CN100479129C - 基板用定位工作台、基板用定位设备及基板的定位方法 - Google Patents

基板用定位工作台、基板用定位设备及基板的定位方法 Download PDF

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Publication number
CN100479129C
CN100479129C CNB2005800098494A CN200580009849A CN100479129C CN 100479129 C CN100479129 C CN 100479129C CN B2005800098494 A CNB2005800098494 A CN B2005800098494A CN 200580009849 A CN200580009849 A CN 200580009849A CN 100479129 C CN100479129 C CN 100479129C
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CN
China
Prior art keywords
substrate
ball
free
bearing
ball bearing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800098494A
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English (en)
Chinese (zh)
Other versions
CN1938843A (zh
Inventor
井口薰
内田卓朗
西之宫秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iguchi Kiko Co Ltd
Iguchi Kiko Seisakusho Co Ltd
Original Assignee
Iguchi Kiko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iguchi Kiko Co Ltd filed Critical Iguchi Kiko Co Ltd
Publication of CN1938843A publication Critical patent/CN1938843A/zh
Application granted granted Critical
Publication of CN100479129C publication Critical patent/CN100479129C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/04—Ball or roller bearings
    • F16C29/045—Ball or roller bearings having rolling elements journaled in one of the moving parts
    • F16C29/046—Ball or roller bearings having rolling elements journaled in one of the moving parts with balls journaled in pockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB2005800098494A 2004-04-05 2005-04-04 基板用定位工作台、基板用定位设备及基板的定位方法 Expired - Fee Related CN100479129C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP110896/2004 2004-04-05
JP2004110896 2004-04-05

Publications (2)

Publication Number Publication Date
CN1938843A CN1938843A (zh) 2007-03-28
CN100479129C true CN100479129C (zh) 2009-04-15

Family

ID=35125361

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800098494A Expired - Fee Related CN100479129C (zh) 2004-04-05 2005-04-04 基板用定位工作台、基板用定位设备及基板的定位方法

Country Status (4)

Country Link
KR (1) KR100847347B1 (ja)
CN (1) CN100479129C (ja)
TW (1) TWI278082B (ja)
WO (1) WO2005098935A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100969283B1 (ko) * 2007-05-16 2010-07-09 아주하이텍(주) 광학 검사 장치
TWI405915B (zh) * 2008-07-09 2013-08-21 Au Optronics Corp 定位裝置
JP5551888B2 (ja) * 2009-04-14 2014-07-16 株式会社井口機工製作所 フリーボールベアリング、ベアリング装置、支持テーブル、搬送設備、ターンテーブル
JP2010265095A (ja) * 2009-05-15 2010-11-25 Iguchi Kiko Seisakusho:Kk ベアリングユニット、フリーボールベアリング、支持テーブル、搬送設備、ターンテーブル
CN101830351B (zh) * 2010-05-10 2012-07-04 友达光电股份有限公司 钳制组件、使用其的定位设备以及从定位设备移走物体的方法
CN102841505B (zh) * 2011-06-22 2015-06-17 上海微电子装备有限公司 一种可精确定位基板的工件台
US9082799B2 (en) * 2012-09-20 2015-07-14 Varian Semiconductor Equipment Associates, Inc. System and method for 2D workpiece alignment
CN106571329A (zh) * 2015-10-12 2017-04-19 沈阳拓荆科技有限公司 一种晶圆基板支架结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3158485B2 (ja) * 1991-04-23 2001-04-23 ソニー株式会社 陰極線管位置決め装置
JP3160690B2 (ja) * 1993-10-18 2001-04-25 東京エレクトロン株式会社 処理方法
JPH07147311A (ja) * 1993-11-24 1995-06-06 Tokyo Electron Ltd 搬送アーム
JPH10209250A (ja) * 1997-01-24 1998-08-07 Tabai Espec Corp 試料体位置決め装置
JPH11116048A (ja) * 1997-10-14 1999-04-27 Nikon Corp 基板搬送装置
JPH11145266A (ja) * 1997-11-07 1999-05-28 Tokyo Electron Ltd 静電吸着装置および静電吸着方法、ならびにそれを用いた基板搬送装置および基板搬送方法
JP2003124292A (ja) * 2001-10-19 2003-04-25 St Lcd Kk 板状部材の位置補正装置及びガイド装置
JP2003239952A (ja) * 2002-02-12 2003-08-27 Takai Corporation:Kk 確実に回転するボールを持ったツバ付きボールプランジャー

Also Published As

Publication number Publication date
TW200534451A (en) 2005-10-16
KR100847347B1 (ko) 2008-07-21
KR20060126597A (ko) 2006-12-07
TWI278082B (en) 2007-04-01
WO2005098935A1 (ja) 2005-10-20
CN1938843A (zh) 2007-03-28

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Granted publication date: 20090415

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CF01 Termination of patent right due to non-payment of annual fee