CH670416A5 - - Google Patents
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- Publication number
- CH670416A5 CH670416A5 CH3040/86A CH304086A CH670416A5 CH 670416 A5 CH670416 A5 CH 670416A5 CH 3040/86 A CH3040/86 A CH 3040/86A CH 304086 A CH304086 A CH 304086A CH 670416 A5 CH670416 A5 CH 670416A5
- Authority
- CH
- Switzerland
- Prior art keywords
- workpiece
- machine according
- lapping machine
- central wheel
- guide
- Prior art date
Links
- 239000000969 carrier Substances 0.000 claims description 42
- 238000003754 machining Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 9
- 238000007373 indentation Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985117510U JPS6225149U (US06653308-20031125-C00199.png) | 1985-07-31 | 1985-07-31 | |
JP1985117509U JPS6225148U (US06653308-20031125-C00199.png) | 1985-07-31 | 1985-07-31 | |
JP2970586A JPS62188658A (ja) | 1986-02-13 | 1986-02-13 | 平面研磨装置 |
JP61033378A JPH0798303B2 (ja) | 1986-02-18 | 1986-02-18 | 平面研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH670416A5 true CH670416A5 (US06653308-20031125-C00199.png) | 1989-06-15 |
Family
ID=27459108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH3040/86A CH670416A5 (US06653308-20031125-C00199.png) | 1985-07-31 | 1986-07-29 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4805348A (US06653308-20031125-C00199.png) |
KR (1) | KR890003776B1 (US06653308-20031125-C00199.png) |
CH (1) | CH670416A5 (US06653308-20031125-C00199.png) |
DE (2) | DE3624878A1 (US06653308-20031125-C00199.png) |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8712995U1 (de) * | 1987-09-14 | 1987-12-03 | Peter Wolters AG, 2370 Rendsburg | Hon-, Läpp- oder Poliermaschine |
DE3730795A1 (de) * | 1987-09-14 | 1989-03-23 | Wolters Peter Fa | Hon-, laepp- oder poliermaschine |
US4996798A (en) * | 1989-05-31 | 1991-03-05 | Moore Steven C | Ultra-precision lapping apparatus |
US5123218A (en) * | 1990-02-02 | 1992-06-23 | Speedfam Corporation | Circumferential pattern finishing method |
US5733171A (en) * | 1996-07-18 | 1998-03-31 | Speedfam Corporation | Apparatus for the in-process detection of workpieces in a CMP environment |
US5823853A (en) * | 1996-07-18 | 1998-10-20 | Speedfam Corporation | Apparatus for the in-process detection of workpieces with a monochromatic light source |
WO1995000291A1 (en) * | 1993-06-24 | 1995-01-05 | Carman Charles M Jr | Ultra-precision lapping apparatus |
US5562530A (en) * | 1994-08-02 | 1996-10-08 | Sematech, Inc. | Pulsed-force chemical mechanical polishing |
US5783497A (en) * | 1994-08-02 | 1998-07-21 | Sematech, Inc. | Forced-flow wafer polisher |
US5697832A (en) * | 1995-10-18 | 1997-12-16 | Cerion Technologies, Inc. | Variable speed bi-directional planetary grinding or polishing apparatus |
US5769691A (en) * | 1996-06-14 | 1998-06-23 | Speedfam Corp | Methods and apparatus for the chemical mechanical planarization of electronic devices |
US5779203A (en) * | 1996-06-28 | 1998-07-14 | Edlinger; Erich | Adjustable wafer cassette stand |
JP2002509643A (ja) * | 1996-07-08 | 2002-03-26 | スピードファム−アイピーイーシー コーポレイション | ウェハー洗浄、リンスおよび乾燥方法および装置 |
US5950327A (en) * | 1996-07-08 | 1999-09-14 | Speedfam-Ipec Corporation | Methods and apparatus for cleaning and drying wafers |
US5899216A (en) * | 1996-07-08 | 1999-05-04 | Speedfam Corporation | Apparatus for rinsing wafers in the context of a combined cleaning rinsing and drying system |
US5842912A (en) * | 1996-07-15 | 1998-12-01 | Speedfam Corporation | Apparatus for conditioning polishing pads utilizing brazed diamond technology |
US5958148A (en) | 1996-07-26 | 1999-09-28 | Speedfam-Ipec Corporation | Method for cleaning workpiece surfaces and monitoring probes during workpiece processing |
US5872633A (en) * | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
US6296553B1 (en) * | 1997-04-02 | 2001-10-02 | Nippei Toyama Corporation | Grinding method, surface grinder, workpiece support, mechanism and work rest |
US5967881A (en) * | 1997-05-29 | 1999-10-19 | Tucker; Thomas N. | Chemical mechanical planarization tool having a linear polishing roller |
US5938506A (en) * | 1997-06-03 | 1999-08-17 | Speedfam-Ipec Corporation | Methods and apparatus for conditioning grinding stones |
