TW200504147A - Siloxane copolymer, making method, and thermosetting resin composition - Google Patents
Siloxane copolymer, making method, and thermosetting resin compositionInfo
- Publication number
- TW200504147A TW200504147A TW093115698A TW93115698A TW200504147A TW 200504147 A TW200504147 A TW 200504147A TW 093115698 A TW093115698 A TW 093115698A TW 93115698 A TW93115698 A TW 93115698A TW 200504147 A TW200504147 A TW 200504147A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- thermosetting resin
- making method
- siloxane copolymer
- durability
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003156226A JP3952194B2 (ja) | 2003-06-02 | 2003-06-02 | シロキサン共重合体及びその製造方法並びにそれを用いた熱硬化性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504147A true TW200504147A (en) | 2005-02-01 |
TWI332961B TWI332961B (zh) | 2010-11-11 |
Family
ID=33157126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093115698A TW200504147A (en) | 2003-06-02 | 2004-06-01 | Siloxane copolymer, making method, and thermosetting resin composition |
Country Status (7)
Country | Link |
---|---|
US (1) | US7163986B2 (zh) |
EP (1) | EP1484353B1 (zh) |
JP (1) | JP3952194B2 (zh) |
KR (1) | KR101015738B1 (zh) |
CN (1) | CN100349962C (zh) |
DE (1) | DE602004001920T2 (zh) |
TW (1) | TW200504147A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI728087B (zh) * | 2016-04-05 | 2021-05-21 | 日商信越化學工業股份有限公司 | 樹脂組成物、樹脂薄膜、樹脂薄膜之製造方法、半導體裝置之製造方法及半導體裝置 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2005241787B2 (en) | 2004-05-11 | 2011-08-11 | Panasonic Corporation | Reproducer, program, and reproducing method |
JP2008069210A (ja) * | 2006-09-12 | 2008-03-27 | Shin Etsu Chem Co Ltd | 多環式炭化水素基含有シリコーン系硬化性組成物 |
WO2008120415A1 (ja) * | 2007-03-29 | 2008-10-09 | Toyota Boshoku Kabushiki Kaisha | 車両用シート |
US8084765B2 (en) * | 2007-05-07 | 2011-12-27 | Xerox Corporation | Electronic device having a dielectric layer |
JP5373736B2 (ja) * | 2010-10-28 | 2013-12-18 | 信越化学工業株式会社 | 接着剤組成物及び接着剤シート、半導体装置保護用材料、及び半導体装置 |
CN103122068B (zh) * | 2012-12-25 | 2015-07-08 | 中山大学 | 一种uv涂料用聚酰亚胺丙烯酸酯低聚物 |
JP6123354B2 (ja) * | 2013-03-01 | 2017-05-10 | Jnc株式会社 | 熱硬化性組成物 |
KR102248043B1 (ko) | 2014-07-08 | 2021-05-04 | 솔브레인 주식회사 | 스크린 프린팅용 저온 경화성 수지 조성물 |
US10308787B2 (en) * | 2016-04-05 | 2019-06-04 | Shin-Etsu Chemical Co., Ltd. | Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device |
JP6616743B2 (ja) * | 2016-06-30 | 2019-12-04 | 信越化学工業株式会社 | シリコーン骨格含有高分子化合物、光硬化性樹脂組成物、光硬化性ドライフィルム、積層体、及びパターン形成方法 |
CN114921179A (zh) * | 2022-04-25 | 2022-08-19 | 开封夸克新材料有限公司 | 一种环保型耐高温涂料、制备方法及其应用 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4404350A (en) * | 1982-07-07 | 1983-09-13 | General Electric Company | Silicone-imide copolymers and method for making |
US4472565A (en) * | 1982-11-18 | 1984-09-18 | General Electric Company | Silicone-polyimide copolymers, condensation vulcanizable compositions obtained therefrom, and methods for making |
US4533737A (en) * | 1984-04-02 | 1985-08-06 | General Electric Company | Silicon functionalized norbornane carboxyimide and methods for making |
US4595732A (en) * | 1984-04-27 | 1986-06-17 | General Electric Company | Siloxane imide diols and siloxane imide organic block polymers obtained therefrom |
JPH044213A (ja) | 1990-04-23 | 1992-01-08 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂の製造方法 |
JPH0834851A (ja) | 1994-07-25 | 1996-02-06 | Sumitomo Bakelite Co Ltd | 低温加工性の優れた耐熱性フィルム接着剤及びその製造方法 |
JP3329677B2 (ja) | 1997-01-10 | 2002-09-30 | 信越化学工業株式会社 | 熱硬化性樹脂組成物 |
JP2002012667A (ja) * | 2000-06-29 | 2002-01-15 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン樹脂、その溶液組成物、およびポリイミドシリコーン樹脂皮膜 |
JP2002012666A (ja) | 2000-06-29 | 2002-01-15 | Shin Etsu Chem Co Ltd | ポリイミドシリコーン樹脂、その製造方法およびその組成物 |
JP2003020337A (ja) | 2001-07-06 | 2003-01-24 | Nippon Unicar Co Ltd | ビスナジイミド−ポリシロキサン交互共重合体又はその誘導体及びそれを配合した電子材料用エポキシ樹脂組成物 |
JP2004099638A (ja) | 2002-09-04 | 2004-04-02 | Shin Etsu Chem Co Ltd | イミドシリコーン樹脂およびその製造方法 |
-
2003
- 2003-06-02 JP JP2003156226A patent/JP3952194B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-01 US US10/856,758 patent/US7163986B2/en not_active Expired - Fee Related
- 2004-06-01 KR KR1020040039684A patent/KR101015738B1/ko active IP Right Grant
- 2004-06-01 TW TW093115698A patent/TW200504147A/zh not_active IP Right Cessation
- 2004-06-02 DE DE602004001920T patent/DE602004001920T2/de active Active
- 2004-06-02 CN CNB2004100550915A patent/CN100349962C/zh active Active
- 2004-06-02 EP EP04253272A patent/EP1484353B1/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI728087B (zh) * | 2016-04-05 | 2021-05-21 | 日商信越化學工業股份有限公司 | 樹脂組成物、樹脂薄膜、樹脂薄膜之製造方法、半導體裝置之製造方法及半導體裝置 |
Also Published As
Publication number | Publication date |
---|---|
EP1484353A1 (en) | 2004-12-08 |
US20040242829A1 (en) | 2004-12-02 |
US7163986B2 (en) | 2007-01-16 |
DE602004001920T2 (de) | 2007-03-08 |
CN100349962C (zh) | 2007-11-21 |
EP1484353B1 (en) | 2006-08-16 |
DE602004001920D1 (de) | 2006-09-28 |
KR101015738B1 (ko) | 2011-02-22 |
CN1583835A (zh) | 2005-02-23 |
KR20040103788A (ko) | 2004-12-09 |
TWI332961B (zh) | 2010-11-11 |
JP2004359703A (ja) | 2004-12-24 |
JP3952194B2 (ja) | 2007-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |