CN100406139C - 涂布装置 - Google Patents
涂布装置 Download PDFInfo
- Publication number
- CN100406139C CN100406139C CNB2005101202622A CN200510120262A CN100406139C CN 100406139 C CN100406139 C CN 100406139C CN B2005101202622 A CNB2005101202622 A CN B2005101202622A CN 200510120262 A CN200510120262 A CN 200510120262A CN 100406139 C CN100406139 C CN 100406139C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- nozzle
- coating
- objective table
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004375305A JP4573645B2 (ja) | 2004-12-27 | 2004-12-27 | 塗布装置 |
JP2004375305 | 2004-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1796001A CN1796001A (zh) | 2006-07-05 |
CN100406139C true CN100406139C (zh) | 2008-07-30 |
Family
ID=36734900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101202622A Expired - Fee Related CN100406139C (zh) | 2004-12-27 | 2005-11-09 | 涂布装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4573645B2 (zh) |
KR (1) | KR100725824B1 (zh) |
CN (1) | CN100406139C (zh) |
TW (1) | TWI295196B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4573655B2 (ja) * | 2005-01-26 | 2010-11-04 | 大日本スクリーン製造株式会社 | 塗布装置 |
JP4922825B2 (ja) * | 2007-05-17 | 2012-04-25 | 大日本スクリーン製造株式会社 | 塗布装置 |
JP4964023B2 (ja) * | 2007-05-22 | 2012-06-27 | 大日本スクリーン製造株式会社 | 塗布装置 |
TW200911389A (en) * | 2007-08-17 | 2009-03-16 | Dainippon Screen Mfg | Nozzle keeping device and coating device |
JP5096106B2 (ja) * | 2007-10-30 | 2012-12-12 | 芝浦メカトロニクス株式会社 | 液滴塗布装置 |
JP5342282B2 (ja) * | 2009-03-17 | 2013-11-13 | 大日本スクリーン製造株式会社 | 塗布装置 |
JP5578377B2 (ja) * | 2011-07-29 | 2014-08-27 | セメス株式会社 | 基板処理装置及び方法 |
CN102320753A (zh) * | 2011-08-09 | 2012-01-18 | 深圳市华星光电技术有限公司 | 玻璃基板的涂布设备及其涂布方法 |
CN104941869B (zh) * | 2015-07-03 | 2018-03-02 | 深圳市华星光电技术有限公司 | 涂布装置 |
CN105594781A (zh) * | 2015-11-26 | 2016-05-25 | 夏柳发 | 蛋糕刷油机 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5776250A (en) * | 1995-12-29 | 1998-07-07 | Samsung Electronics Co., Ltd. | Device for recovering photoresist material exhausted from a spin coater |
JP2003031460A (ja) * | 2001-07-11 | 2003-01-31 | Tokyo Electron Ltd | 液処理装置及びその方法 |
JP2003109894A (ja) * | 2001-07-23 | 2003-04-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3656387B2 (ja) * | 1998-01-14 | 2005-06-08 | 松下電器産業株式会社 | カラー表示pdpの蛍光体形成方法および装置 |
JP2001166938A (ja) * | 1999-09-29 | 2001-06-22 | Toshiba Corp | エンタープライズシステムの構築方法 |
JP2001210757A (ja) * | 2000-01-25 | 2001-08-03 | Toshiba Corp | 樹脂封止型半導体素子 |
JP3992530B2 (ja) * | 2002-04-16 | 2007-10-17 | 大日本スクリーン製造株式会社 | 基板処理方法とその装置 |
JP3844670B2 (ja) * | 2001-09-14 | 2006-11-15 | 東京エレクトロン株式会社 | 塗布膜形成装置 |
-
2004
- 2004-12-27 JP JP2004375305A patent/JP4573645B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-13 KR KR1020050096457A patent/KR100725824B1/ko not_active IP Right Cessation
- 2005-10-14 TW TW094135829A patent/TWI295196B/zh not_active IP Right Cessation
- 2005-11-09 CN CNB2005101202622A patent/CN100406139C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5776250A (en) * | 1995-12-29 | 1998-07-07 | Samsung Electronics Co., Ltd. | Device for recovering photoresist material exhausted from a spin coater |
JP2003031460A (ja) * | 2001-07-11 | 2003-01-31 | Tokyo Electron Ltd | 液処理装置及びその方法 |
JP2003109894A (ja) * | 2001-07-23 | 2003-04-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100725824B1 (ko) | 2007-06-08 |
CN1796001A (zh) | 2006-07-05 |
TW200621380A (en) | 2006-07-01 |
TWI295196B (en) | 2008-04-01 |
JP2006181410A (ja) | 2006-07-13 |
JP4573645B2 (ja) | 2010-11-04 |
KR20060074821A (ko) | 2006-07-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20191109 |