CN100405884C - 柔性电路板的贯通电连接 - Google Patents

柔性电路板的贯通电连接 Download PDF

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CN100405884C
CN100405884C CNB028094425A CN02809442A CN100405884C CN 100405884 C CN100405884 C CN 100405884C CN B028094425 A CNB028094425 A CN B028094425A CN 02809442 A CN02809442 A CN 02809442A CN 100405884 C CN100405884 C CN 100405884C
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conducting wire
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安多·韦林
马赛厄斯·伯格曼
乔基姆·霍普
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Jiejia De Mobile Safety Co Ltd
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Abstract

本发明公开了一种柔性电路板的贯通电连接，其中位于两对置表面的两导电层借助一个简单的、用于形成通路的切割工具割穿电路板而彼此电连接。然后将一确定量的导电材料选择地嵌入到该通孔中。

Description

柔性电路板的贯通电连接
本发明涉及一种适于安装在一智能卡中的柔性电路板的贯通电连接(throughplating)。尤其是本发明涉及一种用于带集成电路的卡(IC卡或智能卡)的基板，其在两个对置的表面上具有通过基板彼此电连接的导电层，本发明还涉及一种相应的卡和一种制造这样一种基板的方法。
这样一种基板或这样的电路板通常作为卡的嵌入件集成在IC卡(证件卡、信用卡、自动提款卡等)中，且构成该卡体的独立层。在电路板的一侧例如可以有一个由带有其他电子元件的导电层构成的集成电路，而电路板的另一侧的导电层例如形成一个用于与通过该电路板与所述集成电路电连接的外部设备进行无接触数据交换的天线线圈。这也涉及到“贯通电连接”或“金属包覆地贯穿”所述电路板。
贯通电连接通常借助中压或钻通孔来完成，并将一个金属套筒插入其中以将两相对置的导电层电连接。这样的贯通电连接是费事的，且因此是昂贵的。
在欧洲专利申请公开说明书EP-A 0 884 973中公开了一种用于将单层或多层电路板贯通电连接的方法，其中首先在板上生成孔，然后在该板上印上导电膏。通过形成真空，将导电膏吸入到接触孔中。为了得到可靠的贯通电连接必须在第一真空步骤中将导电膏吸入到通孔中，且在第二真空步骤中将导电膏吸回，以确保导电材料的均匀分布。
本发明要解决的技术问题是使形成柔性电路板的贯通电连接的制作得以简化。
按照本发明，上述技术问题通过由独立权利要求的技术特征所限定的一种用于IC卡的基板、一种相应的卡以及一种相应的生产方法来解决。本发明的优选实施方式和改进在它们的从属权利要求中给出。
相应地，既不是在电路板上中出通孔，也不是钻出通孔，而是简单地借助一切割工具，如扁钢切刀、剪切中头、刀、激光或其他类似手段在电路板上形成一切口形通路。作为一种替换方式，可以通过加压和加热移走通路区域的基板材料，从而使对置的导电层彼此接触。
可以在导电线路已设置在基板上的情况下形成通路；作为替换方式，还可在形成通路之后再将导电线路敷设在基板上。
贯通电连接可以优选由一个多个切口形通路或一个十字形通路来构成。
在本发明的另一优选实施方式中，为切口通路所作的切割选择得很短，从而仅仅形成一个点状切口。优选采用针来完成这样的切口。
如果对于贯通电连接是必要的话，则在该通路中充填导电材料，但不要求此通路完全充填。在两层位于电路板两对置表面的导电层之间形成电连接就足够了。导电材料必须与这两层都相连接。
导电材料可以是任何要求的材料，其中优选采用一种液态导电粘结剂，它容易敷设在贯通开口上，并流入到贯通开口中，可能的话还由于相当小的贯通开口的横截面而受毛细作用力的影响。
可以优选借助一滴管针或借助漏模印刷或喷墨印刷在一侧或两侧敷设导电材料。
为了敷设导电材料，尤其是液态导电粘结剂，优选采用中空的滴管针，从而一确定量的材料通过该针供给到针尖。
按照第一种优选实施方式，在将滴管针导送到通路之前，先将一确定量的材料提供到滴管针的针尖(事先计量)，例如作为材料滴悬挂在针尖上。
按照第二种优选实施方式，先将滴管针导送到通路中(后计量)，然后再将材料通过针注射到通路中。还可以将事先计量和后计量结合起来。
