CN100479129C - Positioning table for substrate, positioning equipment for the substrate, and positioning method of the substrate - Google Patents
Positioning table for substrate, positioning equipment for the substrate, and positioning method of the substrate Download PDFInfo
- Publication number
- CN100479129C CN100479129C CNB2005800098494A CN200580009849A CN100479129C CN 100479129 C CN100479129 C CN 100479129C CN B2005800098494 A CNB2005800098494 A CN B2005800098494A CN 200580009849 A CN200580009849 A CN 200580009849A CN 100479129 C CN100479129 C CN 100479129C
- Authority
- CN
- China
- Prior art keywords
- substrate
- ball
- free
- bearing
- ball bearing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C29/00—Bearings for parts moving only linearly
- F16C29/04—Ball or roller bearings
- F16C29/045—Ball or roller bearings having rolling elements journaled in one of the moving parts
- F16C29/046—Ball or roller bearings having rolling elements journaled in one of the moving parts with balls journaled in pockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
Abstract
A board positioning table is provided with a placing table whereupon a board is to be placed, and free ball bearings, which are arranged on a plurality of areas on an outer circumference part of the placing table, guide an outer circumference part of the board placed on the placing table by moving down from an upper part of the placing table, and position the board within a board positioning area set on the placing table. The free ball bearing is provided with a ball supporting body and a ball rotatably supported by the ball supporting body. The center of the ball is arranged on a position on an extension of a supporting plane of the placing table for supporting the board or at a position upper than the supporting plane within a range of a thickness of the board to be placed on the placing table.
Description
Technical field
The present invention relates to be used for display with the substrate usefulness positioning table of basic pattern glass, silicon substrate (thin plate) the substrate precision positioning of etc.ing, substrate localization method with positioning equipment and substrate.
Background technology
To PDP (plasma display), the employed glass substrate of display (the mother glass: basic pattern glass) carry out in the equipment of pad pasting etc. that LCD is such, utilize special robot (conveying device), to carrying out film forming, the coating resist, exposure, a plurality of process chambers of processing such as etching (chamber: chamber) move into, transport substrate, but in view of the positioning accuracy of guaranteeing to move into the glass substrate in the process chamber is very important, before the glass substrate that will carry out process flows such as pad pasting is moved into process chamber, be positioned in and be located at substrate and move into [for example moving in the path way of process chamber, in the chamber (loading and unloading lock chamber) that is provided with the process chamber split, be provided with (in the atmosphere) near the vacuum plant inlet of described process chamber etc. etc.] positioning table on and position, then, described robot takes out glass substrate and moves into the process chamber from positioning table, with the Position Control of the glass substrate in the process chamber within range of allowable error.
In the past, as described positioning table, have the glass substrate that makes mounting on this positioning table to support to run into the location meter and the structure (for example patent documentation 1) that positions or running fix meter and make it support structure that the end face of running into the glass substrate on the positioning table positions etc.
In addition, glass substrate is by moving into platform (casset: case) take out glass substrate and the special-purpose transfer robot of its mounting on positioning table carried out from what move into glass substrate to the conveyance of positioning table.As this transfer robot, have: for example as shown in Figure 5, mounting glass substrate 102 carries out the robot (transfer robot 103) of conveyance on many moveable arms 101; Perhaps as shown in Figure 6, use the plurality of positions of the sucker shape adsorption head that is connected with vacuum plant 104 absorption fixing glass substrates 102 and the robot (transfer robot 105) that carries out conveyance.This transfer robot descends the glass substrate of moving into to positioning table 106 102 and it is positioned on the positioning table 106.In addition, also have and take out and to the function of taking out of the position conveyance from positioning table 106 finishing after the technological process such as pad pasting the glass substrate 102 that turns back on the positioning table 106 from process chamber.
Positioning table 106 has: the laterally mobile cross feed device (omitting diagram) of glass substrate 102 that makes mounting by the transfer robot; Support by end face and to bump and the location meter 107 of glass substrate 102 location with the peripheral part of the glass substrate 102 of cross feed device traverse feed, by the glass substrate 102 that utilizes cross feed device that the transfer robot is moved into move and with location meter 107 butts, Locating Glass substrate 102 critically thus.In addition, as positioning table 106, by a plurality of free ball bearing (Off リ one ボ one Le ベ ア リ Application グ) the 109 supporting glass substrates 102 that are provided with on the workbench main body 108, it can laterally be moved freely, can realize laterally moving of glass substrate 102 with lighter power thus.
Patent documentation 1: the spy opens flat 06-183556 communique
But, because on described positioning table, beginning to bumping the positioning operation that the location meter carries out and finish the needs spended time according to supporting from the mounting glass substrate, this becomes the inefficient reason of manufacturing of product, so undesirable.In addition, glass substrate is laterally moved or the location meter is supported in the formation of bumping the end face of glass substrate and positioning, bringing the distortion of small deflection etc. easily to glass substrate, the problem of dimensional accuracy of the flatness of glass substrate occurring influencing.And, owing to need cross feed device (device that perhaps is used for the traverse measurement meter), thus the cost up of making, and such device becomes the generation source of particle, the easy problem of polluting glass substrate of generation.
Summary of the invention
The present invention constitutes in view of above-mentioned problem, its purpose is to provide a kind of substrate cheaply with positioning table, the substrate localization method with positioning equipment and substrate, can carry out the location of substrates such as glass substrate at short notice simply, and, bring distortion to substrate hardly, also can reduce the generation of particle as far as possible.
In order to solve above-mentioned problem, the invention provides following formation.
Substrate positioning table of the present invention, it has: the mounting table of mounting substrate; Free ball bearing, it is arranged on the plurality of positions of described mounting table peripheral part, by the top from described mounting table is descended and the peripheral part channeling conduct of the substrate of mounting on described mounting table, make in the substrate orientation zone that described substrate orientation sets on described mounting table, it is characterized in that, described free ball bearing is by the ball bearing body, be disposed on this ball bearing body a plurality of rotations freely bead and free rotaring ground supporting on the free direction in these a plurality of rotations freely the ball on the bead constitute, the center configuration of described ball supports in described mounting table in the prolongation of bearing-surface of described substrate, perhaps, the described bearing-surface of scope internal ratio of sheet thickness dimension that is arranged on the substrate of mounting on the described mounting table is by last position, the rotation by described ball can with described ball from the substrate of the outstanding part butt of described ball bearing body described substrate orientation regional guidance to the inboard that the ball by each free ball bearing surrounds.
With in the positioning table, the ball of described free ball bearing surface is at least formed by electric conducting material, can adopt the structure that is provided with the earthy conducting parts that is connected with described ball on the ball bearing body of described free ball bearing at this substrate.
In addition, with in the positioning table, preferably adopt following structure, promptly at this substrate, be provided with base supporting mechanism on described mounting table, this base supporting mechanism supports and allows it in the direction displacement along described bearing-surface to the substrate that is positioned on the described mounting table.As described base supporting mechanism, for example can adopt free ball bearing.
In addition, substrate positioning equipment of the present invention, it has: the platform of moving into of moving into substrate; The substrate positioning table of the invention described above; From described move into that platform takes out substrate and with its mounting in described substrate with the substrate transfer device on the mounting table of positioning table.
The localization method of substrate of the present invention, the substrate that makes the invention described above descends from the top of substrate region of acceptance with the substrate of mounting on the described mounting table of positioning table and enters described substrate region of acceptance, then, it at the free ball bearing of the many places that are disposed at described mounting table peripheral part this substrate of guiding and make its decline on the ball of the free bearing in each side (サ イ De Off リ one ベ ア リ Application グ), be configured in the described substrate orientation zone, wherein, described substrate region of acceptance is configured on the described ball of described each free bearing in side, and, with the described ball of described each free bearing in side when the outstanding overhang of described ball bearing body is made as side ball overhang, described substrate region of acceptance is than the wide width that goes out described side ball overhang in described substrate orientation zone.
According to the present invention, make the top decline of the ball of the free ball bearing that substrate is provided with from the peripheral part of mounting table (below also claim the side free bearing), enter into by each side free axis and contract the substrate orientation zone of the inboard of enclosing (by the inboard that surrounds from the most outstanding part of the ball bearing body of ball) and mounting on the bearing-surface of mounting table, promptly can substrate be positioned desirable precision thus.Because being the ball by each free ball bearing in side, the substrate that enters the substrate orientation zone positions, so can when substrate enters the substrate orientation zone, finish the location of substrate.Therefore, can position in the extremely short time.
In addition, descend from the substrate region of acceptance when entering the substrate orientation zone at substrate, even the peripheral part of substrate and described ball are from the outstanding part butt of described ball bearing body, because the structure in substrate orientation zone that will lead swimmingly with the substrate of the part butt of giving prominence to from described ball bearing body of described ball that the free bearing in side is the rotation by described ball is so can finish the location of substrate when substrate enters the substrate orientation zone.
And, with substrate by mounting on the horizontal running fix workbench it being supported runs into the structure that the location meter positions and compares, in the present invention, be difficult for substrate is given the distortion of the deflection etc. of part, can obtain stably to keep the excellent results of the dimensional accuracy of substrate.In addition,, the generation source of particle can be significantly reduced, also cost degradation can be realized owing on positioning table, need not to be provided with the mechanism of complexity such as cross feed device.
Description of drawings
Fig. 1 is the plane graph of substrate of the present invention with positioning table (the following positioning table that also claims);
The positioning table of Fig. 2 presentation graphs 1, the section of A-A line that is Fig. 1 is to view;
Fig. 3 is the enlarged drawing of the installation site relation of the free bearing in side (サ イ De Off リ one ベ ア リ Application グ) that is provided with of the positioning table of presentation graphs 1 and the free bearing of pressure (being subjected to け Off リ one ベ ア リ Application グ);
Fig. 4 is that expression has the floor map of substrate of the present invention with the technological process apparatus of positioning equipment;
Fig. 5 is the schematic diagram of the handover robot of expression conventional example;
Fig. 6 is other routine schematic diagrames of the handover robot of expression conventional example.
Reference numeral
1: substrate positioning table 2: substrate positioning equipment 4: substrate 11: mounting table 12: free ball bearing (the free bearing in side) 12a: ball bearing body (earthy conducting parts) 12b: ball 12f: bead (ground connection conducting parts) 14: free ball bearing (the free bearing of pressure) 14a: ball bearing body (earthy conducting parts) 14b: ball M: substrate orientation zone U: substrate region of acceptance
Embodiment
Below, with reference to Fig. 1～Fig. 4 embodiments of the present invention are described.
Fig. 1, Fig. 2 are the figure of expression substrate of the present invention with positioning table 1 (below be also referred to as positioning table), Fig. 1 is a plane graph, Fig. 2 is that the section of A-A line of Fig. 1 is to view, Fig. 3 is the enlarged drawing of the installation site relation of the free ball bearing (free bearing in side described later (サ イ De Off リ one ベ ア リ Application グ) and the free bearing of pressure (being subjected to け Off リ one ベ ア リ Application グ)) that is provided with of positioning table 1, and Fig. 4 is that expression has the floor map of substrate of the present invention with the technological process apparatus 3 of positioning equipment 2 (the following positioning equipment that also claims).
Wherein, in this embodiment, as substrate 4, glass substrate (the basic pattern glass that uses display to use, also claim glass substrate below) describe for example, but be not limited to glass substrate as suitable substrate 4 of the present invention, for example, can adopt silicon substrate, ceramic substrate, metal substrate etc. to carry out precision machined various substrate.In addition, substrate 4 is that rectangle is tabular at this, but be not limited thereto, and the shape of this substrate 4 also can be for example circle or ellipse etc.
In the present embodiment, as shown in Figure 4, positioning table 1 of the present invention is arranged in the loading and unloading lock chamber 32 that is provided with in the vacuum plant 31 that constitutes technological process apparatus 3.
In Fig. 4, vacuum plant 31 is made of loading and unloading lock chamber 32, transfer chamber 33 and the 1st～3 process chamber 34a, 34b, 34c (chamber).Symbol 35a is the atmosphere valve that is provided with on loading and unloading lock chamber 32, when when substrate 4 being moved into loading and unloading lock chamber 32 outside vacuum plant 31 or with substrate 4, outside vacuum plant 31, taking out of from loading and unloading lock chamber 32, and this atmos-valve door switch.In addition, 35b is the valve that opens and closes between loading and unloading locking device 32 and the transfer chamber 33, and 35c, 35d, 35e are the valves that opens and closes between the 1st～3 process chamber 34a, 34b, 34c and the transfer chamber 33.In transfer chamber 33, be provided with robot 36 (the substrate transfer device that is used for moving substrate 4, be also referred to as vacuum robot below), by this vacuum robot 36 with substrate 4 loading and unloading in the locking device 32 positioning table 1 and process chamber 34a, 34b, 34c between transfer.In addition, be accompanied by the treatment process of pad pasting etc., will be when the substrate 4 that process chamber takes out is moved into other process chambers (perhaps moving into original process chamber), temporary transient through behind the location of positioning table 1, entering into other process chambers again from the substrate 4 that process chamber takes out.
Technological process apparatus 3 is to form by being arranged on vacuum plant 31 outer case 37, robot 38 (the substrate transfer device also claims the atmosphere robot below) and above-mentioned vacuum plants 31.Atmosphere robot 38 from case 37 take out substrates 4 and through atmosphere valve 35a with its mounting to positioning table 1, thus substrate 4 is moved into from the positioning tables 1 in the vacuum plant 31 export-oriented loading and unloading lock chamber 32.Atmosphere robot 38 also carries out operation that the substrate on the positioning table 14 is taken out of outside vacuum plant 31.
At this, atmosphere robot 38 is with same with reference to the handover robot 103 of Fig. 5 explanation, with substrate 4 mountings in can under the state of the moveable arm 38a (with reference to Fig. 2) that moves on the XYZ direction, carrying to substrate 4, but be not limited thereto, can adopt the robot of various structures.
In addition, case 37 plays the function of moving into platform that the substrate 4 of implementing to handle is moved into.
As shown in Figure 1 and Figure 2, positioning table 1 comprises: the mounting table 11 of mounting substrate 4; Free ball bearing 12 (following also claim the side free bearing), it is arranged on the plurality of positions of these mounting table 11 peripheral parts, by with described mounting table 11 on end face 41 butts of substrate 4 of mounting described substrate 4 is positioned on the described mounting table 11 on the desirable position.
Described mounting table 11 have workbench main body 13 and be installed in outstanding a plurality of free ball bearing 14 on the top 13a of this workbench main body 13 (below, also claim pressure free bearing), by the free bearing 14 of described a plurality of pressure the substrate 4 of mounting on this mounting table 11 is bearing on the seating surface F (imaginary plane) of level or approximate horizontal.In addition, outstanding and be provided with and be used to install the side free axis and hold 12 erecting bed 15 above workbench main body 13 in the one of the outside of workbench main body 13, the free bearing 14 of described pressure is installed on the workbench main body 13, makes the top of the ball 14b 13a above the workbench main body of the inboard that is positioned at described erecting bed 15 encirclements that rotates freely outstanding.
In addition, workbench main body 13 planes of the mounting table 11 of illustrated example are seen as oblong-shaped (with reference to Fig. 1), but are not limited thereto in the present invention, for example, also can adopt the plane to be seen as shapes such as circle, ellipse.
The free bearing 12 in described side has ball bearing body 12a (support) and by the ball 12b of this ball bearing body 12a free rotaring ground supporting, and described ball bearing body 12a is fixedly mounted on the erecting bed 15 of mounting table 11 peripheral parts.The free bearing 12 in this side is installed in the inner face 15a side (with the relative side of inner space S of erecting bed 15 encirclements) of the erecting bed 15 of workbench main body 13, and described ball 12b is positioned at the space S side more in the inner part than erecting bed inner face 15a from the outstanding part of ball bearing body 12a.In addition, as shown in Figure 3, the center configuration of the ball 12b of the free bearing 12 in this side is in the prolongation of the bearing-surface F of the described substrate 4 of described mounting table 11 supportings.Therefore, the ball 12b of the free bearing 12 in side makes ball 12b consistent with bearing-surface F and position from the outstanding overhang the best part of ball bearing body 12a.
In this positioning table 1, by the ball 12b of the free bearing 12 in each side (in detail, ball 12b is from the outstanding overhang the best part of ball bearing body 12a) medial region of surrounding is the substrate orientation zone M of the substrate 4 of mounting on the mounting table 11 of this positioning table 1 of configuration, be configured in substrate orientation zone M by substrate 4, position with desirable precision relative positioning workbench 1 by the ball 12b of the free bearing 12 in each side of this positioning table 1 with mounting on the mounting table 11.
As Fig. 2, shown in Figure 3, size L (specifically, the XY size of substrate orientation zone M.The size L of Fig. 2 is the size of expression Y direction) than the size t[of substrate 4 specifically, size in length and breadth.The size t of Fig. 2 represents the size of the longitudinal direction (minor face) of the tabular substrate of rectangle 4] big slightly, according to the size L of substrate orientation zone M and poor (L-t) of the size t of substrate 4, the positioning accuracy of the substrate 4 relative positioning workbench 1 that decision substrate orientation zone M disposes.For substrate 4 in the M configuration of substrate orientation zone, this positioning accuracy is based on along setting for the position deviation permissible range (size c1 shown in Figure 2, c2) of the substrate 4 on the direction of the bearing-surface F of benchmark with the target location (hereinafter referred to as the reference position, error is 0) of substrate orientation zone M.In addition, size c1 shown in Figure 2 and size c2 are the distances between the ball 12b (ball 12b is from the outstanding largest portion of ball bearing body 12a (aftermentioned) (point)) of end face 41 and the free bearing 12 in side of the position configuration of relative this end face 41 of substrate 4 of reference position configuration.
The positioning accuracy of substrate 4 relative positioning workbench 1, for example can be set to ± 0.1～0.7mm about, also can set for than this more small rank.
The free bearing 12 in side can play by described ball 12b rotation will with described ball 12b from the substrate 4 of the top butt of the outstanding part of described ball bearing body 12a function to the M guiding of substrate orientation zone.Therefore, when substrate 4 descends from the top of mounting table 11 when entering substrate orientation zone M, even the ball 12b butt of the free bearing 12 in end and side of substrate 4 in the way that descends then, by the rotation of the ball 12b substrate orientation zone M that also substrate 4 can be led swimmingly, be configured in substrate orientation zone M.
By atmosphere robot 38 (with reference to Fig. 4) substrate 4 is moved into following the carrying out of action (localization method of substrate) that positioning table 1 positions, promptly, from case 37, take out substrate 4, the moveable arm 38a of this substrate 4 of mobile mounting, as shown in Figure 2, substrate 4 is configured in the top of the substrate orientation zone M of positioning table 1, then, fall moveable arm 38a, substrate 4 is positioned among the M of substrate orientation zone.
Be accompanied by the decline of moveable arm 38a from the top of positioning table 1, the substrate 4 of mounting on moveable arm 38a also descends thereupon, and still, substrate 4 (points to and reaches bearing-surface F) when the ball 14b of the free bearing 14 of the pressure that abuts to mounting table 11 and stops to descend.Because substrate 4 is placed on substrate orientation zone M, can position (along the location of the direction of bearing-surface F) with desirable precision by the free bearing 12 in each side (ball 12b at length) around the M of substrate orientation zone.On the other hand, moveable arm 38a continues to descend after substrate 4 stops to descend, and stops when entering the arm accommodating groove 13b that forms on the workbench main body 13 descending.Thus, moveable arm 38a does not contact with the substrate 4 of free bearing 14 upper supports of pressure, and moveable arm 38a does not influence the location of the substrate 4 on the free bearing 14 of pressure.
In addition, as previously mentioned, even in the way that descends the end of substrate 4 from substrate orientation zone M depart from and with the ball 12b butt of the free bearing 12 in side, owing to substrate 4 is guided to substrate orientation zone M, can carry out the configuration of substrate 4 swimmingly to substrate orientation zone M by the rotation of ball 12b.
In addition, as atmosphere robot 38, when above mounting table 11, substrate 4 being moved into substrate orientation zone M, adopt and do not retrain substrate 4 laterally moving, not producing on moveable arm 38a because the dysgenic structure of the location of substrate 4 being brought with the contacting of ball 12b of the free bearing 12 in side.As atmosphere robot 38, can adopt formation by the transfer unit conveying substrate 4 beyond the moveable arm 38a, but need not produce since with the contacting of ball 12b of the free bearing 12 in side to the harmful effect of the location belt wheel of substrate 4.
According to this positioning table 1, substrate 4 folding and unfoldings that to fall from the top of this positioning table 1 are to substrate orientation zone M the time, by the free bearing 12 in each side around the M of substrate orientation zone (at length, ball 12b) finishes the location of substrate 4, thus, the location required time of substrate 4 can be shortened greatly, location efficiency can be improved significantly.In addition, do not need the cross feed device that is used for horizontal moving substrate that in the past used, because can be by the very simple location that constitutes realization substrate 4, so can reduce the generation of particle in the positioning process of positioning table 1 significantly, have the advantage of the high cleanliness in the chamber (loading and unloading lock chamber 32) that keeps being provided with positioning table 1.
In addition, in the present invention, employing is by the free bearing 12 in described side that electroconductive resin material ball 12b that forms and the ball bearing body 12a with the earthy conducting parts that contacts with described ball 12b constitute, also can prevent when substrate 4 contacts with ball 12b owing to substrate 4 with static produce electric spark.
As shown in Figure 3, the free bearing 12 in side, half degree that ball 12b is taken in the inside of the ball bearing body 12a that forms at tubular box 12d and lid 12e in addition, is formed in ball bearing body 12a and takes in a plurality of rotations of joining with ball 12b structure of bead 12f freely.Component parts as the free bearing 12 in side, for example, adopt the ball 12b that forms by the electroconductive resin material, the bead 12f that forms by the conducting metal of stainless steel etc., form by the conducting metal of stainless steel etc. or tubular box 12d that takes in the power-on circuit that electric wire etc. constitutes (comprise fetch mutually guarantee the contact site that conducts electricity with bead 12f) and the earthy conducting parts that constitutes by bead 12f and tubular box 12d.Be connected with earthy conducting parts by earthy circuit, can prevent to produce when substrate 4 from contacting with ball 12b electric spark free bearing 12 outsides, side.
Owing to produce electric spark is to cause substrate 4 damages, so the free bearing 12 in side by the employing said structure can prevent the damage of the substrate 4 that caused by electric spark, can realize the raising of finished product rate etc.
And, as the electroconductive resin material that forms ball 12b, can adopt in base resin the material that disperses to sneak into the conducting metal filler, perhaps in base resin, add the material that prevents charged polymer etc., make ball 12b have 10 by these materials
3～* 10
10The surface resistivity of Ω/.As base resin, can adopt PAI (polyamide-imide), PBI (polybenzimidazoles), PCTFE (polychlorotrifluoroethylene), polyether-ether-ketone, PEI (Polyetherimide), PI (polyimides), PPS (polyphenylene sulfide), melamine resin and aromatic polyamide resin (aromatic polyamide resin) etc.Also can use LCP (liquid crystal polymer), PBT (PETG), PES (polyether sulfone) to wait other resin in addition.The aspect of the character constancy of the environment in the consideration relative vacuum device etc., preferred ベ ス ペ Le (registered trade mark of the aromatic polyamide of デ ユ Port Application company) or PBI.
In addition, in the present invention, has the advantage of the positioning accuracy (by the delivery precision of atmosphere robot 38 conveying substrates 4) that can relax 38 requirements of atmosphere robot.
Promptly, if the positioning table of above-mentioned formation 1, moving of moveable arm 38a by atmosphere robot 38 and with substrate 4 during from the top decline of the ball 12b of the free bearing 12 in each side, because as long as the ball 12b that the peripheral part of substrate 4 is positioned in the free bearing 12 in side can be by the rotation of ball 12b with substrate 4 guiding substrate orientation zone M above the outstanding part of ball bearing body 12a, so need not and to drop near the position folding and unfolding of the substrate 4 the ball 12b of the free bearing 12 in side in the scope of the regional M of substrate orientation.Atmosphere robot 38 is placed into than described substrate orientation zone M at the substrate 4 that will descend above the ball 12b of the free bearing 12 in each side and expands the ball 12b of the free bearing 12 in each side under the state of the scope (substrate receiving area U) of ball bearing body 12a overhang (giving prominence to size P), as long as make this substrate drop to substrate orientation zone M, so with for the positioning accuracy that keeps substrate 4 in the scope that is positioned over substrate orientation zone M unchangeably the situation of moving substrate 4 compare, can relax delivery precision.
In Fig. 2, described substrate region of acceptance U is by the ball bearing body 12a of the free bearing 12 in each side on the mounting table 11 (the end face 12c of the side of the relative substrate orientation of each ball bearing body 12a zone M in detail.In more detail, the end face of the lid 12e of ball bearing body 12a) medial region of surrounding is positioned at the top of the ball 12b of the free bearing 12 in each side.In addition, in other words, each substrate region of acceptance is the medial region of being surrounded from the top (point) of the outstanding part of ball bearing body 12a (taking in half degree of ball 12b) by the ball 12b of the free bearing 12 in each side.
When substrate 4 being descended from the top of the ball 12b of the free bearing 12 in each side by atmosphere robot 38, if guarantee substrate 4 is positioned over positioning accuracy (delivery precision) in the scope of substrate region of acceptance U reliably, then substrate 4 does not contact with ball bearing body 12a of the free bearing 12 in side etc., can make substrate 4 drop to substrate orientation zone M, substrate 4 can be configured in substrate orientation zone M with the positioning accuracy with respect to the hope of positioning table 1.
Specific embodiment
If the positioning accuracy of the horizontal direction of the substrate 4 among the M of substrate orientation zone is ± 0.5mm (c1 of Fig. 2 and c2 are 0.5mm), the outstanding size P of the ball 12b of the free bearing 12 in side is 2.5mm, and the range of allowable error of the horizontal direction position of the substrate 4 when then by atmosphere robot 38 substrate 4 being moved into substrate region of acceptance U is ± 3.0mm.In other words, the horizontal direction position of substrate 4 is accommodated in ± after 3.0mm ground is moved into region of acceptance U to substrate 4 by atmosphere robot 38, if decline substrate 4, then relative positioning workbench 1 can position substrate 4 with the precision of ± 0.5mm.
In recent years, the maximization of the glass substrate 4 of the basic pattern glass used of display etc. is constantly in development.The size of widely used basic pattern glass is 1500mm * 1800mm as LCD the time, and thickness is about 0.3～0.7mm, and the trend of further maximization is arranged.
Like this, when positioning, need the measure that prevents glass substrate 4 deflections with the thin and large-scale glass substrate 4 of robotic delivery and by positioning table.For example; shown in Fig. 2 example; the structure of the atmosphere robot 38 of present embodiment is carried for mounting glass substrate 4 on the moveable arm 38a below being inserted into glass substrate 4; even but guarantee the delivery precision of robot self fully, also be difficult to eliminate because the position error that the deflection of glass substrate 4 produces.In addition, as shown in Figure 5, bumping on the positioning table that glass substrate is positioned by counting to support with the location, owing to the power of touching to the location meter makes glass substrate deflection partly taking place, may influence the flatness of glass substrate.
To this, in the present invention, the substrate 4 that ball 12b by the free bearing 12 in each side will descend from the top of the ball 12b of the free bearing 12 in each side around the mounting table 11 is derived from substrate region of acceptance U on one side and is introduced the regional M of substrate orientation on one side, on the bearing-surface F of mounting on the mounting table 11, substrate 4 is located with the relative mounting table 11 of desirable precision (being positioning table 1), so can absorb the trueness error that the deflection owing to glass substrate produces, realize high-precision location simply.If will drop to the substrate 4 of substrate orientation zone M is positioned in the scope of described substrate region of acceptance U, then can realize high-precision location simply by descending, even exist because the error that the deflection of glass substrate produces also can realize high-precision location simple and reliablely.In addition, only the ball 12b by the free bearing 12 in each side drops to substrate orientation zone M to substrate 4 while leading, can finish the location, make glass substrate produce the unfavorable condition that the part deflection is caused so can separate disappears owing to supporting the power of touching of bumping the location meter, can keep the flatness of stabilized glass substrate.
In positioning table 1 of the present invention, the glass substrate 4 of going up mounting owing to the bearing-surface F by 14 pairs of mounting tables 11 of the free bearing of pressure supports, so even the glass substrate 4 on the moveable arm 38a drops on the bearing-surface F at the state of deflection, ball 14b by the free bearing 14 of one side rotational pressure eliminate deflection on one side and with glass substrate 4 mountings to bearing-surface F, finally be positioned on the bearing-surface F under the state of almost completely eliminating deflection.Thus, when finishing, guarantee the high flatness of glass substrate 4 in the location of locating area M.Because to being positioned in glass substrate 4 on the bearing-surface F is not to apply the external force that is used for traverse feed etc., so flatness that can the stable maintenance glass substrate.
At this, the free bearing of pressure 14 is as supporting and allow it working along the base supporting mechanism of displacement on the direction of described bearing-surface F to being positioned in substrate 4 on this mounting table 11.But, be not limited to the free bearing 14 of pressure as base supporting mechanism, for example, can adopt following structure etc., promptly, the top mounting substrate 4 of the outstanding support plate (comprising the free bearing of pressure) that is provided with in many places on the mounting table, the air of discharging by the exhaust outlet above mounting table, offered, utilization forms a part of load-carrying of air layer (than the high slightly high pressure of atmospheric pressure) supporting substrates 4 between at substrate 4 and above the mounting table, does not retrain laterally the moving of substrate 4 (is that the direction of bearing-surface F (imaginary plane) moves along the face by a plurality of support plate supporting substrates 4) of support plate upper support thus.
In the operations such as pad pasting in vacuum plant 31, to be positioned on the positioning table that is provided with in loading and unloading lock chamber 32 (with reference to Fig. 4) from the substrate 4 that process chamber takes out and after reorientating, when the process chamber that carries out next operation is moved into, by positioning table 1 of the present invention also can be simply and the short time obtain high positioning accuracy, and also can keep the flatness of substrate 4.
In addition,, be not limited to the glass substrate (basic pattern glass) that LCD is used, also can be, for example glass substrate, silicon substrate, ceramic substrate, the metal substrate used of PDP as being applicable to substrate of the present invention.
The position that is provided with of positioning table of the present invention is not limited to load and unload in the lock chamber, as long as suitably set according to the necessity of substrate orientation, is not particularly limited.For example, can be arranged on substrate and move near moving into the path or taking out of in the way in path (for example, outside described vacuum plant 31 (in the atmosphere), substrate move into the moving into of vacuum plant 31 mouthful (atmosphere valve) etc.) or process chamber etc. of process chamber.In addition, positioning table of the present invention for example also can utilize in the location before the location of the substrate that the processing unit (plant) in atmosphere is moved into or substrate are being accommodated in the conveyance box etc.
More than, preferred embodiments of the present invention have been disclosed for illustrative, but the present invention is not limited to these embodiment.In the scope that does not break away from aim of the present invention, what can constitute adds, omits, replaces and other changes.The present invention is not limited to above-mentioned explanation, only limits according to described claim scope.
Utilizability on the industry
According to substrate according to the present invention with positioning table, the substrate localization method with positioning equipment and substrate, Can be critically, short time and carry out simply display with basic pattern glass, silicon substrate (thin plate) etc. The location of substrate.
Claims (7)
1. substrate positioning table, it has: the mounting table of mounting substrate; Free ball bearing, it is arranged on the plurality of positions of described mounting table peripheral part, by to descending and the peripheral part channeling conduct of the substrate of mounting on described mounting table from the top of described mounting table, makes in the substrate orientation zone that described substrate orientation sets on described mounting table, it is characterized in that
Described free ball bearing by the ball bearing body, be disposed on this ball bearing body a plurality of rotations freely bead and free rotary ground supporting on the free direction in these a plurality of rotations freely the ball on the bead constitute, the center configuration of described ball supports in described mounting table in the prolongation of bearing-surface of described substrate, perhaps, the described bearing-surface of scope internal ratio that is arranged on the sheet thickness dimension of the substrate of mounting on the described mounting table leans on the position of top
Rotation that can be by described ball will with the substrate-guided described substrate orientation zone to inboard that ball by each free ball bearing surround of described ball from the outstanding part butt of described ball bearing body.
2. substrate positioning table as claimed in claim 1, it is characterized in that, the described ball of described free ball bearing surface is at least formed by conductive material, is provided with the earthy conducting parts that is connected with described ball on the described ball bearing body of described free ball bearing.
3. substrate positioning table as claimed in claim 1, it is characterized in that, be provided with base supporting mechanism on described mounting table, this base supporting mechanism supports and allows it in displacement on the direction of described bearing-surface to mounting in the substrate on the described mounting table.
4. substrate positioning table as claimed in claim 3 is characterized in that, described base supporting mechanism is free ball bearing.
5. substrate positioning table as claimed in claim 1, it is characterized in that, the outer edge shape of described substrate orientation zone for the viewed in plan of described substrate the time is with 0.1～0.7mm or than the 0.1mm shape expanded laterally of the Rack of micro scale more, and, described ball is from the outstanding part of described ball bearing body, in described substrate orientation zone, the mode with external when the viewed in plan disposes described ball bearing body.
6. a substrate positioning equipment is characterized in that having: the platform of moving into of moving into substrate; The described substrate positioning table of claim 1; From described move into that platform takes out substrate and with its mounting in described substrate with the substrate transfer device on the mounting table of positioning table.
7. the localization method of a substrate, it is characterized in that, use the described substrate positioning table of claim 1, the substrate of mounting on its described mounting table is descended from the top of substrate region of acceptance and enter described substrate region of acceptance, then, at the described free ball bearing of the many places that are disposed at described mounting table peripheral part, be to make its decline in this substrate of guiding on the ball of each free bearing in side, be configured in the described substrate orientation zone, wherein
Described substrate region of acceptance is configured on the described ball of described each free bearing in side,
And, with the described ball of described each free bearing in side when the outstanding overhang of described ball bearing body is made as side ball overhang, described substrate region of acceptance is than the wide width that goes out described side ball overhang in described substrate orientation zone.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004110896 | 2004-04-05 | ||
