CN100418768C - 介电体、压电体、喷墨头、喷墨记录装置及喷墨头制造方法 - Google Patents

介电体、压电体、喷墨头、喷墨记录装置及喷墨头制造方法 Download PDF

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Publication number
CN100418768C
CN100418768C CNB2005100625742A CN200510062574A CN100418768C CN 100418768 C CN100418768 C CN 100418768C CN B2005100625742 A CNB2005100625742 A CN B2005100625742A CN 200510062574 A CN200510062574 A CN 200510062574A CN 100418768 C CN100418768 C CN 100418768C
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China
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layer
orientation
dielectric
mentioned
substrate
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Chinese (zh)
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CN1676331A (zh
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武田宪一
伊福俊博
福井哲朗
舟洼浩
冈本庄司
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Canon Inc
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Canon Inc
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877Conductive materials
    • H10N30/878Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8548Lead-based oxides
    • H10N30/8554Lead-zirconium titanate [PZT] based
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Ceramic Capacitors (AREA)
  • Semiconductor Memories (AREA)
CNB2005100625742A 2004-03-29 2005-03-29 介电体、压电体、喷墨头、喷墨记录装置及喷墨头制造方法 Expired - Fee Related CN100418768C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004-094597 2004-03-29
JP2004094597 2004-03-29
JP2004094597 2004-03-29

Publications (2)

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CN1676331A CN1676331A (zh) 2005-10-05
CN100418768C true CN100418768C (zh) 2008-09-17

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CNB2005100625742A Expired - Fee Related CN100418768C (zh) 2004-03-29 2005-03-29 介电体、压电体、喷墨头、喷墨记录装置及喷墨头制造方法

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Country Link
US (1) US7265483B2 (enExample)
EP (1) EP1585180B1 (enExample)
JP (2) JP2005313628A (enExample)
KR (1) KR100777468B1 (enExample)
CN (1) CN100418768C (enExample)
DE (1) DE602005024208D1 (enExample)
TW (1) TWI253392B (enExample)

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US7453144B2 (en) * 2005-06-29 2008-11-18 Intel Corporation Thin film capacitors and methods of making the same
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JP5743059B2 (ja) * 2011-01-19 2015-07-01 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外線センサー
JP5751407B2 (ja) * 2011-01-19 2015-07-22 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外線センサー
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JP6020784B2 (ja) * 2011-01-19 2016-11-02 セイコーエプソン株式会社 圧電素子、液体噴射ヘッド、液体噴射装置、超音波デバイス及びセンサー
CN102136315B (zh) * 2011-03-21 2012-08-15 四川师范大学 多层陶瓷全面积LNO/Ag/LNO复合电极及制备方法
WO2013018603A1 (ja) * 2011-07-29 2013-02-07 株式会社村田製作所 弾性波デバイスの製造方法
JP5836754B2 (ja) * 2011-10-04 2015-12-24 富士フイルム株式会社 圧電体素子及びその製造方法
US8866367B2 (en) 2011-10-17 2014-10-21 The United States Of America As Represented By The Secretary Of The Army Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making
US9761785B2 (en) 2011-10-17 2017-09-12 The United States Of America As Represented By The Secretary Of The Army Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing
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JP5382196B2 (ja) * 2012-12-27 2014-01-08 セイコーエプソン株式会社 液体吐出ヘッドの製造方法
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106183419A (zh) * 2013-08-09 2016-12-07 精工爱普生株式会社 液体喷射头以及液体喷射装置
CN106183419B (zh) * 2013-08-09 2018-05-22 精工爱普生株式会社 液体喷射头以及液体喷射装置

Also Published As

Publication number Publication date
US20050213020A1 (en) 2005-09-29
TW200602195A (en) 2006-01-16
TWI253392B (en) 2006-04-21
JP2011192975A (ja) 2011-09-29
KR20060044810A (ko) 2006-05-16
KR100777468B1 (ko) 2007-11-20
EP1585180A2 (en) 2005-10-12
US7265483B2 (en) 2007-09-04
CN1676331A (zh) 2005-10-05
EP1585180A3 (en) 2007-10-03
JP2005313628A (ja) 2005-11-10
DE602005024208D1 (de) 2010-12-02
EP1585180B1 (en) 2010-10-20

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