JP4693152B2 - Light emitting diode - Google Patents

Light emitting diode Download PDF

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JP4693152B2
JP4693152B2 JP2005130622A JP2005130622A JP4693152B2 JP 4693152 B2 JP4693152 B2 JP 4693152B2 JP 2005130622 A JP2005130622 A JP 2005130622A JP 2005130622 A JP2005130622 A JP 2005130622A JP 4693152 B2 JP4693152 B2 JP 4693152B2
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light
base substrate
emitting diode
light emitting
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貞人 今井
正芳 金森
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Citizen Electronics Co Ltd
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Description

本発明は、基板上に複数個のLEDチップを実装してLEDアレイとした光源に係わり、詳しくは、リフレクターと組合せた高出力用途の発光ダイオードに関する。   The present invention relates to a light source in which a plurality of LED chips are mounted on a substrate to form an LED array. More specifically, the present invention relates to a light-emitting diode for high output use in combination with a reflector.

従来のLEDアレイを光源とする照明で、特に車両用灯具としては、LED光源からの光をリフレクターにより前方に向けて反射させるように構成されている。(例えば、特許文献1参照)
特開2004−342574号(第4頁、図1、図2、図3)
With illumination using a conventional LED array as a light source, particularly as a vehicular lamp, light from the LED light source is configured to be reflected forward by a reflector. (For example, see Patent Document 1)
JP 2004-342574 (4th page, FIG. 1, FIG. 2, FIG. 3)

上記した特許文献1に開示されている車両用灯具は、図5に示すように、光源11と反射面(リフレクター)12とレンズ13とから構成されている。光源11の構成は、図6に示すように、略四角柱状に形成された光源ホルダ(ベース基材)14の四面の側面14aのそれぞれに設けられたLEDアレイ15で構成されている。ここで前記光源ホルダ14は、略四角柱状に形成され、その軸方向は車両用灯具の光軸Xと略一致して設けられている。前記光源ホルダ14のそれぞれの側面14aも同様に軸方向を光軸Xと平行とされている。そして、前記LEDアレイ15は図7に示すように、複数のLEDチップ16を直線状にプリント基板上に並べて前記光源ホルダ14の側面14aに取付けたものである。LEDチップ16を整列させる方向は光源ホルダ14の側面14aの軸方向、即ち、車両用灯具の光軸X方向に沿うものである。   As shown in FIG. 5, the vehicular lamp disclosed in Patent Document 1 described above includes a light source 11, a reflecting surface (reflector) 12, and a lens 13. As shown in FIG. 6, the light source 11 is composed of LED arrays 15 provided on each of the four side surfaces 14a of a light source holder (base substrate) 14 formed in a substantially quadrangular prism shape. Here, the light source holder 14 is formed in a substantially quadrangular prism shape, and its axial direction is provided so as to substantially coincide with the optical axis X of the vehicular lamp. Similarly, each side surface 14a of the light source holder 14 has an axial direction parallel to the optical axis X. As shown in FIG. 7, the LED array 15 has a plurality of LED chips 16 arranged in a straight line on a printed board and attached to the side surface 14a of the light source holder 14. The direction in which the LED chips 16 are aligned is along the axial direction of the side surface 14a of the light source holder 14, that is, the optical axis X direction of the vehicular lamp.

このように、複数のLEDチップ16によりLEDアレイ化されたことにより、同じ面積でも多くのLEDチップ16を配置することが可能となり光量が増加できる。前記光源ホルダ14の側面14aの数だけLEDアレイ15を設けることができるので、更に、光量の増加が可能となる。   As described above, since the LED array is made up of the plurality of LED chips 16, a large number of LED chips 16 can be arranged even in the same area, and the amount of light can be increased. Since the LED arrays 15 can be provided as many as the number of the side surfaces 14a of the light source holder 14, the amount of light can be further increased.

しかし、高出力用途であるため、大電流駆動(点灯)が必要となる。大電流を印加することにより駆動電流に伴い熱が増加するため、LEDチップが実装されている光源ホルダには、一般に熱伝導率の高い銅又はアルミ材を用いて放熱させている。   However, since it is a high output application, a large current drive (lighting) is required. Since heat increases with driving current by applying a large current, the light source holder on which the LED chip is mounted is generally dissipated using copper or aluminum material having high thermal conductivity.

解決しようとする問題点は、上記した特許文献1に開示されているLEDチップを使用した車両用灯具は、LEDチップが実装されている光源ホルダの先端端面がフラットなため、ライトの中心部が暗くなってしまう。また、リフレクターの光学設計上からみると、光源ホルダは可能な限り細い方が点光源と考えられ、細くすることが望ましいが、そのため放熱に十分な面積を確保することはできない。などの問題があった。   The problem to be solved is that the vehicular lamp using the LED chip disclosed in Patent Document 1 described above has a flat front end surface of the light source holder on which the LED chip is mounted. It will be dark. Further, from the viewpoint of the optical design of the reflector, it is considered that the light source holder is as thin as possible as a point light source, and it is desirable to make it thin, but it is not possible to secure a sufficient area for heat dissipation. There were problems such as.

本発明は、上述の欠点を解消するもので、その目的は、光源からの光のムラを低減すると同時に、放熱面積を拡大して放熱性が向上する。駆動時の熱を低減することが可能な発光ダイオードを提供するものである。   The present invention eliminates the above-mentioned drawbacks, and its object is to reduce unevenness of light from the light source, and at the same time to expand the heat dissipation area and improve the heat dissipation. Provided is a light emitting diode capable of reducing heat during driving.

上記目的を達成するために、本発明における発光ダイオードは、プリント基板に複数個のLEDチップを列状に実装したLEDアレイを、多角柱状をした金属部材よりなるベース基材の側面に搭載した光源と、内側に反射面を有するリフレクターの中心軸と前記ベース基材の軸とが一致するように組合せた発光ダイオードにおいて、前記ベース基材のそれぞれの側面であって前記側面の軸線に沿う方向に直線状に複数のLEDアレイを設け、且つ、前記ベース基材の先端端面内に光沢メッキが施された反射・放熱体を一体的に配設して放熱する表面積を拡大すると共に、前記リフレクターの反射面よりの反射光を反射するようにしたことを特徴とする。
In order to achieve the above object, a light-emitting diode according to the present invention includes a light source in which an LED array in which a plurality of LED chips are mounted in a row on a printed board is mounted on a side surface of a base substrate made of a metal member having a polygonal column shape. And a light emitting diode that is combined so that the central axis of the reflector having a reflection surface on the inner side and the axis of the base substrate coincide with each other in the direction along the axis of each side surface of the base substrate A plurality of LED arrays are provided in a straight line, and a reflective / heat-dissipating body with a gloss plating is provided in the tip end face of the base substrate to increase the surface area for heat dissipation, and the reflector The reflected light from the reflection surface is reflected .

また、前記反射・放熱体は前記ベース基材とは別体であり、その形状は、半球、楕円球、円錐、多角錐などのキャップ状、若しくは、櫛形などの放熱フインのいずれかであることを特徴とするものである。   Further, the reflection / radiation body is separate from the base substrate, and the shape thereof is either a cap shape such as a hemisphere, an elliptical sphere, a cone or a polygonal pyramid, or a heat radiation fin such as a comb shape. It is characterized by.

また、前記ベース基材は銅又はアルミであることを特徴とする請求項1または2記載の発光ダイオード。


Moreover, the base substrate according to claim 1 or 2, wherein the light-emitting diodes, characterized in that copper or aluminum.


本発明の発光ダイオードは、ベース基材の先端端面に形成した反射・放熱体により、リフレクターの反射光が反射・放熱体の先端で反射し、光の取出し効率を高め、光のムラが低減できる。また、ベース基材の先端端面に反射・放熱体を設けることにより、放熱する表面積が拡大され放熱性が向上するため、駆動時の熱が低下でき、LEDチップの寿命も向上することができるなど、信頼性に優れた発光ダイオードを提供することが可能である。   In the light-emitting diode of the present invention, the reflection / radiation body formed on the end face of the base substrate reflects the reflected light of the reflector at the tip of the reflection / radiation body, thereby improving the light extraction efficiency and reducing light unevenness. . In addition, by providing a reflective / heat-dissipating body on the end face of the base substrate, the surface area for heat dissipation is increased and heat dissipation is improved, so that the heat during driving can be reduced and the life of the LED chip can be improved. It is possible to provide a light-emitting diode with excellent reliability.

本発明の発光ダイオードについて、図面に基づいて説明する。   The light emitting diode of the present invention will be described with reference to the drawings.

図1〜図3は、本発明の実施例に係わり、図1は、発光ダイオードの断面図、図2は、図1のベース基板にLEDアレイを搭載した状態の正面図、図3は、図1のLEDアレイの斜視図である。   1 to 3 relate to an embodiment of the present invention, FIG. 1 is a cross-sectional view of a light emitting diode, FIG. 2 is a front view of an LED array mounted on the base substrate of FIG. 1, and FIG. It is a perspective view of 1 LED array.

図1〜図3において、本実施例の発光ダイオードは、ベース基材にLEDアレイを搭載した光源1と、内側に反射面を有するリフレクター2とを組合せて構成されている。光源1の構成は、本実施例では略四角柱状に形成された金属部材よりなるベース基材3と、このベース基材3の4面の側面3aのそれぞれに設けられたLEDアレイ4とから構成されている。尚、前記ベース基材3の側面の数を四角柱状に限定するものではなく、例えば、三角柱状、五角柱状、六角柱状、あるいはそれ以上の任意角数の角柱状とすることも自在である。   1 to 3, the light emitting diode of this embodiment is configured by combining a light source 1 having an LED array mounted on a base substrate and a reflector 2 having a reflection surface on the inside. In this embodiment, the light source 1 is composed of a base substrate 3 made of a metal member formed in a substantially quadrangular prism shape, and an LED array 4 provided on each of the four side surfaces 3a of the base substrate 3. Has been. Note that the number of side surfaces of the base substrate 3 is not limited to a quadrangular prism shape, and may be, for example, a triangular prism shape, a pentagonal column shape, a hexagonal column shape, or a prism shape with an arbitrary number of more than that.

前記ベース基材3の材質は熱伝導率の高い銅又はアルミなどの金属部材を用い、その延長部には、図1及び図2に示すように、ベース基材3とは別体の反射・放熱体である半球体5が形成されている。更に、その表面には反射効率を良くするために光沢メッキが施されている。   The base base material 3 is made of a metal member such as copper or aluminum having a high thermal conductivity, and the extension part is a reflection / separation separate from the base base material 3 as shown in FIGS. A hemispherical body 5 which is a radiator is formed. Further, the surface is subjected to gloss plating in order to improve the reflection efficiency.

前記LEDアレイ4の構成は、ガラスエポキシ樹脂などよりなる絶縁性を有するプリント基板6には所定の配線パターンが形成され、前記プリント基板6上に複数のLEDチップ7が直線状に実装されている。前記LEDチップ7を整列させる方向は、前記ベース基材3の側面3aの軸方向(X)に沿うものである。   The LED array 4 is configured such that a predetermined wiring pattern is formed on an insulating printed board 6 made of glass epoxy resin or the like, and a plurality of LED chips 7 are linearly mounted on the printed board 6. . The direction in which the LED chips 7 are aligned is along the axial direction (X) of the side surface 3 a of the base substrate 3.

上述した発光ダイオードは、ベース基材3の延長部を半球体5にし、更に、光沢メッキを施すことにより、LEDチップ7から照射された光はリフレクター2で反射され、その反射光がベース基材3の先端の半球体5の表面で反射する。その反射光で中心部をムラなく照射することができる。また、ベース基材3の先端端面が半球体5にすることにより、その分、表面積を増すことができ放熱性が向上する。   In the above-described light emitting diode, the extension of the base substrate 3 is made into a hemisphere 5 and further subjected to gloss plating, whereby the light emitted from the LED chip 7 is reflected by the reflector 2 and the reflected light is reflected on the base substrate. Reflected by the surface of the hemisphere 5 at the tip of 3. The central portion can be irradiated evenly with the reflected light. Moreover, when the tip end surface of the base substrate 3 is the hemispherical body 5, the surface area can be increased correspondingly, and the heat dissipation is improved.

本実施例では、ベース基材の形状を四角柱状にしたが、角数を更に増やすことにより、LEDアレイを増加させることができるので、更なる光量の増加が可能である。   In this embodiment, the shape of the base substrate is a quadrangular prism. However, since the number of LED arrays can be increased by further increasing the number of corners, the amount of light can be further increased.

図4は、ベース基材と反射・放熱体の他の形態を示す斜視図である。図4(a)は、ベース基材3が六角柱、反射・放熱体が半球体5aの組み合わせ。図4(b)は、ベース基材3が六角柱、反射・放熱体が楕円球体5bの組み合わせ。図4(c)は、ベース基材3が六角柱、反射・放熱体が円錐体5cの組み合わせ。図4(d)は、ベース基材3が六角柱、反射・放熱体が六角錐体5dの組み合わせ。図4(e)は、ベース基材3が八角柱、反射・放熱体が櫛形体5eの組み合わせである。   FIG. 4 is a perspective view showing another embodiment of the base substrate and the reflective / heat radiating body. FIG. 4 (a) shows a combination of the base material 3 being a hexagonal column and the reflecting / dissipating material being a hemisphere 5a. In FIG. 4B, the base substrate 3 is a hexagonal column, and the reflection / heat dissipation body is an elliptical sphere 5b. FIG. 4 (c) shows a combination of the base material 3 as a hexagonal column and the reflection / heat dissipation body as a cone 5c. FIG. 4D shows a combination of the base substrate 3 having a hexagonal column and the reflecting / radiating body having a hexagonal pyramid 5d. FIG. 4 (e) shows a combination of the base substrate 3 as an octagonal prism and the reflection / heat dissipation body as a comb 5e.

上述したように、反射・放熱体の形状を、半球、楕円球、円錐、多角錐などのキャップ状、若しくは、櫛形などの放熱フインのいずれかに形成することにより、放熱面積を確保しながら、光源の中心部に反射光を有効に取り出し光のムラを低減することが可能になる。また、LEDチップの発光効率は温度の低いほど高いため、発光効率も向上する。更に、LEDチップの寿命も長くなる。など信頼性に優れた発光ダイオードを提供することが可能である。更に、この光源をヘッドライトに使用した際は、ベース基材の金属部材の先端から出る輻射熱によって着雪した雪を解かすことができる。   As mentioned above, while forming the shape of the reflective / heat radiating body in either a cap shape such as a hemisphere, an elliptical sphere, a cone or a polygonal pyramid, or a heat radiation fin such as a comb shape, while ensuring a heat radiation area, It is possible to effectively extract reflected light at the center of the light source and reduce unevenness of the light. In addition, since the luminous efficiency of the LED chip is higher as the temperature is lower, the luminous efficiency is also improved. In addition, the life of the LED chip is extended. Thus, it is possible to provide a light-emitting diode with excellent reliability. Furthermore, when this light source is used for a headlight, it is possible to remove snow that has landed on the ground due to radiant heat emitted from the tip of the metal member of the base substrate.

本発明の実施例に係る発光ダイオードの断面図である。It is sectional drawing of the light emitting diode which concerns on the Example of this invention. 図1のベース基板にLEDアレイを搭載した状態の正面図である。FIG. 2 is a front view of a state where an LED array is mounted on the base substrate of FIG. 1. 図1のLEDアレイの斜視図である。It is a perspective view of the LED array of FIG. 本発明のベース基材と反射・放熱体の他の形態を示す斜視図である。It is a perspective view which shows the base substrate of this invention, and the other form of a reflection and a heat radiator. 従来の車両用灯具の断面図である。It is sectional drawing of the conventional vehicle lamp. 図5の光源ホルダの部分斜視図である。It is a fragmentary perspective view of the light source holder of FIG. 図5のLEDアレイの斜視図である。FIG. 6 is a perspective view of the LED array of FIG. 5.

符号の説明Explanation of symbols

1 光源
2 リフレクター
3 ベース基材
3a 側面
4 LEDアレイ
5(5a、5b、5c、5d、5e) 反射・放熱体
6 プリント基板
7 LEDチップ

DESCRIPTION OF SYMBOLS 1 Light source 2 Reflector 3 Base base material 3a Side surface 4 LED array 5 (5a, 5b, 5c, 5d, 5e) Reflection and heat dissipation body 6 Printed circuit board 7 LED chip

Claims (3)

プリント基板に複数個のLEDチップを列状に実装したLEDアレイを、多角柱状をした金属部材よりなるベース基材の側面に搭載した光源と、内側に反射面を有するリフレクターの中心軸と前記ベース基材の軸とが一致するように組合せた発光ダイオードにおいて、前記ベース基材のそれぞれの側面であって前記側面の軸線に沿う方向に直線状に複数のLEDアレイを設け、且つ、前記ベース基材の先端端面内に光沢メッキが施された反射・放熱体を一体的に配設して放熱する表面積を拡大すると共に、前記リフレクターの反射面よりの反射光を反射するようにしたことを特徴とする発光ダイオード。 A light source in which an LED array in which a plurality of LED chips are mounted in a row on a printed circuit board is mounted on a side surface of a base substrate made of a metal member having a polygonal column shape, a central axis of a reflector having a reflecting surface on the inside, and the base In the light emitting diode combined so that the axis of the base material coincides with each other, a plurality of LED arrays are provided linearly in the direction along the axis of each side surface of the base base material, and the base base A reflective / heat-dissipating body with gloss plating on the end face of the material is integrated to increase the surface area for heat dissipation and reflect light reflected from the reflective surface of the reflector. A light emitting diode. 前記反射・放熱体は前記ベース基材とは別体であり、その形状は、半球、楕円球、円錐、多角錐などのキャップ状、若しくは、櫛形などの放熱フインのいずれかであることを特徴とする請求項1記載の発光ダイオード。   The reflection / heat dissipating body is separate from the base substrate, and the shape thereof is either a cap shape such as a hemisphere, an elliptical sphere, a cone or a polygonal pyramid, or a heat dissipating fin such as a comb shape. The light emitting diode according to claim 1. 前記ベース基材は銅又はアルミであることを特徴とする請求項1または2記載の発光ダイオード。
The base substrate according to claim 1 or 2, wherein the light-emitting diodes, characterized in that copper or aluminum.
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