GB1530870A - Cooling device for a semiconductor component - Google Patents

Cooling device for a semiconductor component

Info

Publication number
GB1530870A
GB1530870A GB39969/77A GB3996977A GB1530870A GB 1530870 A GB1530870 A GB 1530870A GB 39969/77 A GB39969/77 A GB 39969/77A GB 3996977 A GB3996977 A GB 3996977A GB 1530870 A GB1530870 A GB 1530870A
Authority
GB
United Kingdom
Prior art keywords
cooling
water
cooling device
plate
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB39969/77A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Andritz Hydro GmbH Austria
Original Assignee
Andritz Hydro GmbH Austria
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Andritz Hydro GmbH Austria filed Critical Andritz Hydro GmbH Austria
Publication of GB1530870A publication Critical patent/GB1530870A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/004—Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using protective electric currents, voltages, cathodes, anodes, electric short-circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)

Abstract

The cooling device, especially for a thyristor at any potential desired, has at least one cooling body which is in thermal contact with the semiconductor body and through which a liquid flows continuously. It is known to remove the lost heat in semiconductor elements by means of air or oil. A suitable cooling medium with better properties would be water, but hitherto the problems of electrolysis arising from the use of water have not been manageable. The cooling device is designed to be suitable for water as a cooling medium. The cooling body therefore consists of a cooling plate (2) and a distributor plate (1), the cooling plate (2) being provided with a groove (3) for the cooling liquid to flow through. The distributor plate (1) has, at the inlet and/or outlet point of the cooling liquid, a chamber (10, 11) which has a larger cross-section than the groove (3). Arranged in this chamber (10, 11) there is an electrode (12) which consists of a readily conductive material which is chemically resistant to the cooling medium. <IMAGE>
GB39969/77A 1976-09-27 1977-09-26 Cooling device for a semiconductor component Expired GB1530870A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT715676A AT345932B (en) 1976-09-27 1976-09-27 COOLING DEVICE FOR A SEMICONDUCTIVE ELEMENT

Publications (1)

Publication Number Publication Date
GB1530870A true GB1530870A (en) 1978-11-01

Family

ID=3593234

Family Applications (1)

Application Number Title Priority Date Filing Date
GB39969/77A Expired GB1530870A (en) 1976-09-27 1977-09-26 Cooling device for a semiconductor component

Country Status (7)

Country Link
AT (1) AT345932B (en)
CH (1) CH620316A5 (en)
CS (1) CS205092B2 (en)
DE (1) DE2742893A1 (en)
GB (1) GB1530870A (en)
SE (1) SE437586B (en)
SU (1) SU697062A3 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000004583A1 (en) * 1998-07-17 2000-01-27 Abb Ab Cooling element and method for manufacturing a cooling element for cooling of at least one electric power component
CN111111797A (en) * 2019-12-31 2020-05-08 中国科学院力学研究所 Constant temperature water cooling plant of embedded annular water-cooled tube

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3522127A1 (en) * 1985-06-20 1987-01-02 Siemens Ag Refrigerable device for holding electrical modules

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000004583A1 (en) * 1998-07-17 2000-01-27 Abb Ab Cooling element and method for manufacturing a cooling element for cooling of at least one electric power component
CN111111797A (en) * 2019-12-31 2020-05-08 中国科学院力学研究所 Constant temperature water cooling plant of embedded annular water-cooled tube

Also Published As

Publication number Publication date
SE437586B (en) 1985-03-04
CS205092B2 (en) 1981-04-30
CH620316A5 (en) 1980-11-14
SE7710754L (en) 1978-03-28
SU697062A3 (en) 1979-11-05
ATA715676A (en) 1978-02-15
DE2742893A1 (en) 1978-03-30
AT345932B (en) 1978-10-10

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee