JP2011175868A - Lighting equipment - Google Patents

Lighting equipment Download PDF

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Publication number
JP2011175868A
JP2011175868A JP2010039213A JP2010039213A JP2011175868A JP 2011175868 A JP2011175868 A JP 2011175868A JP 2010039213 A JP2010039213 A JP 2010039213A JP 2010039213 A JP2010039213 A JP 2010039213A JP 2011175868 A JP2011175868 A JP 2011175868A
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Prior art keywords
light source
heat
emitting element
light
light emitting
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JP2010039213A
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Japanese (ja)
Inventor
Norimasa Suzuki
則雅 鈴木
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to JP2010039213A priority Critical patent/JP2011175868A/en
Priority to CN2011100439778A priority patent/CN102162590A/en
Priority to US13/033,398 priority patent/US20110205741A1/en
Priority to EP11155625A priority patent/EP2360430A1/en
Publication of JP2011175868A publication Critical patent/JP2011175868A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V11/00—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00
    • F21V11/16—Screens not covered by groups F21V1/00, F21V3/00, F21V7/00 or F21V9/00 using sheets without apertures, e.g. fixed
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F21V13/10—Combinations of only two kinds of elements the elements being reflectors and screens
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/03—Lighting devices intended for fixed installation of surface-mounted type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/14—Adjustable mountings
    • F21V21/30—Pivoted housings or frames
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide lighting equipment effectively radiating heat generated from a light emitting element to suppress the temperature rise of the light emitting element, while effectively securing a member storage space. <P>SOLUTION: The lighting equipment 1 includes a heat conductive body 11, a light source portion 12 stored in the body 11, and having the light emitting element 5 as a light source, a spacer member 13 existing between the inner peripheral wall of the body 11 and the light source portion 12 to form the member storage space 18 between the inner peripheral wall of the body 11 and itself, and a heat conduction structure 7 for thermally coupling the light source part 12 to the inner peripheral wall of the body 11 through the member storage space 18. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、ＬＥＤ等の発光素子を光源として用いる照明装置に関する。   The present invention relates to a lighting device using a light emitting element such as an LED as a light source.

近時、屋内又は屋外用の照明装置の光源としてＬＥＤが用いられるようになってきている。ＬＥＤ等の発光素子は、その発光中に熱を発生し、温度が上昇するに従い、光の出力が低下し、耐用年数も短くなる。このため、ＬＥＤやＥＬ素子等の固体発光素子を光源とする照明装置にとって、発光効率の特性を改善したり耐用年数を延したりするために、発光素子の温度が上昇するのを抑制することが重要である。   Recently, LEDs have been used as light sources for indoor or outdoor lighting devices. A light emitting element such as an LED generates heat during light emission, and as the temperature rises, the light output decreases and the service life is shortened. For this reason, it is possible to suppress an increase in the temperature of the light emitting element in order to improve the characteristics of the light emission efficiency and extend the service life of the lighting device using a solid light emitting element such as an LED or an EL element as a light source. is important.

また、照明装置の筐体内には、発光素子に電力を供給して点灯制御するための電源装置や配線関係の部材を収容するスペースを確保する必要がある。しかしながら、発光素子から発生する熱の影響もあり、熱の影響を受けることが少なく、有効にスペースを確保するのが困難な状況にある。
従来、ＬＥＤ光源体の熱をこれと接触する光源体取付具に伝導し、さらに器具本体に伝導して放熱する照明器具が知られている（例えば、特許文献１参照）。 In addition, it is necessary to secure a space for housing a power supply device and wiring-related members for supplying power to the light emitting element to control lighting, in the housing of the lighting device. However, there is an influence of heat generated from the light emitting element, and it is hardly affected by heat, and it is difficult to effectively secure a space.
2. Description of the Related Art Conventionally, there has been known a lighting fixture that conducts heat of an LED light source body to a light source body fixture in contact with the LED light source body, and further conducts heat to the fixture body to radiate heat (see, for example, Patent Document 1).

特開２００７−２７３２０９号公報JP 2007-273209 A

しかしながら、特許文献１に示されたものは、ＬＥＤ光源体の熱を光源体取付具を介して間接的に器具本体に伝導するものであり、また、ＬＥＤ光源体は、器具本体内に収容されているものではなく、電源装置や配線関係の部材を収容するスペースを有効に確保する点について何ら開示されていない。   However, the device disclosed in Patent Document 1 conducts the heat of the LED light source body indirectly to the instrument body via the light source body fixture, and the LED light source body is accommodated in the instrument body. However, it does not disclose anything about effectively securing a space for accommodating a power supply device or wiring-related members.

本発明は、上記のような状況に基づきなされたもので、発光素子から発生する熱を効果的に放熱して発光素子の温度上昇を抑制するとともに、部材収納スペースを有効に確保し得る照明装置を提供すること目的とする。   The present invention has been made based on the above situation, and effectively radiates the heat generated from the light emitting element to suppress the temperature rise of the light emitting element and can effectively secure a member storage space. The purpose is to provide.

請求項１に記載の照明装置は、熱伝導性を有する本体と；この本体内に収容され、発光素子を光源とする光源部と；前記本体の内周壁と光源部との間に介在され、本体の内周壁との間に部材収容スペースを形成するスペーサ部材と；前記光源部と本体の内周壁とを、前記部材収容スペースを通過して熱的に結合する熱伝導手段と；を具備することを特徴とする。   The illumination device according to claim 1 is a main body having thermal conductivity; a light source unit housed in the main body and having a light emitting element as a light source; and interposed between an inner peripheral wall of the main body and the light source unit, A spacer member that forms a member accommodating space between the inner peripheral wall of the main body; and a heat conducting means that thermally couples the light source unit and the inner peripheral wall of the main body through the member accommodating space. It is characterized by that.

熱伝導性を有する本体は、例えば、アルミニウム材料等の熱伝導が良好な材料で形成され、放熱フィン等が設けられて放熱面積が大きく、放熱効果が高くなるように構成されているものが好ましい。
発光素子とは、ＬＥＤや有機ＥＬ等の固体発光素子である。光源部は、発光素子を光源として用いるものであれば、その形態は、特段限定されるものではない。 The main body having thermal conductivity is preferably formed of a material having good thermal conductivity such as an aluminum material, and provided with a radiation fin or the like so as to have a large heat radiation area and a high heat radiation effect. .
A light emitting element is solid light emitting elements, such as LED and organic EL. If the light source part uses a light emitting element as a light source, the form will not be specifically limited.

スペーサ部材は、本体の内周壁を区画するものであり、その一面側には、例えば、光源部が取付けられる。部材収納スペースには、電源装置、電気部品やリード線等の配線関係の部材が配設される場合があるが、その配設される部材の種類等は、格別限定されるものではない。例えば、電源装置は、必ずしも部材収容スペースに配設する必要はない。電源装置を別置タイプとして構成することもできる。この場合、部材収容スペースは、主として配線関係の部材の配設に利用することができる。   The spacer member defines an inner peripheral wall of the main body, and, for example, a light source unit is attached to one surface side thereof. In the member storage space, there may be a case where wiring-related members such as a power supply device, electrical components, and lead wires are disposed, but the type of the disposed member is not particularly limited. For example, the power supply device is not necessarily arranged in the member accommodation space. The power supply device can be configured as a separate type. In this case, the member accommodation space can be used mainly for arranging wiring-related members.

熱伝導手段は、ヒートパイプを用いることが好適であるが、ヒートパイプに限定されるものではない。例えば、熱伝導性の高いアルミニウム合金材料等を用いてもよい。この熱伝導手段が、部材収容スペースを通過することにより、直接的に光源部の熱を筐体に伝導させることができる。
また、照明装置としては、屋内又は屋外で使用される各種照明器具に適用可能である。
請求項２に記載の照明装置は、請求項１に記載の照明装置において、前記熱伝導手段は、ヒートパイプであることを特徴とする。
この構成により、光源部から本体への熱伝達を速やかに、かつ効率的に行うことが可能となる。 The heat conducting means is preferably a heat pipe, but is not limited to a heat pipe. For example, an aluminum alloy material with high thermal conductivity may be used. When the heat conducting means passes through the member accommodation space, the heat of the light source unit can be directly conducted to the housing.
Moreover, as a illuminating device, it is applicable to the various lighting fixtures used indoors or outdoors.
The lighting device according to claim 2 is the lighting device according to claim 1, wherein the heat conducting means is a heat pipe.
With this configuration, heat transfer from the light source unit to the main body can be performed quickly and efficiently.

請求項１に記載の発明によれば、発光素子の温度上昇を効果的に抑制することができるとともに、部材収容スペースを有効に確保することが可能な照明装置を提供することができる。
請求項２に記載の発明によれば、請求項１に記載の発明の効果に加え、効率的な放熱が実現できる照明装置を提供することができる。 According to the first aspect of the present invention, it is possible to provide an illuminating device that can effectively suppress the temperature rise of the light emitting element and can effectively secure the member accommodation space.
According to invention of Claim 2, in addition to the effect of invention of Claim 1, the illuminating device which can implement | achieve efficient heat dissipation can be provided.

本発明の実施形態に係る照明装置を示す斜視図である。It is a perspective view which shows the illuminating device which concerns on embodiment of this invention. 同照明装置を分解して示す斜視図である。It is a perspective view which decomposes | disassembles and shows the same illuminating device. 同照明装置において前面カバーを取外して示す平面図である。It is a top view which removes and shows a front cover in the illumination device. 図３中、Ｘ−Ｘ線に沿って切断して示す断面図である。It is sectional drawing cut | disconnected and shown along the XX line in FIG. 光源ユニットを示す斜視図である。It is a perspective view which shows a light source unit. 光源ユニットを分解して背面側から見て示す斜視図である。It is a perspective view which decomposes | disassembles and shows a light source unit seeing from the back side. 光源ユニットを示す断面図である。It is sectional drawing which shows a light source unit. 光源ユニットを組み合わせた一例を示す斜視図である。It is a perspective view which shows an example which combined the light source unit. 同じく、光源ユニットを組み合わせた一例を示す側面図である。Similarly, it is a side view which shows an example which combined the light source unit.

以下、本発明の実施形態について図１乃至図９を参照して説明する。図１乃至図４は、照明装置として夜の景観を演出するライトアップ等を行うのに適する投光器を示し、図５乃至図９は、照明装置に組み込まれる光源ユニットを示している。   Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 9. FIGS. 1 to 4 show a floodlight suitable for performing lighting up or the like that produces a night scene as the lighting device, and FIGS. 5 to 9 show a light source unit incorporated in the lighting device.

図１乃至図３においては、２台の投光器１０が並設されて組となった形態を示している。図２は、２台のうち、１台を分解して示しており、図２に代表して示すように、投光器１０は、本体として箱状の筐体１１と、この筐体１１内に収容された光源部１２と、筐体１１と光源部１２との間に介在されたスペーサ部材１３と、透光性の前面カバー１４とを備えている。   In FIG. 1 thru | or FIG. 3, the form with which the two light projectors 10 were arranged in parallel and the group was shown. FIG. 2 shows one of the two units disassembled. As representatively shown in FIG. 2, the projector 10 includes a box-shaped casing 11 as a main body and the casing 11 accommodated in the casing 11. The light source unit 12, the spacer member 13 interposed between the housing 11 and the light source unit 12, and a translucent front cover 14 are provided.

筐体１１は、アルミニウム合金製のダイカストで形成されて熱伝導が良好で、前面側に開口部１１ａを有し、側壁外周に複数の放熱フィンが設けられている。この筐体１１内には、筐体１１より深さ寸法が小さく、アルミニウム等の材料から形成された箱状のスペーサ部材１３が収納されて取付けられるようになっている。   The casing 11 is made of aluminum alloy die casting, has good heat conduction, has an opening 11a on the front side, and is provided with a plurality of radiating fins on the outer periphery of the side wall. A box-shaped spacer member 13 having a depth dimension smaller than that of the casing 11 and made of a material such as aluminum is housed and attached in the casing 11.

光源部１２は、後述する光源ユニット１が複数組合わされて構成されており、具体的には、１６個の光源ユニット１が組合わされている。この光源部１２は、スペーサ部材１３を介して筐体１１内に収容されるようになっている。またスペーサ部材１３の背面側には、光源部１２に電力を供給する電源装置１７が取付けられている。   The light source unit 12 is configured by combining a plurality of light source units 1 described later. Specifically, 16 light source units 1 are combined. The light source unit 12 is accommodated in the housing 11 via the spacer member 13. A power supply device 17 that supplies power to the light source unit 12 is attached to the back surface side of the spacer member 13.

図３に示すように、ひとつの光源ユニット１は、上面側から見た場合、直角三角形の角部をカットした形態をなしていて、これらが組合わされて限られた面積内において、全体の照射面積が広くなるように効率的に配置されている。   As shown in FIG. 3, when viewed from the upper surface side, one light source unit 1 has a shape in which corners of a right triangle are cut, and these are combined to irradiate the entire area within a limited area. It is efficiently arranged so as to increase the area.

筐体１１の開口部１１ａには、外周を化粧枠で保持され前面側に膨らんだ形状をなした透光性の前面カバー１４がパッキンを介して装着されている。この前面カバー１４は、ポリカーボネートやガラスの材料によって構成できる。   A translucent front cover 14 having an outer periphery held by a decorative frame and swelled to the front side is attached to the opening 11a of the housing 11 via a packing. The front cover 14 can be made of a polycarbonate or glass material.

このように構成された投光器１０が２台取付台１５に取付けられている。取付台１５は、ベース板１５ａと、このベース板１５ａの両側に設けられた支持部材１５ｂとからなり、投光器１０は、支持部材１５ｂにねじ等の固定手段によって固定されるようになっている。また、ベース板１５ａには、コ字状のアーム１６を取付けるための取付部材が背面側に延出して形成されており、この取付部材にアーム１６が取付けられている。これによって、筐体１１は、仰角が変更可能、すなわち、光の照射方向が可変できるようにアーム１６に回転可能に支持される。   The two projectors 10 configured in this way are attached to two mounting bases 15. The mount 15 includes a base plate 15a and support members 15b provided on both sides of the base plate 15a, and the projector 10 is fixed to the support member 15b by fixing means such as screws. In addition, an attachment member for attaching the U-shaped arm 16 is formed on the base plate 15a so as to extend to the back side, and the arm 16 is attached to this attachment member. Thus, the casing 11 is rotatably supported by the arm 16 so that the elevation angle can be changed, that is, the light irradiation direction can be changed.

また、筐体１１の底面側からは、図示しないケーブルグランドを介して電源線が導出されている。電源線は、光源部１２に電力を供給するため電源装置１７に接続されている。   A power line is led out from the bottom surface side of the housing 11 through a cable gland (not shown). The power supply line is connected to the power supply device 17 to supply power to the light source unit 12.

このように構成された投光器１０は、アーム１６を例えば、構造物等に取付けて設置し、照射方向を対象物に向けて調整し、電源を投入して使用される。これにより、光源部１２から出射される光は、前面カバー１４を透過して対象物に照射される。   The projector 10 configured as described above is used by installing the arm 16 on, for example, a structure or the like, adjusting the irradiation direction toward the object, and turning on the power. Thereby, the light emitted from the light source unit 12 passes through the front cover 14 and is irradiated onto the object.

次に、図４を参照して筐体１１内の構成について説明する。筐体１１の内周壁は、箱状に形成されており、この筐体１１内には、スペーサ部材１３の外周縁部が筐体１１の開口部１１ａの縁に載置されるようにして取付ねじによって固定されている。このスペーサ部材１３の底壁には、光源部１２が設けられており、すなわち、複数の光源ユニット１が背面側からねじ止め等によって取付けられている。   Next, the configuration in the housing 11 will be described with reference to FIG. The inner peripheral wall of the casing 11 is formed in a box shape, and the outer peripheral edge of the spacer member 13 is mounted in the casing 11 so as to be placed on the edge of the opening 11 a of the casing 11. It is fixed with screws. A light source section 12 is provided on the bottom wall of the spacer member 13, that is, a plurality of light source units 1 are attached from the back side by screws or the like.

このスペーサ部材１３は、前述のように筐体１１の内周壁より深さ寸法が小さく、したがって、スペーサ部材１３は、筐体１１の内周壁と光源部１２との間に介在し、筐体１１の内周壁を区画し、筐体１１の底壁側の内周壁との間に部材収容スペース１８を形成している。この部材収容スペース１８には、スペーサ部材１３の背面側に取付けられた電源装置１７が配設されるようになっている。また、図示しないリード線等の配線関係の部材が配設されている。   As described above, the spacer member 13 is smaller in depth than the inner peripheral wall of the casing 11, and therefore, the spacer member 13 is interposed between the inner peripheral wall of the casing 11 and the light source unit 12, and the casing 11 A member accommodating space 18 is formed between the inner peripheral wall of the housing 11 and the inner peripheral wall on the bottom wall side of the housing 11. In the member accommodating space 18, a power supply device 17 attached to the back side of the spacer member 13 is arranged. Further, wiring-related members such as lead wires (not shown) are provided.

また、詳細を後述する各光源ユニット１の背面側には、アルミニウム等の熱伝導良好な受熱部材６が配設されている。そして、この受熱部材６と筐体１１の底壁との間には、熱伝達手段として棒状のヒートパイプ７が設けられている。具体的には、ヒートパイプ７は、受熱部材６に形成された嵌合穴６ａに嵌合され、また、筐体１１の底壁に形成された嵌合穴１１ｂに嵌合されて、これら嵌合穴６ａ、１１ｂと熱的に接触するようになっている。   Further, a heat receiving member 6 having good heat conductivity such as aluminum is disposed on the back side of each light source unit 1 described in detail later. A rod-shaped heat pipe 7 is provided between the heat receiving member 6 and the bottom wall of the housing 11 as heat transfer means. Specifically, the heat pipe 7 is fitted into a fitting hole 6 a formed in the heat receiving member 6 and fitted into a fitting hole 11 b formed in the bottom wall of the housing 11. The contact holes 6a and 11b are in thermal contact with each other.

したがって、ヒートパイプ７は、受熱部材６の嵌合穴６ａ側からスペーサ部材１３に形成された貫通孔１３ａを通り、部材収容スペース１８を通過して、筐体１１の底壁の嵌合穴１１ｂ側に至るようになっている。なお、ヒートパイプ７は、スペーサ部材１３に接触することなく筐体１１の嵌合穴１１ｂに取付けられることが好ましいが、接触する場合であってもよい。   Therefore, the heat pipe 7 passes from the fitting hole 6 a side of the heat receiving member 6 through the through hole 13 a formed in the spacer member 13, passes through the member accommodating space 18, and is fitted into the fitting hole 11 b in the bottom wall of the housing 11. To the side. In addition, although it is preferable that the heat pipe 7 is attached to the fitting hole 11b of the housing | casing 11 without contacting the spacer member 13, the case where it contacts may be sufficient.

ヒートパイプ７は、内部に作動液が封入されており、この作動液の蒸発及び凝縮の相変化のサイクルで熱を輸送するものである。高温側で暖められた流体は、蒸発し低温側へ移動して凝縮される。凝縮された流体は、毛細管作用によって高温側へ戻る。このサイクルで高温側から低温側へ熱を移動できるものである。   The heat pipe 7 has a working fluid sealed therein, and transports heat in a cycle of phase change of evaporation and condensation of the working fluid. The fluid warmed on the high temperature side evaporates, moves to the low temperature side, and is condensed. The condensed fluid returns to the high temperature side by capillary action. In this cycle, heat can be transferred from the high temperature side to the low temperature side.

続いて、光源ユニット１について図５乃至図９を参照して説明する。光源ユニット１は、反射体２と、基板取付け部材３と、基板４と、この基板４に実装された発光素子５とを備えている。   Next, the light source unit 1 will be described with reference to FIGS. The light source unit 1 includes a reflector 2, a substrate mounting member 3, a substrate 4, and a light emitting element 5 mounted on the substrate 4.

反射体２は、ＰＢＴ（ポリブチレンテレフタレート）等の合成樹脂材料で形成されており、表面にアルミ蒸着された反射面２１を有している。反射面２１は、照射開口部２２を有し、この照射開口部２２に向かって拡開する曲面の一部によって形成されており、例えば、放物線を半回転させた回転放物面として構成されている。したがって、平面視においては、照射開口部２２が形成する外形は、半円形状となっている。そして、この半円形状の直線部、つまり、反射面２１が最大に拡開した照射開口部２２の端部２２ａ間には、補強部２３が形成されている。補強部２３は、照射開口部２２の端部２２ａ間を繋ぐように側面がＬ字状（主として図７参照）であって、桟状に形成されるものであり、反射面２１の変形を抑制する機能を有している。   The reflector 2 is made of a synthetic resin material such as PBT (polybutylene terephthalate), and has a reflecting surface 21 on which aluminum is deposited. The reflection surface 21 has an irradiation opening 22 and is formed by a part of a curved surface that expands toward the irradiation opening 22. For example, the reflection surface 21 is configured as a rotating paraboloid that is a semi-rotated parabola. Yes. Therefore, in plan view, the outer shape formed by the irradiation opening 22 is a semicircular shape. A reinforcing portion 23 is formed between the semicircular straight portions, that is, between the end portions 22a of the irradiation opening portion 22 where the reflecting surface 21 is expanded to the maximum. The reinforcing portion 23 has an L-shaped side surface (mainly see FIG. 7) so as to connect the end portions 22 a of the irradiation opening portion 22, and is formed in a bar shape to suppress deformation of the reflecting surface 21. It has a function to do.

また、図６に示すように、反射面２１と対向する側面側には、開口窓２４が形成されている。開口窓２４は、略長方形状に形成されているが、その開口部分２４ａは反射面２１の側面形状に従い略椀状に形成されている。一方、開口窓２４の両側には、基板取付け部材３の受部２４ｂが形成されており、受部２４ｂには、正面側から固定手段である取付ねじＳが貫通するねじ貫通孔が形成されている。   Further, as shown in FIG. 6, an opening window 24 is formed on the side surface facing the reflecting surface 21. The opening window 24 is formed in a substantially rectangular shape, but the opening portion 24 a is formed in a substantially bowl shape according to the side surface shape of the reflecting surface 21. On the other hand, receiving portions 24b of the board mounting member 3 are formed on both sides of the opening window 24, and screw receiving holes through which mounting screws S as fixing means pass from the front side are formed in the receiving portion 24b. Yes.

基板取付け部材３は、アルミニウム等の熱伝導が良好な金属製であり、開口窓２４の内周側に嵌合するように開口窓２４と同様に略長方形状の外形に形成されている。中央部には、基板４が対向配置される開口３１が形成され、上下の長辺部には、ガイド片３２が折曲して形成されている。また、開口３１から連続して略直角に折曲され反射面２１方向へ向かう遮光部３３が一体に形成されている(図５等参照)。この遮光部３３は、平面視、半円形状に形成されていて、反射面２１の照射開口部２２が形成する半円形状と同心円状をなしている。したがって、漏れ光を遮光する調整がしやすい利点を有する。   The board mounting member 3 is made of a metal having good heat conduction, such as aluminum, and is formed in a substantially rectangular outer shape like the opening window 24 so as to be fitted to the inner peripheral side of the opening window 24. An opening 31 on which the substrate 4 is disposed is formed at the center, and guide pieces 32 are bent at the upper and lower long sides. Further, a light shielding portion 33 that is continuously bent from the opening 31 at a substantially right angle and directed toward the reflecting surface 21 is integrally formed (see FIG. 5 and the like). The light shielding portion 33 is formed in a semicircular shape in plan view, and is concentric with the semicircular shape formed by the irradiation opening 22 of the reflecting surface 21. Therefore, there is an advantage that it is easy to adjust to block the leaked light.

基板４は、絶縁材であるガラスエポキシ樹脂の矩形状の平板からなり、表面側には銅箔で形成された配線パターンが施されている。なお、基板４の材料は、絶縁材とする場合には、セラミックス材料又は他の合成樹脂材料を適用できる。また、アルミニウム等の熱伝導性が良好で放熱性に優れたべース板の一面に絶縁層が積層された金属製のべース基板を適用することができる。   The board | substrate 4 consists of a rectangular flat plate of the glass epoxy resin which is an insulating material, and the wiring pattern formed with the copper foil is given to the surface side. The material of the substrate 4 can be a ceramic material or other synthetic resin material when an insulating material is used. Further, a metal base substrate in which an insulating layer is laminated on one surface of a base plate having good thermal conductivity and excellent heat dissipation, such as aluminum, can be applied.

基板４の表面側には、発光素子５がホルダ５１を介して実装されている。発光素子５は、表面実装型のＬＥＤパッケージであり、概略的にはセラミックスで形成された本体に配設されたＬＥＤチップと、このＬＥＤチップを封止するエポキシ系樹脂やシリコーン樹脂等のモールド用の透光性樹脂とから構成されている。ＬＥＤチップは、青色光を発光する青色のＬＥＤチップである。モールド用の透光性樹脂は、ＬＥＤチップの発光を吸収して黄色系の光を発生する蛍光体を含有しており、ＬＥＤチップから出射される光は、ＬＥＤパッケージの透光性樹脂を経て白色や電球色等の白色系の発光色となって外部へ放射されるようになっている。なお、ＬＥＤは、チップ・オン・ボード方式で直接基板４に実装するようにしてもよく、実装方式は、格別限定されるものではない。   On the surface side of the substrate 4, the light emitting element 5 is mounted via a holder 51. The light-emitting element 5 is a surface-mount type LED package, which is roughly used for molding an LED chip disposed in a main body formed of ceramics, and an epoxy resin or a silicone resin that seals the LED chip. And a translucent resin. The LED chip is a blue LED chip that emits blue light. The translucent resin for molding contains a phosphor that absorbs light emitted from the LED chip and generates yellow light, and the light emitted from the LED chip passes through the translucent resin of the LED package. It is emitted in the form of white light-emitting colors such as white and light bulb. Note that the LED may be directly mounted on the substrate 4 by a chip-on-board method, and the mounting method is not particularly limited.

このように発光素子５が実装された基板４は、基板取付け部材３の開口３１に対向するように取付けられる。また、基板４が取付けられた基板取付け部材３は、反射体２の開口窓２４に位置決めされて取付けられる。この場合、基板取付け部材３の外形は、開口窓２４の内周側に嵌合するように形成されており、基板取付け部材３のガイド片３２が開口窓２４に案内され、さらに、基板取付け部材３の前面側が開口窓２４の受部２４ｂに当接されて位置決めされて配置される。その後、正面側から取付ねじＳによってねじ止めされて取付けられる。
したがって、基板取付け部材３は、規定された位置に精度よく、容易に配置され、反射面２１の焦点に発光素子５が配置されるようになる。 Thus, the substrate 4 on which the light emitting element 5 is mounted is attached so as to face the opening 31 of the substrate attachment member 3. The substrate attachment member 3 to which the substrate 4 is attached is positioned and attached to the opening window 24 of the reflector 2. In this case, the outer shape of the board mounting member 3 is formed so as to be fitted to the inner peripheral side of the opening window 24, the guide piece 32 of the board mounting member 3 is guided to the opening window 24, and the board mounting member 3 is placed in contact with the receiving portion 24b of the opening window 24 and positioned. After that, it is attached by being screwed with a mounting screw S from the front side.
Therefore, the board mounting member 3 is easily and accurately arranged at a specified position, and the light emitting element 5 is arranged at the focal point of the reflecting surface 21.

以上のように構成された光源ユニット１において、図７に示すように、反射面２１は、側面側を中心線Ｃとして放物線を半回転させた回転放物面として形成されている。そして、側壁としての基板取付け部材３に取付けられた基板４上の発光素子５は、反射面２１に包囲されるように対向しており、発光素子５は、反射面２１の放物面の焦点に配置されるようになっている。また、遮光部３３は、その先端部と発光素子５とを結ぶ延長線Ｌが反射面２１における照射開口部２２の開口端より少しばかり下方に位置するように配設されている。   In the light source unit 1 configured as described above, as shown in FIG. 7, the reflecting surface 21 is formed as a rotating paraboloid obtained by half-rotating the parabola around the side surface as the center line C. The light emitting element 5 on the substrate 4 attached to the substrate attachment member 3 as a side wall is opposed so as to be surrounded by the reflecting surface 21, and the light emitting element 5 is focused on the parabolic surface of the reflecting surface 21. It is supposed to be arranged in. Further, the light shielding portion 33 is disposed so that the extension line L connecting the tip portion and the light emitting element 5 is located slightly below the opening end of the irradiation opening portion 22 in the reflection surface 21.

次に、図６に示すように、光源ユニット１の背面側には、前述した受熱部材６及びこの受熱部材６に結合されるヒートパイプ７が配設されるようになっている。受熱部材６は、略長方形状をなし、基板４の背面側に密着するように取付けられている。また、その厚み方向の寸法内において嵌合穴６ａが形成され、この嵌合穴６ａにヒートパイプ７が嵌合されている。   Next, as shown in FIG. 6, the heat receiving member 6 and the heat pipe 7 coupled to the heat receiving member 6 are arranged on the back side of the light source unit 1. The heat receiving member 6 has a substantially rectangular shape and is attached to be in close contact with the back side of the substrate 4. Further, a fitting hole 6a is formed within the dimension in the thickness direction, and the heat pipe 7 is fitted into the fitting hole 6a.

基本的には、各光源ユニット１に対して、それぞれヒートパイプ７が配設されるが、図８及び図９に示すように、光源ユニット１の背面同士が相対するように組み合わされる２つの光源ユニット１の部分においては、受熱部材６が双方の背面側で挟持された状態で固定されるようになっている。したがって、１つの受熱部材６が２つの光源ユニット１の受熱機能を果たしており、ヒートパイプ７も１つのヒートパイプ７が２つの光源ユニット１の熱伝達を行うようになっている。このように、１つのヒートパイプ７が複数の光源ユニット１の熱伝達を兼用するように構成されている。   Basically, a heat pipe 7 is provided for each light source unit 1, but as shown in FIGS. 8 and 9, two light sources combined so that the back surfaces of the light source units 1 face each other. In the unit 1 portion, the heat receiving member 6 is fixed in a state of being sandwiched between both back sides. Therefore, one heat receiving member 6 fulfills the heat receiving function of the two light source units 1, and the heat pipe 7 also allows the one heat pipe 7 to transfer heat between the two light source units 1. In this way, one heat pipe 7 is configured so as to share heat transfer between the plurality of light source units 1.

次に、本実施形態の作用を説明する。電源を投入し、基板４を介して発光素子５に通電すると、発光素子５が発光し、その光は、図７に示すように、主として反射面２１によって反射され、照射開口部２２の方向Ａへ向かって放射される。ここで、発光素子５は、反射面２１の焦点に配置されているので、照射開口部２２の方向へ向かう光は、不用意にビームの開きが大きくなったり、拡散したりすることなく、平行光線となって放射されるようになる。したがって、対象物へスポットをあてて有効に光を照射することが可能となり、また、所期の配光設計の容易化が実現できる。   Next, the operation of this embodiment will be described. When the power is turned on and the light emitting element 5 is energized through the substrate 4, the light emitting element 5 emits light, and the light is reflected mainly by the reflecting surface 21 as shown in FIG. Radiated toward Here, since the light emitting element 5 is disposed at the focal point of the reflecting surface 21, the light traveling toward the irradiation opening 22 is parallel without causing an unintentionally large beam spread or diffusion. It will be emitted as light rays. Therefore, it is possible to irradiate light effectively by applying a spot to the object, and it is possible to facilitate the intended light distribution design.

また、反射体２は、合成樹脂材料で形成されているので、反射面２１が変形し、発光素子から出射される光を対象物へ有効に照射できなくなる虞があるが、補強部２３が形成されているので、これにより反射面２１の変形を抑制することができ、光を対象物へ有効に照射する機能を維持することができる。   In addition, since the reflector 2 is made of a synthetic resin material, the reflecting surface 21 may be deformed and light emitted from the light emitting element may not be effectively irradiated onto the object, but the reinforcing portion 23 is formed. Thus, the deformation of the reflecting surface 21 can be suppressed, and the function of effectively irradiating the object with light can be maintained.

さらに、遮光部３３は、その先端部と発光素子５とを結ぶ延長線Ｌが照射開口部２２の開口端より下方に位置するように配設されているので、反射面２１によって反射される有効な光Ａをほとんど遮ることなく、発光素子５から出射される光のうち、反射面２１に反射されない不必要な直接光は、遮光部３３によって遮られ漏れ光として外部に放射されるのを確実に抑制することができる。   Further, since the light shielding portion 33 is disposed so that the extension line L connecting the tip portion and the light emitting element 5 is positioned below the opening end of the irradiation opening portion 22, the light shielding portion 33 is effectively reflected by the reflecting surface 21. Of the light emitted from the light emitting element 5, the direct light that is not reflected by the reflecting surface 21 is shielded by the light shielding portion 33 and is radiated to the outside as leakage light. Can be suppressed.

また、発光素子５の発光中は、発光素子５から熱が発生するが、この熱は、基板４の背面側から受熱部材６を経てヒートパイプ７に伝導される。ヒートパイプ７に伝導された熱は、作動液の蒸発及び凝縮の相変化のサイクルで直接的にヒートシンクとして作用する放熱面積の大きな筐体１１へと速やかに伝達される。これによって筐体１１から効果的に放熱が行われる。したがって、発光素子５の温度上昇の抑制が促進される。   While the light emitting element 5 emits light, heat is generated from the light emitting element 5, and this heat is conducted from the back side of the substrate 4 to the heat pipe 7 through the heat receiving member 6. The heat conducted to the heat pipe 7 is quickly transferred to the casing 11 having a large heat radiation area that directly acts as a heat sink in the cycle of phase change of evaporation and condensation of the hydraulic fluid. This effectively dissipates heat from the housing 11. Therefore, suppression of the temperature rise of the light emitting element 5 is promoted.

さらに、このような光源部１２からの熱伝達、筐体１への効果的な放熱によって、光源部１２に隣接する部材収容スペース１８の温度上昇を抑制することができ、部材収容スペース１８を有効に確保することができる。例えば、部材収納スペース１８に配設された電源装置１７や配線関係の部材への熱的影響を軽減できる。   Further, the heat transfer from the light source unit 12 and the effective heat dissipation to the housing 1 can suppress the temperature rise of the member storage space 18 adjacent to the light source unit 12, and the member storage space 18 is effective. Can be secured. For example, it is possible to reduce the thermal influence on the power supply device 17 and wiring-related members disposed in the member storage space 18.

したがって、光源部１２の近くに電源装置１７等を配設することが可能になり、この場合、部材収容スペース１８を小さくできるとともに筐体１１のコンパクト化が実現でき、また、配線長を短くすることが可能となる。   Accordingly, the power supply device 17 and the like can be disposed near the light source unit 12. In this case, the member housing space 18 can be reduced, the housing 11 can be made compact, and the wiring length can be shortened. It becomes possible.

以上のように本実施形態によれば、発光素子５の温度上昇を抑制することができるとともに、発光素子５から発生する熱をヒートパイプ７によって直接的に筐体１１へ伝達し放熱するようにしたので、部材収容スペース１８を有効に確保することが可能となる。   As described above, according to the present embodiment, the temperature rise of the light emitting element 5 can be suppressed, and the heat generated from the light emitting element 5 can be directly transmitted to the housing 11 by the heat pipe 7 and radiated. Therefore, the member accommodation space 18 can be effectively secured.

なお、本発明は、上記実施形態の構成に限定されることなく、発明の要旨を逸脱しない範囲で種々の変形が可能である。例えば、上記実施形態では、電源装置をスペーサ部材の背面側に取付ける場合について説明したが、電源装置は、筐体側に取付けるようにしてもよい。さらに、電源装置は、必ずしも部材収容スペースに配設する必要はない。電源装置を別置タイプとして構成することもできる。この場合、部材収容スペースは、主として配線関係の部材の配設に利用される。   In addition, this invention is not limited to the structure of the said embodiment, A various deformation | transformation is possible in the range which does not deviate from the summary of invention. For example, although the case where the power supply device is attached to the back side of the spacer member has been described in the above embodiment, the power supply device may be attached to the housing side. Furthermore, the power supply device is not necessarily arranged in the member accommodation space. The power supply device can be configured as a separate type. In this case, the member accommodation space is mainly used for arranging wiring-related members.

また、光源部は、上記実施形態で示した光源ユニットを用いる場合に限定されるものではない。発光素子を光源として用いるものであれば、格別その形態は限定されない。加えて、熱伝導手段は、ヒートパイプを用いることが効率的な面から好適であるが、ヒートパイプに限定されるものではない。例えば、熱伝導性の高いアルミニウム合金材料等を用いてもよい。
さらに、照明装置としては、屋内又は屋外で使用される各種照明器具に適用可能である。 Further, the light source section is not limited to the case where the light source unit shown in the above embodiment is used. As long as the light emitting element is used as a light source, the form is not particularly limited. In addition, the heat conduction means is preferably a heat pipe from the viewpoint of efficiency, but is not limited to the heat pipe. For example, an aluminum alloy material with high thermal conductivity may be used.
Furthermore, the lighting device can be applied to various lighting fixtures used indoors or outdoors.

１・・・光源ユニット、２・・・反射体、３・・・基板取付け部材、
５・・・発光素子（ＬＥＤ）、７・・・熱伝導手段（ヒートパイプ）、
１０・・・照明装置（投光器）、１１・・・本体（筐体）、１２・・・光源部、
１３・・・スペーサ部材、１８・・・部材収容スペース、２１・・・反射面、 DESCRIPTION OF SYMBOLS 1 ... Light source unit, 2 ... Reflector, 3 ... Board attachment member,
5 ... Light emitting element (LED), 7 ... Heat conduction means (heat pipe),
DESCRIPTION OF SYMBOLS 10 ... Illuminating device (projector), 11 ... Main body (casing), 12 ... Light source part,
13 ... Spacer member, 18 ... Member housing space, 21 ... Reflecting surface,

Claims (2)

熱伝導性を有する本体と；
この本体内に収容され、発光素子を光源とする光源部と；
前記本体の内周壁と光源部との間に介在され、本体の内周壁との間に部材収容スペースを形成するスペーサ部材と；
前記光源部と本体の内周壁とを、前記部材収容スペースを通過して熱的に結合する熱伝導手段と；
を具備することを特徴とする照明装置。 A body having thermal conductivity;
A light source unit housed in the main body and having a light emitting element as a light source;
A spacer member interposed between the inner peripheral wall of the main body and the light source part and forming a member receiving space between the inner peripheral wall of the main body;
Heat conduction means for thermally coupling the light source part and the inner peripheral wall of the main body through the member housing space;
An illumination device comprising: 前記熱伝導手段は、ヒートパイプであることを特徴とする請求項１に記載の照明装置。   The lighting device according to claim 1, wherein the heat conducting means is a heat pipe.
JP2010039213A 2010-02-24 2010-02-24 Lighting equipment Pending JP2011175868A (en)

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