CH621825A5 - - Google Patents

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Publication number
CH621825A5
CH621825A5 CH460076A CH460076A CH621825A5 CH 621825 A5 CH621825 A5 CH 621825A5 CH 460076 A CH460076 A CH 460076A CH 460076 A CH460076 A CH 460076A CH 621825 A5 CH621825 A5 CH 621825A5
Authority
CH
Switzerland
Prior art keywords
plating
masking
seal
plating solution
nozzle
Prior art date
Application number
CH460076A
Other languages
German (de)
English (en)
Inventor
Yasuyuki Murata
Original Assignee
Electroplating Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Eng filed Critical Electroplating Eng
Publication of CH621825A5 publication Critical patent/CH621825A5/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
CH460076A 1975-06-14 1976-04-12 CH621825A5 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975080126U JPS51159731U (pt) 1975-06-14 1975-06-14

Publications (1)

Publication Number Publication Date
CH621825A5 true CH621825A5 (pt) 1981-02-27

Family

ID=13709512

Family Applications (1)

Application Number Title Priority Date Filing Date
CH460076A CH621825A5 (pt) 1975-06-14 1976-04-12

Country Status (6)

Country Link
US (1) US4083755A (pt)
JP (1) JPS51159731U (pt)
CH (1) CH621825A5 (pt)
DE (1) DE2615326C2 (pt)
FR (1) FR2313986A1 (pt)
GB (1) GB1541244A (pt)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0059787A1 (de) * 1981-03-05 1982-09-15 Siemens Aktiengesellschaft Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153523A (en) * 1978-05-04 1979-05-08 Bell Telephone Laboratories, Incorporated Continuous electrochemical processing apparatus
US4278520A (en) * 1978-05-31 1981-07-14 Bell Telephone Laboratories, Incorporated Continuous gold electroplating apparatus
JPS5521502A (en) * 1978-07-25 1980-02-15 Sumitomo Metal Mining Co Ltd Method and device for partial plating
JPS56102590A (en) * 1979-08-09 1981-08-17 Koichi Shimamura Method and device for plating of microarea
DE3015282C2 (de) * 1980-04-21 1986-07-17 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum partiellen Galvanisieren von leitenden oder leitend gemachten Oberflächen
JPS5845399A (ja) * 1981-09-10 1983-03-16 Electroplating Eng Of Japan Co メツキ装置
US5202688A (en) * 1989-10-02 1993-04-13 Brunswick Corporation Bulk RF absorber apparatus and method
US5125992A (en) * 1989-10-02 1992-06-30 Brunswick Corp. Bulk rf absorber apparatus and method of making same
US6159449A (en) * 1997-04-03 2000-12-12 Enamelon, Inc. Dentifrice products and methods for remineralizing and/or mineralizing teeth
CN116623263B (zh) * 2023-07-24 2023-10-31 深圳市顺益丰实业有限公司 一种半导体器件镀膜均匀性的调节装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1546834A (en) * 1923-06-12 1925-07-21 Charles A Hanington Stenciled article and method of making the same
US3340162A (en) * 1964-01-27 1967-09-05 Philco Ford Corp Pitch tolerance compensator for a jetelectrolytic treatment apparatus
BE669523A (pt) * 1964-10-10 1965-12-31
US3511213A (en) * 1964-12-22 1970-05-12 Mccorquodale Colour Display Application of liquid colours to paper card or other smooth surfaces
US3672939A (en) * 1969-06-02 1972-06-27 Ppg Industries Inc Electroless process for forming thin metal films
US3819497A (en) * 1969-09-17 1974-06-25 Macdermid Inc Electroless and electrolytic copper plating
US3850656A (en) * 1970-07-13 1974-11-26 W Brown Typing error correction system
US3746630A (en) * 1970-12-08 1973-07-17 Auric Corp Apparatus for selective electroplating of strips
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
NL170027C (nl) * 1971-05-25 1982-09-16 Galentan Ag Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting.
US3788963A (en) * 1972-01-13 1974-01-29 Auric Corp Apparatus for intermittent electroplating strips
JPS5512112B2 (pt) * 1973-02-23 1980-03-29
US3860499A (en) * 1973-04-19 1975-01-14 Gte Sylvania Inc Electroplating apparatus and method
ZA745674B (en) * 1973-09-13 1975-10-29 Mccoryuodale Colour Display Lt Method and apparatus for applying liquid to a substrate
US3897323A (en) * 1974-08-05 1975-07-29 Motorola Inc Apparatus for selective plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0059787A1 (de) * 1981-03-05 1982-09-15 Siemens Aktiengesellschaft Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefassten Teilen im Durchlaufverfahren

Also Published As

Publication number Publication date
FR2313986A1 (fr) 1977-01-07
FR2313986B1 (pt) 1980-08-14
DE2615326C2 (de) 1982-04-01
GB1541244A (en) 1979-02-28
DE2615326A1 (de) 1976-12-23
US4083755A (en) 1978-04-11
JPS51159731U (pt) 1976-12-18

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Legal Events

Date Code Title Description
PL Patent ceased