CH620316A5 - Cooling device for a semiconductor component - Google Patents
Cooling device for a semiconductor component Download PDFInfo
- Publication number
- CH620316A5 CH620316A5 CH1169177A CH1169177A CH620316A5 CH 620316 A5 CH620316 A5 CH 620316A5 CH 1169177 A CH1169177 A CH 1169177A CH 1169177 A CH1169177 A CH 1169177A CH 620316 A5 CH620316 A5 CH 620316A5
- Authority
- CH
- Switzerland
- Prior art keywords
- cooling
- plate
- cooling device
- electrode
- heat sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
- F28F19/004—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using protective electric currents, voltages, cathodes, anodes, electric short-circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT715676A AT345932B (de) | 1976-09-27 | 1976-09-27 | Kuehleinrichtung fuer ein halbleiterelement |
Publications (1)
Publication Number | Publication Date |
---|---|
CH620316A5 true CH620316A5 (en) | 1980-11-14 |
Family
ID=3593234
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1169177A CH620316A5 (en) | 1976-09-27 | 1977-09-23 | Cooling device for a semiconductor component |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT345932B (sv) |
CH (1) | CH620316A5 (sv) |
CS (1) | CS205092B2 (sv) |
DE (1) | DE2742893A1 (sv) |
GB (1) | GB1530870A (sv) |
SE (1) | SE437586B (sv) |
SU (1) | SU697062A3 (sv) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3522127A1 (de) * | 1985-06-20 | 1987-01-02 | Siemens Ag | Kuehlbare einrichtung zur aufnahme von elektrischen baugruppen |
SE9802564L (sv) * | 1998-07-17 | 2000-01-18 | Abb Ab | Kylelement |
CN111111797A (zh) * | 2019-12-31 | 2020-05-08 | 中国科学院力学研究所 | 一种内嵌环形水冷管的恒温水冷设备 |
-
1976
- 1976-09-27 AT AT715676A patent/AT345932B/de not_active IP Right Cessation
-
1977
- 1977-09-23 CH CH1169177A patent/CH620316A5/de not_active IP Right Cessation
- 1977-09-23 DE DE19772742893 patent/DE2742893A1/de not_active Withdrawn
- 1977-09-26 SE SE7710754A patent/SE437586B/sv unknown
- 1977-09-26 GB GB39969/77A patent/GB1530870A/en not_active Expired
- 1977-09-26 SU SU772526350A patent/SU697062A3/ru active
- 1977-09-27 CS CS776250A patent/CS205092B2/cs unknown
Also Published As
Publication number | Publication date |
---|---|
GB1530870A (en) | 1978-11-01 |
AT345932B (de) | 1978-10-10 |
DE2742893A1 (de) | 1978-03-30 |
SU697062A3 (ru) | 1979-11-05 |
SE437586B (sv) | 1985-03-04 |
SE7710754L (sv) | 1978-03-28 |
ATA715676A (de) | 1978-02-15 |
CS205092B2 (en) | 1981-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE2527681C3 (de) | Elektrische Kontaktanordnung | |
DE102014213084B4 (de) | Halbleitervorrichtung | |
DE69401137T2 (de) | Kühlungsanordnung für elektrische Leistungsbauteile | |
DE3305471C2 (de) | Wärmetauscher mit einem Fliessbett | |
EP0144579A2 (de) | Kühlkörper zur Flüssigkeitskühlung von Leistungshalbleiterbauelementen | |
EP0604481B1 (de) | Flüssigkeitsgekühlter hochlastwiderstand | |
DE3212727C2 (de) | Wärmeaustauscher | |
DE102007023058A1 (de) | Kühlplattensystem | |
DE69904923T2 (de) | Elektrohydrodynamischer wärmetauscher | |
DE3010363A1 (de) | Geraetekombination fuer den bergbau mit bauelementen der leistungselektronik | |
CH620316A5 (en) | Cooling device for a semiconductor component | |
WO2018096095A1 (de) | Fluidheizer | |
DE440145C (de) | Elektrischer Heisswasserspender | |
DE2928710A1 (de) | Strombegrenzungsapparat | |
DE102016211967B3 (de) | Elektronisches Bauteil und Verfahren zum Herstellen eines elektronischen Bauteils | |
DD259026A5 (de) | Elektrische heizvorrichtung fuer fluessigkeiten | |
DE69031883T2 (de) | Kühlvorrichtung mit elektrisch isoliertem Wärmerohr für Halbleiter | |
DE10316908A1 (de) | Heizvorrichtung | |
DE1915314A1 (de) | Thermoelektrische Anordnung in Form einer Saeule | |
DE3132112A1 (de) | Kuehlvorrichtung fuer schaltungselemente, die waerme erzeugen | |
EP0048424B1 (de) | Elektrische Überstromsicherung | |
DE10241099B3 (de) | Reaktor zur Beaufschlagung einer Trägerplatte mit einer Probe | |
DE7900902U1 (de) | Sonnenenergiekollektor | |
DE1514511C3 (de) | Anordnung mit elektrisch zwangsgekühlten Halbleiterbauelementen | |
DE2627275C2 (de) | Vorrichtung zum Detektieren von elektrisch leitender Flüssigkeit in elektrisch isolierender Flüssigkeit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |