Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
  • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
  • B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
  • B07B1/46—Constructional details of screens in general; Cleaning or heating of screens
  • B07B1/50—Cleaning
  • B07B1/54—Cleaning with beating devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
  • H10P95/80—Electrical treatments, e.g. for electroforming
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
  • B07B—SEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
  • B07B1/00—Sieving, screening, sifting, or sorting solid materials using networks, gratings, grids, or the like
  • B07B1/46—Constructional details of screens in general; Cleaning or heating of screens
  • B07B1/48—Stretching devices for screens
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
  • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
  • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P10/00—Bonding of wafers, substrates or parts of devices
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
  • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

• Thermistors And Varistors (AREA)
• Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
• Combined Means For Separation Of Solids (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=6090786

Family Applications (1)

Country Status (4)

Families Citing this family (2)

• 1928
  • 1928-08-27 FR FR659561D patent/FR659561A/fr not_active Expired
  • 1928-08-29 GB GB24818/28A patent/GB297822A/en not_active Expired
  • 1928-09-18 US US306679A patent/US1741291A/en not_active Expired - Lifetime
• 1951
  • 1951-03-17 CH CH297822D patent/CH297822A/de unknown

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