US6033521A (en) | 1997-06-04 | 2000-03-07 | Speedfam-Ipec Corporation | Tilt mechanism for wafer cassette |
US6224465B1 (en) | 1997-06-26 | 2001-05-01 | Stuart L. Meyer | Methods and apparatus for chemical mechanical planarization using a microreplicated surface |
US6030280A (en) * | 1997-07-23 | 2000-02-29 | Speedfam Corporation | Apparatus for holding workpieces during lapping, honing, and polishing |
US5975986A (en) * | 1997-08-08 | 1999-11-02 | Speedfam-Ipec Corporation | Index table and drive mechanism for a chemical mechanical planarization machine |
US5957763A (en) * | 1997-09-19 | 1999-09-28 | Speedfam Corporation | Polishing apparatus with support columns supporting multiple platform members |
US6168506B1 (en) * | 1998-01-21 | 2001-01-02 | Speedfam-Ipec Corporation | Apparatus for polishing using improved plate supports |
US6113465A (en) * | 1998-06-16 | 2000-09-05 | Speedfam-Ipec Corporation | Method and apparatus for improving die planarity and global uniformity of semiconductor wafers in a chemical mechanical polishing context |
JP4342012B2 (ja) * | 1998-12-02 | 2009-10-14 | 株式会社ノリタケカンパニーリミテド | 平面研磨加工方法および装置 |
US6338672B1 (en) * | 1998-12-21 | 2002-01-15 | White Hydraulics, Inc. | Dressing wheel system |
DE10081456T1 (de) | 1999-05-17 | 2001-09-27 | Kashiwara Machine Mfg | Vefahren und Vorrichtung zum doppelseitigen Polieren |
US6213855B1 (en) | 1999-07-26 | 2001-04-10 | Speedfam-Ipec Corporation | Self-powered carrier for polishing or planarizing wafers |
US6517424B2 (en) | 2000-03-10 | 2003-02-11 | Abrasive Technology, Inc. | Protective coatings for CMP conditioning disk |
EP1193610B1 (en) | 2000-09-29 | 2006-11-15 | Ricoh Company, Ltd. | Data processing apparatus and DMA data transfer method |
DE20112495U1 (de) * | 2001-07-28 | 2002-04-11 | Lühmann, Dieter, 21279 Wenzendorf | Von Hand betätigbares Werkzeug |
KR100454120B1 (ko) | 2001-11-12 | 2004-10-26 | 삼성전자주식회사 | 화학적 기계적 연마 장비의 슬러리 공급 장치 및 방법 |
US6932684B1 (en) | 2004-03-08 | 2005-08-23 | Roy H. Hunt | Reciprocal blade lapping machine |
JP4727218B2 (ja) * | 2004-12-10 | 2011-07-20 | 株式会社住友金属ファインテック | 両面研磨用キャリア |
US7399217B1 (en) | 2007-02-05 | 2008-07-15 | P.R. Hoffman Machine Products | Lapping machine |
US20110097977A1 (en) * | 2009-08-07 | 2011-04-28 | Abrasive Technology, Inc. | Multiple-sided cmp pad conditioning disk |
JP2013078808A (ja) * | 2011-09-30 | 2013-05-02 | Sony Corp | 研磨装置及び研磨方法 |
CN102909620A (zh) * | 2012-10-24 | 2013-02-06 | 常熟天地煤机装备有限公司 | 一种通用型节圆定位齿轮磨内孔装置 |
JP6707831B2 (ja) * | 2015-10-09 | 2020-06-10 | 株式会社Sumco | 研削装置および研削方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2618911A (en) * | 1950-07-08 | 1952-11-25 | Norton Co | Lapping machine |
DE965190C (de) * | 1952-09-14 | 1957-06-06 | Wolters Peter Fa | Vorrichtung zum Flachlaeppen oder Flachschleifen |
DE1792521U (de) * | 1958-10-28 | 1959-07-23 | Hahn & Kolb | Laeppmaschine mit einer planeten-laeppeinrichtung. |
DE2403574C2 (de) * | 1974-01-25 | 1983-10-27 | Moskovskoe ordena Lenina i ordena Trudovogo krasnogo znameni vysšee techničeskoe učilišče imeni N.E. Baumana, Moskva | Läppmaschine |
JPS56157035A (en) * | 1980-05-09 | 1981-12-04 | Nec Corp | Simultaneous working of both faces of wafer |
JPS56157036A (en) * | 1980-05-09 | 1981-12-04 | Nec Corp | Simultaneous working of both faces of wafer |
JPS5981057A (ja) * | 1982-11-01 | 1984-05-10 | Hitachi Ltd | 両面研磨装置 |
-
1986
- 1986-07-23 DE DE19863624878 patent/DE3624878A1/de active Granted
- 1986-07-23 DE DE19863644854 patent/DE3644854A1/de active Granted
- 1986-07-29 CH CH3040/86A patent/CH670416A5/de not_active IP Right Cessation
- 1986-07-29 KR KR1019860006184A patent/KR890003776B1/ko not_active IP Right Cessation
- 1986-07-29 US US06/891,241 patent/US4805348A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR890003776B1 (ko) | 1989-10-04 |
KR870001002A (ko) | 1987-03-10 |
US4805348A (en) | 1989-02-21 |
DE3624878A1 (de) | 1987-02-12 |
DE3644854A1 (de) | 1987-07-30 |
DE3644854C2 (US06653308-20031125-C00199.png) | 1988-04-21 |
DE3624878C2 (US06653308-20031125-C00199.png) | 1988-11-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |