CN100462715C - 印刷焊锡检查装置 - Google Patents

印刷焊锡检查装置 Download PDF

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Publication number
CN100462715C
CN100462715C CNB2005100095515A CN200510009551A CN100462715C CN 100462715 C CN100462715 C CN 100462715C CN B2005100095515 A CNB2005100095515 A CN B2005100095515A CN 200510009551 A CN200510009551 A CN 200510009551A CN 100462715 C CN100462715 C CN 100462715C
Authority
CN
China
Prior art keywords
aforementioned
light
light beam
deflector
beam split
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100095515A
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English (en)
Chinese (zh)
Other versions
CN1661362A (zh
Inventor
益田纪彦
田下贵久
菅井雅也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anritsu Corp
Original Assignee
Anritsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anritsu Corp filed Critical Anritsu Corp
Publication of CN1661362A publication Critical patent/CN1661362A/zh
Application granted granted Critical
Publication of CN100462715C publication Critical patent/CN100462715C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/10—Segmentation; Edge detection
    • G06T7/136—Segmentation; Edge detection involving thresholding
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Inking, Control Or Cleaning Of Printing Machines (AREA)
CNB2005100095515A 2004-02-25 2005-02-21 印刷焊锡检查装置 Expired - Fee Related CN100462715C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004049336 2004-02-25
JP2004049336A JP4014571B2 (ja) 2004-02-25 2004-02-25 印刷はんだ検査装置

Publications (2)

Publication Number Publication Date
CN1661362A CN1661362A (zh) 2005-08-31
CN100462715C true CN100462715C (zh) 2009-02-18

Family

ID=35010799

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100095515A Expired - Fee Related CN100462715C (zh) 2004-02-25 2005-02-21 印刷焊锡检查装置

Country Status (4)

Country Link
JP (1) JP4014571B2 (ko)
KR (1) KR100632650B1 (ko)
CN (1) CN100462715C (ko)
TW (1) TWI274866B (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699179B2 (ja) * 2005-11-10 2011-06-08 日本オートマチックマシン株式会社 電線端末部の芯線検査装置
NO336441B1 (no) * 2012-01-24 2015-08-17 Tomra Sorting As Anordning, system og fremgangsmåte for optisk detektering av materie
US9551569B2 (en) * 2014-10-13 2017-01-24 Hermes-Epitek Corporation Apparatus and method for curvature and thin film stress measurement
CN105093256B (zh) * 2015-06-29 2017-12-01 京东方科技集团股份有限公司 一种射线检测基板及其制造方法和射线探测器
CN105864144B (zh) * 2016-05-23 2019-01-22 重庆德盟液压机械有限公司 囊膜式液压缸或气缸
CN106018434B (zh) * 2016-07-06 2018-12-28 康代影像科技(苏州)有限公司 一种光学检测设备
JP6306230B1 (ja) * 2017-02-09 2018-04-04 Ckd株式会社 半田印刷検査装置、半田印刷検査方法、及び、基板の製造方法
JP2019100753A (ja) * 2017-11-29 2019-06-24 アンリツ株式会社 プリント基板検査装置及びプリント基板検査方法
JP2020046341A (ja) * 2018-09-20 2020-03-26 パイオニア株式会社 投光装置、投受光装置及び測距装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113355A (en) * 1980-12-30 1982-07-14 Fujitsu Ltd Pattern detection
JPS62232545A (ja) * 1986-04-01 1987-10-13 Kobe Steel Ltd 表面欠陥検出方法
JPH04232951A (ja) * 1990-12-28 1992-08-21 Canon Inc 面状態検査装置
JPH04279846A (ja) * 1991-03-08 1992-10-05 Fujitsu Ltd 光学式検査装置
JPH0921759A (ja) * 1995-07-10 1997-01-21 Hitachi Electron Eng Co Ltd 基板の異物検査装置
CN1158464A (zh) * 1995-12-14 1997-09-03 富士通株式会社 条形码读出装置
JP2002228597A (ja) * 2001-01-31 2002-08-14 Anritsu Corp 印刷半田検査装置及び方法
JP2003097924A (ja) * 2001-09-21 2003-04-03 Matsushita Electric Ind Co Ltd 形状測定装置および測定方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57113355A (en) * 1980-12-30 1982-07-14 Fujitsu Ltd Pattern detection
JPS62232545A (ja) * 1986-04-01 1987-10-13 Kobe Steel Ltd 表面欠陥検出方法
JPH04232951A (ja) * 1990-12-28 1992-08-21 Canon Inc 面状態検査装置
JPH04279846A (ja) * 1991-03-08 1992-10-05 Fujitsu Ltd 光学式検査装置
JPH0921759A (ja) * 1995-07-10 1997-01-21 Hitachi Electron Eng Co Ltd 基板の異物検査装置
CN1158464A (zh) * 1995-12-14 1997-09-03 富士通株式会社 条形码读出装置
JP2002228597A (ja) * 2001-01-31 2002-08-14 Anritsu Corp 印刷半田検査装置及び方法
JP2003097924A (ja) * 2001-09-21 2003-04-03 Matsushita Electric Ind Co Ltd 形状測定装置および測定方法

Also Published As

Publication number Publication date
JP4014571B2 (ja) 2007-11-28
TW200529721A (en) 2005-09-01
TWI274866B (en) 2007-03-01
CN1661362A (zh) 2005-08-31
JP2005241336A (ja) 2005-09-08
KR20060043034A (ko) 2006-05-15
KR100632650B1 (ko) 2006-10-12

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20090218

Termination date: 20160221