CN100413898C - 聚合物组合物及其用途 - Google Patents

聚合物组合物及其用途 Download PDF

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Publication number
CN100413898C
CN100413898C CNB2005101269054A CN200510126905A CN100413898C CN 100413898 C CN100413898 C CN 100413898C CN B2005101269054 A CNB2005101269054 A CN B2005101269054A CN 200510126905 A CN200510126905 A CN 200510126905A CN 100413898 C CN100413898 C CN 100413898C
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CN
China
Prior art keywords
group
polymkeric substance
alkyl
monomer
acid
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Expired - Fee Related
Application number
CNB2005101269054A
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English (en)
Chinese (zh)
Other versions
CN1789300A (zh
Inventor
L·F·罗德斯
R·维卡里
L·J·兰格斯多弗
A·A·索比克
E·P·博伊德
B·本乃特
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Publication of CN1789300A publication Critical patent/CN1789300A/zh
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Publication of CN100413898C publication Critical patent/CN100413898C/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNB2005101269054A 2001-12-12 2002-12-12 聚合物组合物及其用途 Expired - Fee Related CN100413898C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34052601P 2001-12-12 2001-12-12
US60/340,526 2001-12-12

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB028190815A Division CN1253485C (zh) 2001-12-12 2002-12-12 聚合物组合物及其用途

Publications (2)

Publication Number Publication Date
CN1789300A CN1789300A (zh) 2006-06-21
CN100413898C true CN100413898C (zh) 2008-08-27

Family

ID=23333763

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2005101269054A Expired - Fee Related CN100413898C (zh) 2001-12-12 2002-12-12 聚合物组合物及其用途
CNB028190815A Expired - Fee Related CN1253485C (zh) 2001-12-12 2002-12-12 聚合物组合物及其用途

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB028190815A Expired - Fee Related CN1253485C (zh) 2001-12-12 2002-12-12 聚合物组合物及其用途

Country Status (9)

Country Link
US (2) US6949609B2 (enExample)
EP (1) EP1461373B1 (enExample)
JP (1) JP4389158B2 (enExample)
KR (1) KR100880313B1 (enExample)
CN (2) CN100413898C (enExample)
AT (1) ATE354599T1 (enExample)
AU (1) AU2002358247A1 (enExample)
DE (1) DE60218342T2 (enExample)
WO (1) WO2003050158A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7442487B2 (en) * 2003-12-30 2008-10-28 Intel Corporation Low outgassing and non-crosslinking series of polymers for EUV negative tone photoresists
US7101654B2 (en) * 2004-01-14 2006-09-05 Promerus Llc Norbornene-type monomers and polymers containing pendent lactone or sultone groups
US20050192409A1 (en) * 2004-02-13 2005-09-01 Rhodes Larry F. Polymers of polycyclic olefins having a polyhedral oligosilsesquioxane pendant group and uses thereof
US7524594B2 (en) * 2004-07-07 2009-04-28 Promerus Llc Photosensitive dielectric resin compositions, films formed therefrom and semiconductor and display devices encompassing such films
JP2006100563A (ja) * 2004-09-29 2006-04-13 Sumitomo Bakelite Co Ltd 半導体装置
JP5017793B2 (ja) * 2005-04-06 2012-09-05 Ｊｓｒ株式会社 環状オレフィン系付加重合体の製造方法
JP2006321912A (ja) * 2005-05-19 2006-11-30 Jsr Corp 環状オレフィン系付加重合体の製造方法
JP2007002082A (ja) * 2005-06-23 2007-01-11 Jsr Corp 環状オレフィン系付加重合体の製造方法
JP2007009044A (ja) * 2005-06-30 2007-01-18 Jsr Corp 環状オレフィン付加重合体の製造方法および環状オレフィン付加重合体
JP4956956B2 (ja) * 2005-10-12 2012-06-20 Ｊｓｒ株式会社 水素化触媒および水素化重合体の製造方法
JP4826242B2 (ja) 2005-12-12 2011-11-30 Ｊｓｒ株式会社 環状オレフィン系付加重合体の製造方法
HUE042388T2 (hu) * 2007-06-07 2019-06-28 Albemarle Corp Adduktok, adduktok és oligomerek, vagy adduktok, oligomerek és kis molekulatömegû polimerek, és elõállításuk
EP2072536A1 (en) * 2007-12-17 2009-06-24 Lanxess Inc. Hydrogenation of diene-based polymers
JP2009256468A (ja) * 2008-04-16 2009-11-05 Asahi Glass Co Ltd 含フッ素重合体の製造方法
JP5051185B2 (ja) * 2009-06-16 2012-10-17 住友ベークライト株式会社 半導体装置および樹脂組成物
CN103874731B (zh) 2011-09-07 2017-02-15 微量化学公司 用于在低表面能基底上制造浮雕图案的环氧制剂和方法
US11635688B2 (en) * 2012-03-08 2023-04-25 Kayaku Advanced Materials, Inc. Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates
US8846295B2 (en) 2012-04-27 2014-09-30 International Business Machines Corporation Photoresist composition containing a protected hydroxyl group for negative development and pattern forming method using thereof
CN106068569B (zh) * 2014-03-12 2019-03-22 默克专利股份有限公司 有机电子组合物及其器件

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997033198A1 (en) * 1996-03-07 1997-09-12 The B.F. Goodrich Company Photoresist compositions comprising polycyclic polymers with acid labile pendant groups
US6294616B1 (en) * 1995-05-25 2001-09-25 B. F. Goodrich Company Blends and alloys of polycyclic polymers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4491628A (en) 1982-08-23 1985-01-01 International Business Machines Corporation Positive- and negative-working resist compositions with acid generating photoinitiator and polymer with acid labile groups pendant from polymer backbone
GB9120773D0 (en) * 1991-10-01 1991-11-13 Ici Plc Modified olefin polymers
US5372912A (en) 1992-12-31 1994-12-13 International Business Machines Corporation Radiation-sensitive resist composition and process for its use
US5468819A (en) 1993-11-16 1995-11-21 The B.F. Goodrich Company Process for making polymers containing a norbornene repeating unit by addition polymerization using an organo (nickel or palladium) complex
JP3804138B2 (ja) * 1996-02-09 2006-08-02 Ｊｓｒ株式会社 ＡｒＦエキシマレーザー照射用感放射線性樹脂組成物
US6294615B1 (en) * 1997-12-08 2001-09-25 Tosch Corporation Copolymer, cationic high molecular weight flocculating agent comprising the copolymer, and process for producing the copolymer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6294616B1 (en) * 1995-05-25 2001-09-25 B. F. Goodrich Company Blends and alloys of polycyclic polymers
WO1997033198A1 (en) * 1996-03-07 1997-09-12 The B.F. Goodrich Company Photoresist compositions comprising polycyclic polymers with acid labile pendant groups
US6136499A (en) * 1996-03-07 2000-10-24 The B. F. Goodrich Company Photoresist compositions comprising polycyclic polymers with acid labile pendant groups

Also Published As

Publication number Publication date
US20030176583A1 (en) 2003-09-18
AU2002358247A1 (en) 2003-06-23
EP1461373A1 (en) 2004-09-29
CN1789300A (zh) 2006-06-21
JP4389158B2 (ja) 2009-12-24
CN1561355A (zh) 2005-01-05
EP1461373B1 (en) 2007-02-21
DE60218342T2 (de) 2007-10-31
HK1071385A1 (en) 2005-07-15
JP2005511833A (ja) 2005-04-28
KR100880313B1 (ko) 2009-01-28
US7612146B2 (en) 2009-11-03
DE60218342D1 (de) 2007-04-05
WO2003050158A1 (en) 2003-06-19
KR20040065209A (ko) 2004-07-21
US20060025540A1 (en) 2006-02-02
ATE354599T1 (de) 2007-03-15
CN1253485C (zh) 2006-04-26
US6949609B2 (en) 2005-09-27

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20080827

Termination date: 20131212