为使用银导电膏或炭墨作为贯通电连接的导电材料，漏模印刷是特别合适的。
当采用导电墨时，优选采用喷墨印刷技术。鉴于导电墨的良好流动性能，这种技术对带有切口形通路的贯通电连接来说特别有利，因为导电墨比粘性材料更容易穿透过切口形通路。
本发明的方法和用此方法生产的基板或电路板和IC卡相对于传统的贯通电连接而言具有的优点是：形成通孔和实现接触两者可以用简单的手段十分经济地实现。不需要复杂的设备或昂贵的辅助材料，而且用于嵌入的导电材料的计量过程可十分方便地加以控制。
如果切口形通路与基板表面相倾斜地构成，则可以省去使用其他导电材料。在这种情况，足以使由倾斜切口形成的舌片推压得彼此错开，从而在基板上对置的导电线路相接触，即在基板顶部的导电线路与基板底部的导电线路相接触。通常借助层压贴合将其装入卡中，从而使连接更稳定。
作为一种替换方式，贯通电连接可以采用一种切割点或切割棱可加热的工具来形成。将该加热的工具放在基板一侧的导电线路上施加压力。这使得位于导电线路下的基板变软，从而移走基板材料，在基板第一侧上的导电线路与该基板第二侧上的导电线路相接触，因而形成电连接。于是在这种情况下通路仅关系到基板材料，而导电线路不会损坏。
下面结合附图和实施方式对本发明加以说明：
图1A和图1b示出了本发明基板的正面和背面；
图2a至图2e示出了本发明贯通电连接柔性电路板的不同实施方式。
图1a示出了适于安装在一卡体上的基板1的正面。在基板的这一侧上，示出了一个用于与一外部设备进行无接触数据和能量交换的线圈形式的导电层2。设置在基板1运一侧的线圈具有接触面4和5，接触面5用来与模块相连接。该线圈另一个与集成电路的接触是借助接触面6来完成的，所述接触面6通过贯通电连接8与第二导电层3相连接，其在基板1背面(参见图1b)上为第二线圈的形式。
贯通电连接在图1中以充填有导电材料的十字形通路8来实现。以此通路来实现与基板背面上线圈3的电接触。另一个同类的贯通电连接7使接触面4和线圈3相连接。如从图1b可看到的那样，为贯通电连接设置了接触面61和41。
图2a中以横截面方式示出了贯通电连接8，其中第一切割线用黑色示出，在该处的第二切割线与其相垂直，以灰色表示。图2a中还示出第二类通路，多个通路，在图中所示情况为双通路。
在图2a中示出的通路充填有例如在一侧或两侧用滴管针敷设的导电材料。作为一种替换方式，可以根据所使用导电材料的的类型采用漏模印刷或喷墨印刷的方法。
如果在形成开口或加大开口的同时或紧接之后将待贯通电连接的地方或区域稍稍弯曲一下，导电材料的穿透可以很容易地完成。
图2b示出了本发明的一种实施方式，其中用一个尖端或棱边优选被加热的工具向一接触面6施加压力。该加热和压力将接触面6压向接触面61，形成电连接。位于该区域的基板由于加热至少变成粘滞的，于是可以很容易地移走。
图2c示出了一个从两侧施加压力和加热的实施方式。
所使用的工具优选为一个烙铁头或超声头。这些工具不用作很大努力就可以适用于各种要求。
图2d示出了一种实施方式，其中切口以与表面相倾斜方式穿过基板和线圈的导电接触面。在这种切口的情况下，可以采用类似于图1a的例子中的导电材料，以在对置的接触面6和61之间形成电接触。
作为一种替换方式，在这种切口的实施方式中，可以通过加压将两个舌片91和92彼此推压错开(图2e)，从而对置的接触面相接触，于是形成电接触。因此，位于基板顶部的接触面6的一部分与位于基板底部的接触面61的一部分相接触。
为了生成图2a、2d和2e所示的切口，优选采用切割冲头或刀。采用激光或类似工具也能得到良好的结果。

Claims (4)

1.一种用于带有集成电路的卡的基板(1)，该基板在两对置表面上涂覆有导电材料层，且如此形成的两导电层穿过该基板彼此电连接，其特征在于：具有一个穿过所述基板和所述两导电层的切口形通路(2，3)，所述切口形通路与所述表面相倾斜地延伸，由所述切口形通路形成的舌片彼此推压错开，从而在该基板顶部的导电线路与基板底部的导电线路相接触。
2.一种带有集成电路的卡，包括一块如权利要求1所述的基板(1)。
3.按照权利要求2所述的卡，其特征在于：所述基板(1)构成该卡体的一层。
4.一种生产权利要求1所述的基板(1)的方法，包括下述步骤：
-为该基板(1)提供两层位于该基板两对置表面的导电层(2，3)，
-借助一切割工具(10)切割穿过该基板(1)和所述两导电层(2，3)，从而在移走该工具后保留一切口形通路，
-所述切口形通路与所述表面相倾斜地延伸，
-将由所述切口形通路形成的舌片彼此推压错开，从而使在该基板顶部的导电线路与基板底部的导电线路相接触。
CNB028094425A 2001-05-09 2002-05-06 柔性电路板的贯通电连接 Expired - Fee Related CN100405884C (zh)

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