置在图7的反射面下部的金属板等成一整体的结构,与单独构件结构时保持同样的散热功能。 Further, in the above described fans, the substrate supporting plate as a separate structural member has been described, but may be made of the thermal conductivity of the housing 2 into an integral structure, or it is made provided , to maintain the same heat dissipation structure when a separate member into a unitary structure reflecting surface of the lower metal plate 7 of FIG.

实施形式2. 2 embodiment.

图8是表示本发明的实施形式2的发光装置的剖视图(困9的B 剖面),围9是发光装置的俯视困, FIG 8 is a sectional view (B sectional trapped 9) of the light emitting device of the present invention in the embodiment 2, 9 is a plan trapped around the light emitting device,

在图8、困9中,与实施形式1的图l相同或者相当的部分赋予相同的标号,省略其说明. In FIG. 8, 9 trapped in the embodiment of FIG. 1 l of the same or corresponding portions are given the same reference numerals, and description thereof is omitted.

高热传导性构件40以将側面朝向凹部的底部的反射面2a2的方式、向内侧伸出地倾斜地安装在筐体2的开口部边缘的对向的两个边上.底部的反射面2a2是平面,安装高热传导性构件40的对向的侧面2a3,从底部反射面2a2朝着开口部向外側展宽地形成,另外的对向側面2a4垂直于底部的反射面2a2形成。 Heat conductive member 40 so as to face the side of the bottom of the concave portion 2a2 of the reflection surface, extending obliquely inwardly mounted in the opening edge portion of the casing body 2 to both sides of reflective surface of the bottom portion 2a2 is planar, heat conductive member mounted on the side surface 40 of 2A3, 2a2 are formed from the bottom of the wide reflecting surface toward the opening portion to the outside exhibition, 2a2 formed on the other side surface perpendicular to the reflecting surfaces 2a4 bottom.

并且,在高热传导性构件40的内表面側上,以LED元件的发光面朝向凹部底面的反射面2a2的方式,安装LED安装基板4. Further, on the inner surface of the side member 40 of high thermal conductivity, the light emitting surface of the LED element in a manner reflecting surface toward the bottom surface of the concave portion 2a2, the LED mounting substrate 4 is mounted.

在这种结构中,将从LED安装基板4的LED元件12发出的光作为激发光,用设置在筐体2的凹部反射面2a上的波长变换部3进行波长变换发射出来的第二种光,经由透光性板l被发射出去,这时,由LED元件12产生的热,经由LED安装基板4、基板支撑板5、高热传导性构件40、散热翅24散热, In this configuration, the second light, the light from the LED mounting substrate for an LED element 4 is emitted as excitation light 12, it is provided with a wavelength converting portion for the concave portion of the reflecting surface 2a of the housing 2 is emitted from the wavelength conversion 3 is emitted via the light-transmissive plate L, this time, the heat generated by the LED element 12, via the LED mounting substrate 4, the substrate supporting plate 5, heat conductive member 40, heat radiating fin 24,

如上所述,由于以LED元件12的发光面朝向底部的反射面2a2 的方式,将LED安装基板4安装在将内侧面朝向凹部底面的反射面2a2地装配在筐体2的开口边缘内側的高热传导性构件40上,所以, 从透光性板1的表面侧不会直接看到LED元件12的光源像,并且, 将波长变换部3作为和实施形式同样的结构,可以获得白色发光, As described above, because of the way the light emitting surface of the LED 2a2 element 12 toward the bottom of the reflecting surface, the LED mounting substrate 4 is mounted in the inner side facing the bottom of the recess of the reflection surface 2a2 is fitted in the opening edge of the high inner casing 2 the thermally conductive member 40, so that, from the surface side of the translucent plate 1 does not directly see the light source image of the LED element 12, and the same configuration as the wavelength conversion portion 3 and the embodiment, the white emission can be obtained,

另外,可以提高LED安装基板4的散热性,可以防止LED元件12本身的发光效率的降低、并防止其缩短寿命. Further, heat dissipation can be improved LED mounting substrate 4 can be prevented from reduction in luminous efficiency of the LED elements 12 itself, and to prevent their shortened life expectancy.

另外,在本实施形式中,LED安装基板4,在筐体2的开口部边缘部处作为对向的两个边,但也可以如图10所示,设置在四个边上. 另外,将筐体2的凹部底面的形状制成平面状,但是,例如,也可以制成弯曲状,不会因此对发光功能产生影响,在图36中表示这种情况的側视图。 Further, in the present embodiment, LED mounting substrate 4, as two opposing sides of the opening edge portion of the housing body 2, shown in Figure 10 but may be provided at four sides. Further, the the planar shape of the recess formed in the bottom surface of the housing 2, but, for example, can also be made curved, will not affect the light-emitting function, in this case a side view in FIG. 36.

另外,筐体2的凹部,在俯视图中呈四边形,但也可以是圃形。 Further, the concave portion of the housing 2, a quadrilateral shape in plan view, but may be shaped garden.

另外,如图11 (困12的平剖视图B)、图12所示,也可以在高热传导性构件40的背面设置散热翅24,进一步获得更好的散热效果. Further, as shown in FIG. 11 (cross-sectional view of the flat trapped 12 B), and 12, cooling ribs 24 may be provided on the back surface of the high heat conductivity member 40 is further obtained a better cooling effect.

另外,在本实施形式中,在氲体2的开口边缘部上安装支撑LED 安装基板4的高热传导性构件40,但是,也可以代替高热传导性构件40的部分,用髙热传导性构件至少构成该部分. Further, in the present embodiment, the mounting a high thermal conductivity member 40 supporting the LED mounting substrate 4 in the opening edge portion Yun body 2, however, instead of part of the high thermal conductivity member 40, by Gao thermally conductive member composed of at least the section.

另外,也可以将上述基板支撑板制成与热传导性的篋体成一整体的结构,在这种情况下,与用单独部件构成时保持同样的散热功能. Further, the substrate may be a support plate made of the thermal conductivity of the trunk body into a unitary structure, in this case, when constituted by a separate member to maintain the same cooling.

实施形式3. 3 embodiment.

图13是表示本发明的实施形式3的发光装置的剖视图(图14的B剖面),图14是发光装置的俯视图,在图13、图14中,与实施形式l的图l相同或相当的部分赋予相同的标号,省略其说明. FIG 13 is a sectional view (B sectional view of FIG. 14) of the light emitting device of embodiment of the present invention. 3, FIG. 14 is a plan view of a light emitting device in FIG. 13, FIG. 14, the embodiment l of Figure l the same as or equivalent denoted by the same reference numerals, and description thereof is omitted.

筐体2的凹部的反射面2a,由中央部的棱线部2al和沿着该棱线部2al在两侧具有谷部的槽形的两个抛物面状的反射面2a2构成,以将LED元件12的发光面分别朝向反射面2a2的方式,将LED安装基板4安装到平行于棱线部2al的对向的两个側面2a3上, The reflecting surface 2a of the housing 2 of the recessed portion, the central portion of the ridge line portion 2al and configured along the ridge line portion 2al on both sides having two parabolic reflecting surfaces 2a2 of the groove-shaped valleys to the LED elements the light emitting surface 12 toward the reflective surface of each of the 2a2 embodiment, the LED mounting substrate 4 is mounted parallel to the ridge line portion 2a3 of the two sides of the 2al,

并且,在筐体2的两个侧面2a3的背面安装散热翅24等高散热形构件.另外,在光提取侧的筐体开口面的边缘部,以向内側伸出的方式设置漫反射性的遮光板28,以便不会直接看到LED元件12的光源像。 And, on both sides of the rear surface 2a3 of the housing 2 is mounted high heat radiating fin-shaped member 24. Further, the opening edge portion of the light extraction surface side of the housing, so as to protrude inwardly disposed diffuse reflectivity the light shielding plate 28, so as not to directly see the LED light source 12 of the image element.

在这种结构中,以从LED安装基板4的LED元件12发出的光作为激发光,用设置在筐体2的凹部的反射面2a2上的波长变换部3进行波长变换所发出的第二种光(白色光)经由透光性板l发射出来。 In this configuration, the LED light board mounting element 4 is emitted from the LED 12 as excitation light, is provided with a wavelength converting body housing portion 2a2 2 on the reflecting surface of the concave portion 3 of the emitted second wavelength conversion light (white light) emitted through the light-transmissive plate l. 这时,由LED元件12产生的热经由LED安装基板4、筐体2的側面2a3、散热翅24散热. In this case, the heat generated by the LED 12 via the LED element mounting substrate 4, the housing 2 of the side surface 2A3, heat radiating fin 24.

如上所述,由于筐体2的凹部的反射面2a由中央部的棱线部2al 和沿着该棱线部2al在两侧具有谷部的槽形的两个抛物面状形成的反射面2a2构成,以将LED元件12的发光面分别朝向反射面2a2的方式,将LED安装基板4安装到平行于棱线部2al的对向的两个侧面2a3上,在两个侧面2a3上安装散热翅24,所以,由LED元件12产生的热经由筐体2的側面的散热翅24向空气中散热,从而可以确保LED元件12的高的发光效率,同时可以延长LED元件12的寿命。 As described above, since the reflective surface of the concave portion 2a of the housing 2 is composed of a central portion of the ridge line portion 2al and a reflective surface is formed along the two ridge line portion 2al parabolic trough having a trough-shaped portion 2a2 on both sides to the light emitting surface of the LED element 12 toward the respective reflection surfaces 2a2 embodiment, the LED mounting substrate 4 is mounted on two parallel side faces of the ridge line portion 2a3 2al, radiating fin 24 mounted on both sides 2a3 the heat dissipation fin, the heat generated by the LED element 12 through the housing 24 to the side surface 2 of the cooling air, thereby ensuring high efficiency of the LED light emitting element 12, and can extend the life of the LED elements 12.

另外,由于在开口面的边缘部设置漫反射性遮光板28,所以,可以消除在从发光面侧观察时的LED元件12的光源像, Further, since the edge of the opening face provided diffuse reflectivity shading plate 28, it is possible to eliminate the light source images when viewed from the luminous plane side of the LED element 12,

另外,也可以不安装散热翅24,用高热传导性构件至少构成安装了LED安装基板4的筐体2的凹部的两个側面2a3,也可以安装散热翅24,以便进一步提高散热效果. Further, cooling ribs 24 may not be mounted, with high thermal conductivity member constituting at least a LED mounting board housing body 4 two side portions 2a3 of the recesses 2 is mounted, radiating fins 24 may be attached, in order to further improve the heat dissipation effect.

另外,如困15 (图16的B剖面)、困16所示,也可以在筐体2 的凹部的两个側面2a3的安装了LED安装基板4的部分上,设置和LED安装基板4相同大小的开口部,制成不会从该篋体凹部漏光、并且LED安装基板4经由开口部直接与空气接触的结构,使散热特性良好.这时,通过在LED安装基板4的背面设置散热翅24,可以进一步提高散热特性. Further, as the storm 15 (B cross section in FIG. 16), trapped. 16, may be part of the LED mounting substrate body 4 of two sides of the concave portion 2 is mounted in the housing 2a3, provided the same size and the LED mounting substrate 4 an opening portion formed without light leakage from the concave portion of the trunk, and the LED mounting structure of the contact with the air directly through the opening portion of the substrate 4, so that good heat dissipation properties. in this case, the heat radiation fin 24 through the back surface of the LED mounting substrate 4 , heat dissipation properties can be further improved.

另夕卜,通过使图13的设有波长变换部3的篋体凹部的棱线部2al 比LED元件12的光轴中心(图13中的C线)更靠上方的位置,可以将从LED元件12发出的光高效率地照射的波长变换部上,可以获得高的波长变换效率。 Another Bu Xi, is provided by a ridge line portion in FIG wavelength converting portion 3 of the body trunk portion is recessed more than the LED 2al axis center (C line in FIG. 13) in a position above the element 12 13, from the LED may be the portion irradiated with the light wavelength conversion efficiently emitted from element 12, a high wavelength conversion efficiency. 另外,在图13中,作为棱线部构成的反射面, 即使是如图37所示在该反射面上具有平面部的结构,也可以保持波长变换的功能. Further, in FIG. 13, the reflecting surface of the ridge portion defined, even having the structure shown in FIG. 37 in the planar portion of the reflecting surface can be maintained in the wavelength conversion function.

另外,如困17、图18所示,筐体2的凹部也可以制成圃形,在中央部设置由凸出部2a5和沿着该凸出部la5的外周形成的圃形的抛物面构成的反射面2a2,借助这种结构,可以提高波长变换效率及光提取效率.另外,筐体2的凹部的圃形形状也可以是接近圃形的多角形。 Further, difficulties such as 17, shown in FIG. 18, the concave portion 2 of the housing may be formed garden shape, provided in the central portion by the convex portion 2a5 and garden parabolic shape formed along the outer periphery of the protruding portion constituted la5 reflecting surfaces 2a2, With this structure, the wavelength conversion efficiency can be improved and the light extraction efficiency. Further, garden shaped recess of the housing 2 may be a polygonal shape close to the garden.

另外,作为LED安装基板4,可以用散热性高的金属基板或陶瓷基板构成,但考虑到向篋体2上的安装容易性,例如,也可以用耐热性髙的像聚跣亚胺那样的柔性基板构成,进而,如图14所示,通过在筐体2的背面安装散热翅24,可以提高散热效果。 Further, an LED mounting substrate 4, with a high heat dissipation property can be a metal substrate or a ceramic substrate made of, but considering the trunk body 2 is mounted on the ease, for example, also be used as heat-resistant polyethylene imine Municipal as Gao a flexible substrate formed, and further, as shown in FIG. 14, the back of the housing 2 by mounting the heat dissipation fins 24, the heat dissipation effect can be improved.

实施形式4. 4 embodiment.

图19是表示本发明的实施形式4的发光装置的剖视图(困20的B剖面),图20是发光装置的俯视图,图21是发光装置的剖视图(困20的A剖面), FIG 19 is a sectional view (B 20 trapped in the cross-section) light-emitting device of Embodiment 4 of the present invention, and FIG. 20 is a plan view of a light emitting device, FIG. 21 is a sectional view of a light emitting device (A sectional trapped 20),

在图19至21中,与实施形式l的图l相同或相当的部分赋予相同的标号,省略其说明, In FIGS. 19 to 21 is, in the embodiment of FIG. L l the same or corresponding portions are given the same reference numerals, and description thereof is omitted,

筐体2的凹部的反射面2a,由两側的棱线2al和在该棱线2al之间具有谷部的在俯视困中呈长方形的槽状的抛物面构成的反射面2a2 用多个棱线部2al连接排列起来构成,各个反射面2a2在棱线部2al 方向的两个端部,由篋体的側面2a3支撑.并且,安装在LED安igA 板4上的LED元件12的光轴以通过由各个抛物面构成的反射面2a2 的方式,安装在LED安装基板4对向的筐体的側面2a3上, Reflecting surface of the concave portion 2 of the housing 2a, a reflecting surface made of a parabolic ridgeline 2al sides and having valleys between the ridge line 2al rectangular groove-shaped in plan with a plurality of ridge lines 2a2 trapped in arraying connector portion 2al, 2a2 at the both end portions of the ridge portion 2al direction, supported by the body trunk side surfaces each reflecting surface 2a3 Further, the optical axis of the LED element 12 is mounted on the LED safety plate 4 through igA 2a2 manner reflecting surface made of the respective paraboloid, mounted on the side of the housing to the four pairs of LED mounting board 2A3,

这样,以沿着LED元件12的发光轴的方式、并且棱线部2al位于相邻的LED元件12之间的方式,构成多个弯曲的条带状. Thus, to extend along the light-emitting axis of the LED element 12 and the ridge portion 12 between the embodiment 2al adjacent LED elements, composed of a plurality of curved strip.

在这种结构中,以从LED安装基板4的LED元件12发出的光作为激发光,由设置在筐体2的凹部的各个反射面2a2上的波长变换部3变换波长发出的笫二种光,经由透光性板l发射.这时,LED元件产生的热经由LED安装基板4、筐体2的側面2a3、散热翅24散热。 In this configuration, light of the LED element mounting board 4 is emitted from the LED 12 as excitation light, by a provided housing undertaking of two kinds of light 3 is converted wavelength converting portion on 2a2 2 each reflecting surface of the concave portion of the emitted body , transmitted via the light-transmissive plate l. in this case, the heat generated by the LED elements via the LED mounting substrate 4, the housing 2 of the side surface 2A3, heat radiating fin 24.

如上所述,由于反射面2a由多个棱线2al和沿着该棱线2al在两側具有谷部的槽状的多个抛物面形成的反射面2a2构成,以将LED安装基板4的发光面分别朝向反射面2a2的方式将LED安装基板4安装到各个反射面2a2的各自的两端的筐体的侧面2a3上,所以,可以将从LED元件12在多个方面发出的光在沿着光轴的限定的范围内进行波长变换,由于在没有大的光的损失的状态下在波长变换部3进行波长变换,所以,可以提高波长变换效率以及从本发光装置中的光的提取效率. As described above, since the reflecting surface is formed by a plurality of ridge lines and a plurality of parabolic 2al 2al on both sides having a groove-like valley portions along the ridge line of the reflection surface 2a 2a2 configuration, to the substrate mounting the light emitting surface of the LED 4 manner toward each reflection surface 2a2 of the LED mounting board 4 is mounted to the side face of each of the housing across the reflecting surfaces 2a2 of the respective 2A3, it is possible in many aspects from the LED 12 emits light along the optical axis of the elements wavelength conversion within the scope defined, since the wavelength conversion in the wavelength conversion portion 3 in a state without a large loss of light, it is possible to increase the wavelength conversion efficiency and extraction efficiency of light from this light emitting device.

实施形式5. 5 embodiment.

图22~图25是表示本发明的实施形式5的发光装置的剖视图, 22 to FIG. 25 is a sectional view of a light-emitting device of the present embodiment of the invention, FIG 5,

图22、图23、围24分别是重新绘制的实施形式1的图6、实施形式2的图8、实施形式3的困13的图示,图25是表示图6的波长变换部3的大小的图示。 22, 23, 24 are surrounded by the embodiment of FIG. 1 redrawn 6, 8 of the embodiment of FIG. 2, the illustrated embodiment in the form of trapped 13 3, 25 is a wavelength conversion portion in FIG. 6 of size 3 illustration.

在围22 ~图24中,调整实施形式1的困4所示的LED安装^L 上板13的反射孔14的反射部角度及透明性模塑材料17的模塑形状, 如图22 ~困24所示,制成这样一种结构,使得从LED安装基板4的LED元件12发出的光的光度分布成为从LED元件12观察时进入筐体2的凹部内(进入从困中的LED元件12的光轴算起的角度8以下). In around 22 to 24, an adjustment of the embodiment shown trapped ^ L 4 LED mounting hole 13 on the reflection plate reflecting portion angle and transparency of the molding material 14 is molded shape 17, as shown in FIG. 22 to sleepy FIG. 24, a configuration is made such that the distribution be observed LED element 12 enters the housing from the recess 2 (entering from the LED element 12 trapped in the luminosity of the light from the LED substrate 12 of the LED element 4 is mounted emitted counting the optical axis angle of 8 or less).

通过制成这种结构,可以将从LED元件12发出的光高效率地照射到波长变换部3上,可以实现高效率的发光装置. By forming such a structure, light can be efficiently emitted from the LED 12 is irradiated to the wavelength conversion element unit 3, the light emitting device with high efficiency can be realized.

进而,如困25所示,使得设置在篋体2的凹部的反射面2a上的波长变换部3占有的部分与LED元件12所发出的光照射的范围(照射角度P)相一致. Further, as shown in sleepy 25, provided that the range of light irradiation trunk portion emitted by the LED element 123 occupies the wavelength converting portion 2a 2 of the upper concave portion of the reflecting surface (irradiation angle P) coincides body.

借助这种结构,可以缩小波长变换部3的面积,能够降低波长变换部的成本,可以将装置制成廉价的. With this structure, it is possible to reduce the area of ​​the wavelength conversion portion 3, the wavelength converting unit cost can be reduced, the apparatus can be made inexpensive.

这时,通过使未施加波长变换部材料的反射面2a处于高腐反射性状态,可以保持离的发光效率.也可以用铝等镜面反射材料构成反射面2a,但是,如果用漫反射性高的白色材料制成的话,可以获得从发光面側观察时不容易辨认出波长变换部3与反射面2a的交界的外观好的发光装置. In this case, by not applying a waveform converting unit length in the material of the reflection surface 2a of the high reflective state of corrosion, can be kept away from the light emission efficiency can be specularly reflective material such as aluminum constituting the reflection surface 2a, however, if high diffuse reflectance made of a white material, it is possible to obtain a good appearance is not easy to identify the light emitting device 3 and the reflection surface 2a of the junction of the wavelength converting portion as viewed from the luminous plane side.

实施形式6. 6 embodiment.

图26、图28~30是表示利用本发明的实施形式6所示的发光装置的照明器具的剖视图(图27A剖视图),困27是图26、图28 ~图30的俯视困.本实施形式是分别利用4台实施形式1~3所示的发光装置的结构最简羊的下面敞开的照明器具. 26, 28 to 30 is a cross-sectional view of the lighting fixture of the light-emitting device using the embodiment of the present invention shown in FIG. 6 (27A sectional view), the storm 27 in FIG. 26, a top trapped FIGS. 28 to 30 of the present embodiment in the form of respectively using four embodiments 1 to 3, the structure of the light emitting device shown in simplest sheep following an open luminaire.

在困26~困30中,在照明器具的上部备有点亮发光装置51用的点灯装置52,可以经由照明器具的电源输入部53向点灯装置52供应商用电源,另外,经由点灯装置52向设置在发光装置51上的电源输入部供应LED元件12点亮用的电力.发光装置51,向中心部向四个方向配置4台. 26 to 30 trapped in trapped in the upper portion of the lighting fixture equipped with the lighting apparatus 52 is turned on by the light emitting device 51 may be a commercial power source via a power input unit 53 is supplied to the lighting fixture 52 lighting apparatus, further, the lighting apparatus 52 via the power input portion is provided on the light emitting device 51 for lighting the LED element 12 supplies a power light-emitting device 51, toward the central portion 4 disposed in four directions.

图26表示利用实施形式1的发光装置51的照明器具,由发光装置51的金属等构成的高热传导性构件40直接或者经由高热传导性密封件设置在照明器具的照明器具筐体50上, 26 shows a lighting fixture using the embodiment of the light emitting device 51, 40 is provided directly on the luminaire or lighting fixture housing 50 via the high thermal conductivity of the seal member made of a highly heat conductive metal or the like of the light emitting device 51,

在这种结构中,从发光装置51的LED产生的热经由LED安装基板4、基板支撑板5、高热传导性构件40向照明器具筐体50散热. In this structure, heat generated from the LED light emitting device 51 via the LED mounting substrate 4, the substrate supporting plate 5, a high thermal conductivity member 40 to the radiator 50 luminaire housing.

图28是将安装散热翅24的实施形式1的发光装置51应用到照明器具上的例子,在照明器具的发光装置51的安装部上,发光装置51 的散热翅24,以直接接触空气的方式构成. FIG 28 is mounted cooling ribs embodiment 24 of an example of the lighting apparatus emitting device 511 is applied to, on the mounting portion of the light emitting device 51 of the luminaire, the heat dissipation fin light emitting device 51 24, in direct contact with the air in a manner constitution.

通过制成这种结构,可以利用照明器具上部的对流进行冷却,可以进一步提高散热效果。 By forming such a structure, the upper portion of the convection may be utilized for cooling the lighting fixture, the heat dissipation effect can be further improved.

图29是利用在实施形式2中,安装高热传导性构件40的发光装置51的照明器具,发光装置51的高热传导性构件40,直接或者经由高热传导性密封件配置在照明器具的照明器具篋体50上。 FIG 29 is utilized in the embodiment 2, is mounted a high thermal conductivity member luminaire light emitting device 51 40, high thermal conductivity member is a light emitting device 51 40, arranged directly or via a high thermal conductivity seal luminaire trunk luminaire 50 on the body.

在这种结构中,从发光装置51的LED产生的热经由LED安装基板4、高热传导性构件40,向照明器具筐体50散热. In this structure, heat generated from the LED light emitting device 51 via the LED mounting substrate 4, a high thermal conductivity member 40, 50 to heat the luminaire housing.

图30是使用在实施形式3中,代替散热翅24安装高热传导性构件40的发光装置51的照明器具,发光装置51的筐体2的LED安装基板4的安装部分直接或者经由高热传导性的密封件等设置在照明器具的照明器具筐体50上, FIG 30 is used wings 24 are mounted high heat conductivity member luminaire light emitting device 40 51 in embodiment 3, instead of the heat dissipation, the light emitting device housing 51 of the mounting portion of the LED mounting substrate 2 to 4 directly or via the high thermal conductivity seals disposed on the light fixtures 50 of the housing,

在这种结构中,从发光装置51的LED产生的热经由LED安装基板4、筐体2的高热传导性构件40向照明器具篋体50散热, In this structure, heat generated from the LED light emitting device 51 via the LED mounting substrate 4, the housing 2 of the high thermal conductivity member 4050 is dissipated to the luminaire body trunk,

如上所述,可以获得能够抑制LED元件12的温度上升、发光效率良好长寿命的照明装置, As described above, it is possible to obtain the LED element capable of suppressing the temperature rise of 12, the illumination device excellent in luminous efficiency and long life,

另外,照明光,其一部分作为从发光装置51发出的光,其另一部分作为M射板56反射的光,可以通过将所述光混合获得该照明光. Further, illumination light, which is part of light emitted from the light emitting device 51, and the other part M as a light reflection plate 56 is reflected can be obtained by mixing the light of the illumination light.

这时,反射板56,从提高照明效率的角度出发,优选地使用高反射性材料,根据所需的用途,也可以进行漫射面或者镜面加工。 In this case, the reflection plate 56, from the angle of illumination efficiency, it is preferable to use a highly reflective material, depending on the desired purpose, or may be mirror-finished surface diffusion.

实施形式7. 7 embodiment.

图38是表示本发明的实施形式7的发光装里的剖视图(图39的B剖面),图39是发光装置的俯视围.在图37、 38中,与实施形式l 的图l相同或者相当的部分赋予相同的标号,省略其说明,配备有和实施例1等同样的安装发射短波长的光的LED元件12的LED安装基板4、和在具有在凹部设置利用LED元件的短波长的光发出变换光的波长变换部3的反射面2a的筐体. FIG 38 is a cross-sectional view of the lighting apparatus embodiment of the present invention 7 Lane (FIG B cross section 39), FIG. 39 is a plan view around the light emitting device. In FIG. 37, 38, the embodiment l of Figure l the same as or equivalent portions are given the same reference numerals, and description thereof, 4, and a recessed portion provided with the LED elements of short-wavelength light in an LED mounting substrate provided with and the same installation in Example 1 other embodiment short-wavelength light emitted from the LED element 12 is omitted wavelength converter emits converted light reflecting surface 3 of the casing 2a.

这里,反射面2a由与LED安装基板4对向地形成的抛物面构成, LED安装基板4以使LED安装基板4的发光面分别朝向反射面2a的方式安装在筐体凹部内的一个側面上。 Here, the reflecting surface 2a of the mounting substrate 4 pairs of parabolic circumferentially formed constituted by a LED, the LED mounting substrate 4 so that the LED mounting the light emitting surface of the substrate 4 of the embodiment 2a is mounted within the housing recess portion on a side surface of each facing reflective surface. 在这种在篋体2内的一个边上设置LED安装基板4的发光装置中,除将其透光性板1朝下使用之外, 在以LED安装基板4倒(散热翅24側)成为上側的方式将透光性板1朝向橫向的使用方法中,LED元件12所产生的热可以沿着筐体向上方散热,可以获得散热性良好、发光效率高的发光装置, In such a light emitting device disposed on the edge of the trunk body 2, the LED mounting substrate 4, in addition to use light-transmissive plate 1 facing down, in order to install the LED 4 down (radiating fin 24 side) of the substrate becomes manner using a lateral side of the light transmitting plate 1 toward a method, the heat generated by the LED elements 12 can be heat upwardly along the housing, good heat dissipation can be obtained, the light emitting device with high emission efficiency,

这时,通过将LED发出的光的最大光度分布角如困38的最大光度分布角度S所示限制在反射面2a内,可以将成为波长变换部的一次激发光的LED发出的光高效率地照射到波长变换部3上,可以实现发光效率高的发光装置。 In this case, the maximum luminous intensity by the luminous intensity distribution angle of light emitted by the LED maximum spread angle of 38 trapped as limited to the reflective surface S shown in FIG. 2a, the light can be a high efficiency LED excitation light emitted from the wavelength converting portion irradiated to the wavelength conversion portion 3, the light emitting device with high emission efficiency can be realized. 另外,如困40所示,即使使用与实施形式3 类似的表面是镜面或者漫射性的、高反射率的光反射遮光板62,可以降低直接入射到透光性板1上的LED发出的光的比例,仍然可以获得发光效率髙的发光装置.另外,光反射遮光板62也可以是与篋体成整体结构的.另外,凹部反射面2a,例如,如困41所示,也可以由与抛物面基本上近似的平面构成,另外,如困42所示,也可以由抛物面和平面部构成,也可以实现波长变换功能.另外,在图43(困44的B剖面)中,波长变换部3由与LED基板4对向形成的抛物面构成,以将LED安装基板4的发光面朝向反射面2a的方式,安装到作为设置在筐体凹部的开口边缘部上的一个倾斜构件的髙热传导性构件40上。 Further, as shown trapped 40, even if a surface similar to the embodiment 3 is specular or diffusive, a high reflectance light-reflecting light-blocking plate 62 may be reduced directly incident on the light-transmissive plate emitted by the LED 1 the proportion of light, still can be obtained a light emitting device Gao emission efficiency. Further, the light-reflecting light-blocking plate 62 may also be a trunk body integral structure. Further, the concave portion reflecting surface 2a, for example, as the storm 41 may be made approximately parabolic substantially planar configuration, further, as shown in the storm 42 may be constituted by a parabolic portion of peace, the wavelength conversion function can be achieved. Further, in FIG. 43 (B 44 trapped in the cross section), the wavelength conversion portion 3 composed of the LED board 4 facing the parabolic form, in the way 2a the light-emitting surface of the LED mounting substrate 4 toward the reflecting surface, mounted as a tilting member is provided at the opening edge portion of the housing concave portion of Gao thermally conductive member 40 on. 与图38、图39同样,除将透光性板l 朝向下侧使用之外,在LED安装基板4变成上側的方式将透光性板1 朝向横向使用的方法中,也可以获得散热性良好、发光效率高的发光装置。 And FIG. 38, FIG. 39 similarly, except that the light-transmissive plate l lower side toward outside use, the LED mounting substrate 4 side becomes manner using a method of laterally toward the translucent plate 1, heat dissipation properties can be obtained good, high luminous efficiency light emitting device.

图45是用LED安装基板4的背面具有厚度的髙热传导性构件54 构成的例子,可以获得高的散热效果。 Gao Examples of the thermally conductive member 54 having a thickness of FIG. 45 is a back side of the LED mounting substrate 4 composed of a high heat radiating effect can be obtained. 这里,如图45所示,也可以在光源设置側的側面上,配置波长变换部3. Here, as shown in Figure 45, may be provided on the side of the light source side, the wavelength converting portion 3.

另外,在困43、 45中,表示了反射面2a是抛物面时的愔况,但是也可以用与前述抛物面近似的平面代替抛物面的至少一部分的抛物面,由于LED安装基板4的安装位置,底部也可以是平面,用抛物面和平面构成可以提高加工性能. Furthermore, in the stranded 43, 45, represents the reflecting surface 2a is yin conditions at the time paraboloid, but may be a plane with the parabolic approximation instead of parabolic at least a portion of a paraboloid, since the mounting position of the LED mounting substrate 4, the bottom also may be planar, parabolic and planar configuration can improve the processing performance.

另外,如图46所示,在篋体2内部的底面的一部分上设置凹部, 在该凹部内配置波长变换部3,通过制成至少将从LED光轴算起,透光性板1側的LED元件12的最大光度分布角度S集中在该区域之内的结构,可以获得发光效率高的发光装置.进而,通过使光度分布角变窄、缩小波长变换部的区域,可以获得成本低廉的发光装置。 Further, as shown in FIG, 46 is provided on the inside of the trunk portion of the bottom surface of the concave portion 2, the wavelength conversion portion 3 arranged in the recess, formed at least by counting from the optical axis of the LED, the light-transmissive plate 1 side the maximum luminous intensity distribution angle of the LED element 12 in the structure S concentration area, a high light emitting efficiency of the device. Further, by narrowing the luminous intensity distribution angle, narrowing the wavelength conversion unit area, low-cost light emission can be obtained device.

另外,例如,如图47 (表示器具的剖视图)所示,将在本实施形式中所表示的结构的发光装置51装入到提高本发光装置的散热性的照明器具筐体50中,可以作为发光效率高的大光束照明器具使用.在 Further, for example, (cross-sectional view showing the appliance) 47, the light emitting device 51 in the present form of embodiment represented in the structure is loaded to improve heat dissipation luminaire housing according to the present light-emitting device 50, as high luminous efficiency large beam luminaire used in

将多个本发光装置沿着纸面方向排列的长方形状的照明器具的情况下,如图所示,令装置侧面或者筐体背面与利用高热传导性材料构成的照明器具筐体50接触(贴紧),制成确保散热性的结构,这时,由于发光装置51可以从其宽的波长变换部提取出漫射的白色光,所以, 可以获得降低令人不快的眩光的照明器具. The case where the rectangular luminaire plurality of light emitting devices arranged along this direction of the paper, as shown, so that the back side of the device housing or body 50 contacts (the luminaire housing and the use of highly thermal conductive material paste tight), to ensure heat dissipation structure is made, this time, since the light emitting device 51 can be extracted from the diffuse white light of a wide wavelength converting portion, it is possible to obtain a reduced unpleasant glare lighting fixture.

另外,如困48 (表示器具的剖视图)所示,可以将多个发光装置51作为以提髙其散热性的结构配置的照明器具使用,通过在纸面的纵深方向也配置多个发光装置,可以获得宽阔的大光束面的照明器具. Further, as the storm 48 (a cross-sectional view of the appliance shown), a plurality of light emitting devices 51 may be to provide a heat dissipation structure which Gao configuration of an illumination fixture using the depth direction in the drawing by a plurality of light emitting devices also, lighting can open wide big beam surface.

图48是表示在用热传导性材料形成的照明器具筐体50上设置开口部50c,与该开口部50c相一致地设置发光装置的发光面(透光性板l) 的例子。 FIG 48 is a body 50 provided on the opening portion 50c formed in the luminaire housing with a thermally conductive material, examples of the light emitting surface of the light emitting device (light-transmissive plate l) coincides with the opening portion arranged 50c.

照明器具筐体50,在前面具有前面开口部50a (照明器具的发光面表面),在底部50b上具有发光装置51的筐体2的发光面側插入安装的开口部50c,形成箱状,底部50b的内側表面用高反射率材料袭盖,前面开口部50a用漫射透射板63覆盖。 Lighting fixture housing 50 having a front opening portion 50a (a light emitting surface of the surface lighting fixture) at the front, having a housing the light emitting device 51 of the light emitting surface side 2 of the insertion opening portion 50c mounted, a box shape on the bottom 50b, the bottom the inner surface 50b of the passage of a material with a high reflectance cover portion 50a with a diffusion transmitting plate 63 covers the front opening.

另外,从前面开口部50a向里側设置竖立设置部50d,使照明器具筐体50与发光装置51的热传导良好,同时容易固定。 Further, from the front opening 50a erected portion 50d is provided to the back side, the lighting fixture housing 50 with good thermal conductivity emitting device 51, while easily fixed. 另外,照明器具筐体50的底部50b和发光装置的透光性板1的各个面最好是没有阶梯差, Further, the lighting fixture housing 50 of the light-transmissive plate 50b and the bottom surface of each of the light emitting device 1 is preferably no step difference,

在这种结构中,从发光装置51发射的光,透过漫射透射板63发射,并且,被漫射透射板63反射的光被照明器具筐体50的底部50b 的高反射铝材料反射,透过漫射透射板63发射。 In this structure, the light emitted from the light emitting device 51, emission through the diffusion transmission plate 63, and is reflected by the light transmissive diffusing plate 63 is a lighting fixture housing bottom 50b of the body 50 of a highly reflective aluminum, transmitting through the diffusion transmission plate 63.

另外,从发光装置51发发生的热,从筐体2经由照明器具筐体50的竖立设置部50d向照明器具50散热, Further, the heat from the light emitting device 51 made occurrence, from the casing body 2 provided upright portion 50 of the luminaire 50 to the heat sink 50d via the luminaire housing,

这样,可以抑制LED元件12的温度上升,可以获得发光效率好长寿命的照明装置。 Thus, it is possible to suppress the temperature rise of the LED element 12, the lighting device light emission efficiency can be obtained a long life.

另外,由于照明光的一部分是从发光装置51发出的光,另外的部分是被照明器具筐体50的底部50b的高反射率材料反射的光透过漫射透射板63被发射,所以,可以使照明光成为均匀的,可以获得高发光效率均匀的照明光的照明器具. Further, since a part of the illumination light is emitted from the light emitting device 51, the further moiety is reflected high reflectivity material at the bottom 50b of the casing 50 of the luminaire light 63 is emitted through the diffusion transmission plate, it is possible illumination light becomes uniform, a uniform high emission efficiency can be obtained illumination light lighting fixture.

进而,通过控制各个发光装置的驱动电力,也可以进行发光面的分区点灯控制.另外,对于本结构的照明器具,例如,可以作为液晶显示装置等的照明光源使用. Further, by controlling the driving power of each light emitting device, a lighting control may partition the light emitting surface. Further, the illumination device of the present structure, for example, using the illumination light as the liquid crystal display device or the like.

下面,利用困49、困50、困51,对于本发光装置的波长变换部3 的另外的结构进行说明.困49是图48的发光装置的剖视困,图51 是图49、图50的平面图,图49的波长变换部3,由ft反射率面构成其配置部分,将波长变换部3表面形状形成凹凸状,在借助这种结构具有一定的固定尺寸的筐体中,相对于平坦地构成波长变换部3的情况而言,可以确保其表面的LED照射面积比较宽,结果可以获得高效率的发光装置。 Here, the use of trapped 49, stranded 50, stranded 51, for additional structural wavelength converting portion according to the present light-emitting device 3 will be described. Trapped 49 is a cross-sectional view of trapped light emitting device of FIG 48, FIG 51 is a 49, 50, a plan view of the wavelength conversion portion 49 of FIG. 3, is constituted by surfaces disposed ft reflectivity portion, the surface shape of the wavelength converting portion 3 formed in an uneven shape, the housing having a certain fixed size by means of such a configuration, with respect to the flat constituting the wavelength converting portion 3 of the case, to ensure its LED illuminated area of ​​the surface is relatively wide, the result can be obtained a light emitting device with high efficiency. 进而, 如图50所示,将波长变换部3的表面形成凹凸的形状,同时,借助与该形状相一致地形成反射面2a的结构,在增加LED照射面积的同时, 可以使荧光体变换部的厚度一定,所以,与图49同样,可以获得高发光效率并且廉价的发光装置. Further, as shown in FIG. 3 the surface of the wavelength conversion portion 50 is formed concave and convex shape, while the structure is formed by means coincides with the reflecting surface 2a of the shape, at the same time increasing the area of ​​the LED illumination, the phosphor converting portion can a certain thickness, so that, similarly to FIG 49, a high light emission efficiency can be obtained and inexpensive light-emitting device.

另外,波长变换部3的凹凸形状,例如,如图图51 (a)所示, 可以形成棱锥体状,也可以如图51 (b)所示,形成直线的三角形波的形状(虚线表示棱线,实线表示谷).另外,也可以如图51(c)所示,形成曲线的三角形波的形状。 Shape (broken line of the triangular wave Moreover, uneven wavelength conversion unit 3, for example, shown in Figure 51 (a), the pyramidal shape may be formed, as shown in FIG 51 (b), represented by rectilinear ribs line, a solid line indicates the valley). Further, as shown in 51 (c), the shape of the triangular wave profile is formed. 在任何一种情况下,都使反射面2a 的倾斜部分的间距比平面部小.图51(c)所示的情况,在LED元件12的数目少的情况下,可以使凹凸形成部谷LED元件12的距离相等, 是很有效的. In either case, the reflecting surface 2a of the inclined portion of the pitch is smaller than the flat portion. FIG. 51 (c) in the case shown, in the case where a small number of LED elements 12 can be formed so that the uneven portion Valley LED equal to the distance element 12, is very effective.

另外,该波长变换部的结构,并不局限于本实施形式,在构成前述实施例的波长变换中也可以实施. Further, the structure of the wavelength conversion portion is not limited to the present embodiment, the configuration of the wavelength conversion in the foregoing embodiments may be implemented.

例如,利用实施形式7的困46所示的波长变换部3等时,也是有效的, For example, when using the embodiment of the wavelength converting portion shown in FIG. 3 and the like 467 is trapped, it is also effective,

上面,本实施形式,揭示了发光装置51及利用该发光装置的照明器具,但是将本实施形式所示的发光装置51用于实施形式6中所示的照明器具,也可以获得同样的效果. Above, the present embodiment discloses a light emitting device using the lighting fixture 51 and the light emitting device, it will be shown in the present embodiment in the form of a light emitting device 51 for lighting fixture in the form of embodiment shown in Figure 6, the same effect can be obtained.

Claims (19)

1. 一种发光装置,其特征在于,该发光装置包括:安装有发射紫外线~青色光的短波长光的LED元件的多个LED安装基板,筐体,该筐体具有在凹部设有借助前述LED元件的前述短波长光发出变换光的波长变换部的反射面,竖立设置在前述筐体的凹部底面的中央部的热传导性LED基板支撑板,前述反射面由形成于前述LED基板支撑板的竖立设置部的两侧的抛物面构成,将前述LED安装基板安装到LED基板支撑板的两个面上,使前述LED元件的发光面分别朝向前述反射面。 1. A light emitting device, wherein the light emitting device comprising: - a plurality of mounted LED emits ultraviolet light of the blue LED mounting substrate element short-wavelength light, the housing, the housing having a recessed portion provided by the the short-wavelength LED elements emitted light reflective surface of the wavelength conversion portion converting light erected thermally conductive central portion of the bottom of the recess of the housing of the LED substrate support plate, the reflecting surface is formed on the LED substrate support plate parabolic portion is provided on both sides of the upright configuration, the LED mounting substrate to a mounting surface of the LED substrate supporting two plates, the light emitting surface of each LED element toward the reflection surface.
2. —种发光装置,其特征在于,该发光装置包括: 安装有发射紫外线〜青色光的短波长光的LED元件的多个LED安装基板,筐体,该筐体具有在凹部设有借助前述LED元件的前述短波长光发出变换光的波长变换部的反射面,前述反射面由中央部的棱线部和沿着该棱线部在两侧具有谷部的槽状的抛物面构成,将前述LED安装基板安装到与前述棱线部相对的筐体的两个侧面上,使前述LED元件的发光面朝向前述反射面。 2. - A luminous means, characterized in that the light-emitting device comprising: - a plurality of ultraviolet light emitting mounted LED mounting substrate for an LED element, blue light of short wavelength light, the housing, the housing having a recessed portion provided by the the short-wavelength LED element emits light reflective surface of the wavelength converted light converting portion, the reflecting surface is formed by the ridge portion and the central portion of the ridge line portion having a parabolic trough-shaped groove portions on both sides along the aforementioned LED mounting board mounted on both sides of the housing body and the ridge line portion opposite to the light emitting surface of the LED element toward the reflection surface.
3. 如权利要求2所述的发光装置,其特征在于,前述反射面的棱线部或者凸出部的顶点,位于比前述LED元件的光轴更靠近前述筐体的开口面侧。 The light emitting device according to claim 2, characterized in that the vertex of the reflection surface of the ridge portion or the convex portion, the ratio of the optical axis of LED elements positioned closer to the opening surface side of the housing.
4. 一种发光装置,其特征在于,该发光装置包括: 安装有发射紫外线〜青色光的短波长光的LED元件的多个LED安装基板,筐体,该筐体具有在凹部设有借助前述LED元件的前述短波长光发出变换光的波长变换部的反射面,前述反射面由多个棱线部和沿着该棱线部在两侧具有谷部的槽状的多个抛物面构成,将前述LED安装基板安装到前述各个抛物面的各自的两端的筐体侧面上,使前述LED安装基板的发光面分别朝向前述反射面。 4. A light emitting device, wherein the light emitting device comprising: - a plurality of mounted LED emits ultraviolet light of the blue LED mounting substrate element short-wavelength light, the housing, the housing having a recessed portion provided by the the short-wavelength LED element emits light reflective surface of the wavelength converted light converting portion, the reflective surface is formed by the ridge portions and a plurality of grooves having a plurality of parabolic trough-shaped portions on both sides along the ridge line portion, and the housing-side surface of the mounting substrate to the respective ends of the respective paraboloid mounting the LED, the light emitting surface of the LED mounting substrate respectively face the reflection plane.
5. 如权利要求1~4中任何一项所述的发光装置,其特征在于,将构成前述反射面的抛物面的至少一部分的反射面用近似于前述抛物面的平面4戈替。 The light emitting device as claimed in any of claims 1 to 4, wherein the reflective surface constituting at least a part of the parabolic reflecting surface of the plane with the approximate parabola for 4 Ge.
6. 如权利要求1~4中任何一项所述的发光装置,其特征在于,至少前述篁体中的安装有前述LED安装基板的部分为热传导性材料。 The light emitting device as claimed in any of claims 1 to 4, characterized in that at least part of the thermally conductive material is attached to the body of Huang the LED mounting substrate.
7. 如权利要求1~4中任何一项所述的发光装置,其特征在于,在安装有前述LED安装基板的前述筐体的背面装配散热片。 The light emitting device as claimed in any of claims 1 to 4, characterized in that the assembly is attached to the back surface of the heat sink the LED mounting substrate of the housing.
8. 如权利要求1~4中任何一项所述的发光装置,其特征在于,从前述LED元件发出的光的光度分布角度是前述发出的光以进入对向的反射面内的方式照射的角度。 The light emitting device as claimed in any of claims 1 to 4, characterized in that the luminous intensity distribution angle of light emitted from the LED elements is emitted from the light irradiated to enter the reflecting surface of the pair angle.
9. 如权利要求1~4中任何一项所述的发光装置,其特征在于,该发光装置包括LED发射光反射部,所述LED发射光反射部在安装于前述箧体的开口部的透光性板的至少一个面上反射前述短波长光的一部分或者全部波长的光,将由前述波长变换部变换的变换光中的包含一部分或者全部的波长的光以透射的方式提取出来。 9. The light emitting device as claimed in any of claims 1 to 4, wherein the light emitting device includes an LED emitting a light reflecting portion, said LED emitting light through the reflection portion attached to the opening portion of the trunk body a light-reflection plate at least one face or all the wavelengths of the short wavelength portion of the light, will comprise part or all of the wavelengths of the light transmitting manner to extract the optical wavelength conversion portion converting the conversion.
10. 如权利要求1~4中任何一项所述的发光装置,其特征在于, 前述反射面的至少配置有前述波长变换部的表面,由相对于前述LED 元件发射的短波长光以及进行过波长变换的光具有高反射率的材料形成o 10. The light emitting device as claimed in any of claims 1 to 4, characterized in that at least the surface of the wavelength converting portion of the reflection surfaces, carried out by a short-wavelength light emitted from the LED elements with respect to and a material having a high light reflectance for forming a wavelength conversion o
11. 如权利要求1~4中任何一项所述的发光装置,其特征在于, 在前述反射面的至少配置有前述波长变换部的表面上,至少配置相对于前述LED元件发射的短波长光以及进行过波长变换的光具有高反射率的反射片。 11. The light emitting device as claimed in any of claims 1 to 4, characterized in that, on the reflecting surface is disposed at least a surface of the wavelength converting portion, arranged at least with respect to short-wavelength light emitted from the LED elements and a light reflective sheet having been high reflectance wavelength conversion.
12. 如权利要求1~4中任何一项所述的发光装置,其特征在于,构成前述波长变换部的材料是将荧光体混入具有透光性且具有柔性的树脂中的片状材料。 12. The light emitting device as claimed in any of claims 1 to 4, characterized in that the material constituting the wavelength conversion portion is mixed into the phosphor sheet in a flexible resin material having a light transmitting property and has.
13. 如权利要求1~4中任何一项所述的发光装置,其特征在于, 前述波长变换部的表面形成凹凸状。 13. The light emitting device as claimed in any of claims 1 to 4, characterized in that the surface of the wavelength converting portion are formed uneven shape.
14. 如权利要求1~4中任何一项所述的发光装置,其特征在于, 前述LED安装基板的表面由相对于前述LED元件发射的短波长光及利用波长变换部变换过的变换波长光具有高反射率的材料形成。 14. The light emitting device as claimed in any of claims 1 to 4, wherein the LED mounting surface of the substrate with respect to the wavelength converted by the short-wavelength light by the wavelength conversion unit and the LED element emitting light of a converted a material having high reflectance is formed.
15. 如权利要求1~4中任何一项所述的发光装置,其特征在于, 前述LED安装基板用高热传导性材料构成。 15. The light emitting device as claimed in any of claims 1 to 4, wherein the LED mounting board constituted by a high thermal conductive material.
16. 如权利要求1~4中任何一项所述的发光装置,其特征在于, 前述短波长光是紫色或者青紫色的光。 16. The light emitting device as claimed in any of claims 1 to 4, characterized in that the short-wavelength light purple or light purple foregoing.
17. —种照明器具,其特征在于,该照明器具使用如权利要求1~ 16中任何一项所述的发光装置。 17. - species luminaire, wherein the light emitting device according to any of 1 to 16. The use as claimed in claim luminaire.
18. 如权利要求17所述的照明器具,其特征在于,照明器具的筐体由热传导性材料构成,前述发光装置的筐体的热传导性构件的至少一部分与前述照明器具的前述筐体接触。 18. The luminaire according to claim 17, characterized in that the housing the lighting fixture is made of thermally conductive material, at least the housing part of the lighting fixture contact heat conductive member of the housing of the light emitting device.
19. 如权利要求18所述的照明器具,其特征在于,前述照明器具的箧体形成箱状,所述箱状在前面具有前面开口部,在底部具有前述发光装置的前述箧体的发光面侧插入的开口部,前述底部的表面由高反射率的材料构成,前述前面开口部由漫射透射板覆盖。 19. The luminaire according to claim 18, wherein the trunk body is formed in a box-shaped lighting fixture, the box-shaped front portion having a front opening, having a light emitting surface of the body trunk at the bottom of the light emitting device insertion opening side, the bottom surface is made of material having a high reflectivity, the front opening portion is covered by the diffusion transmission plate.
CN 200480006869 2003-12-05 2004-12-03 Light emitting device and illumination instrument using the same CN100492685C (en)

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CN105065938A (en) * 2015-08-10 2015-11-18 苏州速腾电子科技有限公司 Lamp provided with reflector with highly-reflecting film

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