CN100349962C - 硅氧烷共聚物、其制备方法、和热固性树脂组合物 - Google Patents

硅氧烷共聚物、其制备方法、和热固性树脂组合物 Download PDF

Info

Publication number
CN100349962C
CN100349962C CNB2004100550915A CN200410055091A CN100349962C CN 100349962 C CN100349962 C CN 100349962C CN B2004100550915 A CNB2004100550915 A CN B2004100550915A CN 200410055091 A CN200410055091 A CN 200410055091A CN 100349962 C CN100349962 C CN 100349962C
Authority
CN
China
Prior art keywords
group
hydrogen
siloxane copolymer
general formula
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100550915A
Other languages
English (en)
Chinese (zh)
Other versions
CN1583835A (zh
Inventor
菅生道博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Publication of CN1583835A publication Critical patent/CN1583835A/zh
Application granted granted Critical
Publication of CN100349962C publication Critical patent/CN100349962C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54—Nitrogen-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
CNB2004100550915A 2003-06-02 2004-06-02 硅氧烷共聚物、其制备方法、和热固性树脂组合物 Expired - Fee Related CN100349962C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003156226A JP3952194B2 (ja) 2003-06-02 2003-06-02 シロキサン共重合体及びその製造方法並びにそれを用いた熱硬化性樹脂組成物
JP156226/2003 2003-06-02

Publications (2)

Publication Number Publication Date
CN1583835A CN1583835A (zh) 2005-02-23
CN100349962C true CN100349962C (zh) 2007-11-21

Family

ID=33157126

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100550915A Expired - Fee Related CN100349962C (zh) 2003-06-02 2004-06-02 硅氧烷共聚物、其制备方法、和热固性树脂组合物

Country Status (7)

Country Link
US (1) US7163986B2 (enExample)
EP (1) EP1484353B1 (enExample)
JP (1) JP3952194B2 (enExample)
KR (1) KR101015738B1 (enExample)
CN (1) CN100349962C (enExample)
DE (1) DE602004001920T2 (enExample)
TW (1) TW200504147A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101714386B (zh) 2004-05-11 2012-10-24 松下电器产业株式会社 再现装置、再现方法
JP2008069210A (ja) * 2006-09-12 2008-03-27 Shin Etsu Chem Co Ltd 多環式炭化水素基含有シリコーン系硬化性組成物
US8038217B2 (en) * 2007-03-29 2011-10-18 Toyota Boshoku Kabushiki Kaisha Vehicle seat
US8084765B2 (en) * 2007-05-07 2011-12-27 Xerox Corporation Electronic device having a dielectric layer
JP5373736B2 (ja) 2010-10-28 2013-12-18 信越化学工業株式会社 接着剤組成物及び接着剤シート、半導体装置保護用材料、及び半導体装置
CN103122068B (zh) * 2012-12-25 2015-07-08 中山大学 一种uv涂料用聚酰亚胺丙烯酸酯低聚物
JP6123354B2 (ja) * 2013-03-01 2017-05-10 Jnc株式会社 熱硬化性組成物
KR102248043B1 (ko) 2014-07-08 2021-05-04 솔브레인 주식회사 스크린 프린팅용 저온 경화성 수지 조성물
US10308787B2 (en) * 2016-04-05 2019-06-04 Shin-Etsu Chemical Co., Ltd. Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
JP6683559B2 (ja) * 2016-04-05 2020-04-22 信越化学工業株式会社 樹脂組成物、樹脂フィルム、樹脂フィルムの製造方法、半導体装置の製造方法及び半導体装置
JP6616743B2 (ja) * 2016-06-30 2019-12-04 信越化学工業株式会社 シリコーン骨格含有高分子化合物、光硬化性樹脂組成物、光硬化性ドライフィルム、積層体、及びパターン形成方法
KR20230006992A (ko) 2021-07-05 2023-01-12 삼성전자주식회사 반도체 장치 제조 방법 및 기판 분리 방법
CN114958199A (zh) * 2022-04-25 2022-08-30 开封夸克新材料有限公司 一种环保型超耐侯预涂板材涂料及其制备方法
EP4780884A1 (en) * 2023-09-19 2026-07-29 Momentive Performance Materials Inc. Imide functional organopolysiloxanes

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044213A (ja) * 1990-04-23 1992-01-08 Sumitomo Bakelite Co Ltd 半導体封止用樹脂の製造方法
JPH10195278A (ja) * 1997-01-10 1998-07-28 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物
EP1184403A2 (en) * 2000-06-29 2002-03-06 Shin-Etsu Chemical Co., Ltd. Polyimide silicone resin, process for its production, and polyimide silicone resin composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404350A (en) * 1982-07-07 1983-09-13 General Electric Company Silicone-imide copolymers and method for making
US4472565A (en) * 1982-11-18 1984-09-18 General Electric Company Silicone-polyimide copolymers, condensation vulcanizable compositions obtained therefrom, and methods for making
US4533737A (en) * 1984-04-02 1985-08-06 General Electric Company Silicon functionalized norbornane carboxyimide and methods for making
US4595732A (en) * 1984-04-27 1986-06-17 General Electric Company Siloxane imide diols and siloxane imide organic block polymers obtained therefrom
JPH0834851A (ja) 1994-07-25 1996-02-06 Sumitomo Bakelite Co Ltd 低温加工性の優れた耐熱性フィルム接着剤及びその製造方法
JP2002012667A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜
JP2003020337A (ja) 2001-07-06 2003-01-24 Nippon Unicar Co Ltd ビスナジイミド−ポリシロキサン交互共重合体又はその誘導体及びそれを配合した電子材料用エポキシ樹脂組成物
JP2004099638A (ja) 2002-09-04 2004-04-02 Shin Etsu Chem Co Ltd イミドシリコーン樹脂およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH044213A (ja) * 1990-04-23 1992-01-08 Sumitomo Bakelite Co Ltd 半導体封止用樹脂の製造方法
JPH10195278A (ja) * 1997-01-10 1998-07-28 Shin Etsu Chem Co Ltd 熱硬化性樹脂組成物
EP1184403A2 (en) * 2000-06-29 2002-03-06 Shin-Etsu Chemical Co., Ltd. Polyimide silicone resin, process for its production, and polyimide silicone resin composition

Also Published As

Publication number Publication date
US7163986B2 (en) 2007-01-16
EP1484353A1 (en) 2004-12-08
JP3952194B2 (ja) 2007-08-01
TW200504147A (en) 2005-02-01
KR101015738B1 (ko) 2011-02-22
DE602004001920D1 (de) 2006-09-28
JP2004359703A (ja) 2004-12-24
TWI332961B (enExample) 2010-11-11
CN1583835A (zh) 2005-02-23
EP1484353B1 (en) 2006-08-16
DE602004001920T2 (de) 2007-03-08
KR20040103788A (ko) 2004-12-09
US20040242829A1 (en) 2004-12-02

Similar Documents

Publication Publication Date Title
JP5522111B2 (ja) シリコーン樹脂組成物及び当該組成物を使用した光半導体装置
CN1207361C (zh) 用于硅橡胶的粘合剂
CN1072429A (zh) 含有锡化合物的组合物
CN1656174A (zh) 槽池寿命改进的组合物
CN1318077A (zh) 含有缩水甘油醚基团的烷氧基硅烷的部分缩合物,硅烷改性树脂,它们的组合物和制备它们的方法
CN1809619A (zh) 具有改进粘合聚合膜的可固化硅氧烷组合物
CN1558931A (zh) 低热膨胀性的热固性树脂组合物以及树脂膜
CN1666326A (zh) 半导体封装件及其制备方法
JP4535245B2 (ja) 部分ブロックポリイミド−ポリシロキサン共重合体及びその製造方法並びに該共重合体を含む樹脂組成物
TWI682009B (zh) 底漆組合物、接著方法、及電氣．電子零件
CN1875071A (zh) 可固化的硅氧烷组合物及其固化产物
CN1165533A (zh) 官能化聚硅氧烷及其制备方法
CN1644623A (zh) 加成交联硅氧烷树脂组合物
JP2011236296A (ja) 新規シルフェニレン骨格含有シリコーン型高分子化合物及びその製造方法
JP2004099638A (ja) イミドシリコーン樹脂およびその製造方法
JP4789663B2 (ja) 熱硬化性組成物及び該組成物から得られる層を備えたフィルム
CN1771126A (zh) 改善了与纸和聚合物膜之间粘附力的纸隔离组合物
CN101044209A (zh) 聚硅氧烷组合物和固化的有机硅树脂
EP1484353B1 (en) Siloxane copolymer, making method, and thermosetting resin composition
CN1944538A (zh) 剥离膜用硅氧烷组合物
US9221849B2 (en) Silane coupling agent, making method, primer composition, and coating composition
CN1850503A (zh) 热压接合用多层橡胶片
CN1315734A (zh) 印刷电路板用绝缘材料
CN1513033A (zh) 室温可固化的硅橡胶组合物
CN101044208A (zh) 有机基氢聚硅氧烷树脂和聚硅氧烷组合物

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20071121

CF01 Termination of patent right due to non-payment of annual fee