| JP110896/2004 | 2004-04-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1938843A CN1938843A (en) | 2007-03-28 |
| CN100479129C true CN100479129C (en) | 2009-04-15 |
Family
ID=35125361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800098494A Expired - Fee Related CN100479129C (en) | 2004-04-05 | 2005-04-04 | Positioning table for substrate, positioning equipment for the substrate, and positioning method of the substrate |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100847347B1 (en) |
| CN (1) | CN100479129C (en) |
| TW (1) | TWI278082B (en) |
| WO (1) | WO2005098935A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100969283B1 (en) * | 2007-05-16 | 2010-07-09 | 아주하이텍(주) | Apparatus for optical inspection |
| TWI405915B (en) * | 2008-07-09 | 2013-08-21 | Au Optronics Corp | Locating apparatus |
| JP5551888B2 (en) * | 2009-04-14 | 2014-07-16 | 株式会社井口機工製作所 | Free ball bearing, bearing device, support table, transfer equipment, turntable |
| JP2010265095A (en) * | 2009-05-15 | 2010-11-25 | Iguchi Kiko Seisakusho:Kk | Bearing unit, free ball bearing, support table, carrying facility and turntable |
| CN101830351B (en) * | 2010-05-10 | 2012-07-04 | 友达光电股份有限公司 | Clamping assembly, positioning equipment using same and method for moving object from positioning equipment |
| CN102841505B (en) * | 2011-06-22 | 2015-06-17 | 上海微电子装备有限公司 | Substrate-precise-positioning workpiece stage |
| US9082799B2 (en) * | 2012-09-20 | 2015-07-14 | Varian Semiconductor Equipment Associates, Inc. | System and method for 2D workpiece alignment |
| CN106571329A (en) * | 2015-10-12 | 2017-04-19 | 沈阳拓荆科技有限公司 | Wafer substrate support rack structure |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3158485B2 (en) * | 1991-04-23 | 2001-04-23 | ソニー株式会社 | Cathode ray tube positioning device |
| JP3160690B2 (en) * | 1993-10-18 | 2001-04-25 | 東京エレクトロン株式会社 | Processing method |
| JPH07147311A (en) * | 1993-11-24 | 1995-06-06 | Tokyo Electron Ltd | Transfer arm |
| JPH10209250A (en) * | 1997-01-24 | 1998-08-07 | Tabai Espec Corp | Sample body positioner |
| JPH11116048A (en) * | 1997-10-14 | 1999-04-27 | Nikon Corp | Substrate carrying device |
| JPH11145266A (en) * | 1997-11-07 | 1999-05-28 | Tokyo Electron Ltd | Apparatus and method of electrostatic chucking, and apparatus and method of transferring substrate using the same |
| JP2003124292A (en) * | 2001-10-19 | 2003-04-25 | St Lcd Kk | Position correcting device and guide device of planer member |
| JP2003239952A (en) * | 2002-02-12 | 2003-08-27 | Takai Corporation:Kk | Ball plunger with collar having ball rotating securely |
-
2005
- 2005-04-04 TW TW094110689A patent/TWI278082B/en not_active IP Right Cessation
- 2005-04-04 KR KR1020067018597A patent/KR100847347B1/en active IP Right Grant
- 2005-04-04 WO PCT/JP2005/006615 patent/WO2005098935A1/en active Application Filing
- 2005-04-04 CN CNB2005800098494A patent/CN100479129C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100847347B1 (en) | 2008-07-21 |
| CN1938843A (en) | 2007-03-28 |
| TW200534451A (en) | 2005-10-16 |
| TWI278082B (en) | 2007-04-01 |
| KR20060126597A (en) | 2006-12-07 |
| WO2005098935A1 (en) | 2005-10-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100479129C (en) | Positioning table for substrate, positioning equipment for the substrate, and positioning method of the substrate | |
| JP6512248B2 (en) | Transport apparatus, transport method, exposure apparatus, and device manufacturing method | |
| CN100392409C (en) | Probe, probe assembly method and probe plate | |
| KR100795657B1 (en) | Substrate processing apparatus | |
| JP5572575B2 (en) | Substrate positioning apparatus, substrate processing apparatus, substrate positioning method, and storage medium storing program | |
| TWI627693B (en) | Substrate processing apparatus and substrate processing method | |
| JP2005062819A (en) | High-precision gas bearing axially divided stage for conveyance and restraint of large-sized flat-plate flexible medium in processing | |
| JP5265099B2 (en) | Board inspection equipment | |
| KR19980019115A (en) | COATING APPARATUS FOR SEMICONDUCTOR PROCESS | |
| JP2008147291A (en) | Substrate supporting apparatus, substrate supporting method, substrate working apparatus, substrate working method, and manufacturing method of display device component | |
| JP4545625B2 (en) | Substrate positioning table, substrate positioning equipment, and substrate positioning method | |
| JP4490521B2 (en) | Rotation drive mechanism, mounting mechanism for inspection object, and inspection device | |
| KR101423811B1 (en) | A positiong apparatus, a substrate processing apparatus and method for fixing a reference member | |
| JP2003258071A (en) | Substrate holding apparatus and aligner | |
| JP4971416B2 (en) | Placement mechanism for test object | |
| JP5165718B2 (en) | Substrate processing equipment | |
| JP7096746B2 (en) | A board processing device including a board transfer device and a board transfer device. | |
| JP5349770B2 (en) | Coating apparatus and coating method | |
| CN114121768B (en) | Substrate processing apparatus and substrate processing method | |
| JP2020136622A (en) | Jig for adjustment, adjustment method, and position deviation measurement method | |
| KR101428659B1 (en) | Apparatus for testing | |
| US20230163018A1 (en) | Substrate holding apparatus and substrate processing apparatus | |
| JP2008147292A (en) | Substrate supporting apparatus, substrate supporting method, substrate working apparatus, substrate working method, and manufacturing method of display device component | |
| US20210249293A1 (en) | Substrate positioning apparatus, substrate positioning method, and bonding apparatus | |
| WO2020129714A1 (en) | Substrate processing apparatus and substrate processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090415 Termination date: 20160404 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |