CA954425A - Anisotropic etching of silicon and germanium - Google Patents
Anisotropic etching of silicon and germaniumInfo
- Publication number
- CA954425A CA954425A CA142,580A CA142580A CA954425A CA 954425 A CA954425 A CA 954425A CA 142580 A CA142580 A CA 142580A CA 954425 A CA954425 A CA 954425A
- Authority
- CA
- Canada
- Prior art keywords
- germanium
- silicon
- anisotropic etching
- anisotropic
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 title 1
- 229910052732 germanium Inorganic materials 0.000 title 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/115—Orientation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18289171A | 1971-09-22 | 1971-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA954425A true CA954425A (en) | 1974-09-10 |
Family
ID=22670506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA142,580A Expired CA954425A (en) | 1971-09-22 | 1972-05-19 | Anisotropic etching of silicon and germanium |
Country Status (12)
Country | Link |
---|---|
US (1) | US3738881A (ja) |
JP (1) | JPS5212060B2 (ja) |
KR (1) | KR780000484B1 (ja) |
BE (1) | BE789090A (ja) |
CA (1) | CA954425A (ja) |
CH (1) | CH582755A5 (ja) |
DE (1) | DE2245809C3 (ja) |
FR (1) | FR2153384B1 (ja) |
GB (1) | GB1357831A (ja) |
IT (1) | IT969438B (ja) |
NL (1) | NL166361C (ja) |
SE (1) | SE380543B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6874713B2 (en) | 2002-08-22 | 2005-04-05 | Dow Corning Corporation | Method and apparatus for improving silicon processing efficiency |
US7270706B2 (en) | 2004-10-04 | 2007-09-18 | Dow Corning Corporation | Roll crusher to produce high purity polycrystalline silicon chips |
US8021483B2 (en) | 2002-02-20 | 2011-09-20 | Hemlock Semiconductor Corporation | Flowable chips and methods for the preparation and use of same, and apparatus for use in the methods |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4013502A (en) * | 1973-06-18 | 1977-03-22 | Texas Instruments Incorporated | Stencil process for high resolution pattern replication |
US3990925A (en) * | 1975-03-31 | 1976-11-09 | Bell Telephone Laboratories, Incorporated | Removal of projections on epitaxial layers |
US4057939A (en) * | 1975-12-05 | 1977-11-15 | International Business Machines Corporation | Silicon wafer polishing |
JPS5351970A (en) * | 1976-10-21 | 1978-05-11 | Toshiba Corp | Manufacture for semiconductor substrate |
FR2372904A1 (fr) * | 1976-11-19 | 1978-06-30 | Ibm | Composition de decapage du silicium polycristallin contenant de l'hydroxyde de tetramethylammonium et procede d'application |
US6060237A (en) * | 1985-02-26 | 2000-05-09 | Biostar, Inc. | Devices and methods for optical detection of nucleic acid hybridization |
US4680243A (en) * | 1985-08-02 | 1987-07-14 | Micronix Corporation | Method for producing a mask for use in X-ray photolithography and resulting structure |
US5482830A (en) * | 1986-02-25 | 1996-01-09 | Biostar, Inc. | Devices and methods for detection of an analyte based upon light interference |
DE3805752A1 (de) * | 1988-02-24 | 1989-08-31 | Fraunhofer Ges Forschung | Anisotropes aetzverfahren mit elektrochemischem aetzstop |
US4996627A (en) * | 1989-01-30 | 1991-02-26 | Dresser Industries, Inc. | High sensitivity miniature pressure transducer |
US4918030A (en) * | 1989-03-31 | 1990-04-17 | Electric Power Research Institute | Method of forming light-trapping surface for photovoltaic cell and resulting structure |
US5116464A (en) * | 1989-06-02 | 1992-05-26 | Massachusetts Institute Of Technology | Cesium hydroxide etch of a semiconductor crystal |
US5639671A (en) * | 1989-09-18 | 1997-06-17 | Biostar, Inc. | Methods for optimizing of an optical assay device |
US5541057A (en) * | 1989-09-18 | 1996-07-30 | Biostar, Inc. | Methods for detection of an analyte |
AU6513790A (en) * | 1989-09-18 | 1991-04-18 | Biostar Medical Products, Inc. | Apparatus for detection of an immobilized analyte |
US5955377A (en) * | 1991-02-11 | 1999-09-21 | Biostar, Inc. | Methods and kits for the amplification of thin film based assays |
US5550063A (en) * | 1991-02-11 | 1996-08-27 | Biostar, Inc. | Methods for production of an optical assay device |
US5418136A (en) * | 1991-10-01 | 1995-05-23 | Biostar, Inc. | Devices for detection of an analyte based upon light interference |
US5494829A (en) * | 1992-07-31 | 1996-02-27 | Biostar, Inc. | Devices and methods for detection of an analyte based upon light interference |
US5431777A (en) * | 1992-09-17 | 1995-07-11 | International Business Machines Corporation | Methods and compositions for the selective etching of silicon |
US5552272A (en) * | 1993-06-10 | 1996-09-03 | Biostar, Inc. | Detection of an analyte by fluorescence using a thin film optical device |
US6114248A (en) * | 1998-01-15 | 2000-09-05 | International Business Machines Corporation | Process to reduce localized polish stop erosion |
CN102061228B (zh) * | 2002-06-07 | 2013-02-13 | 安万托特性材料股份有限公司 | 包含氧化剂和有机溶剂的微电子清洁组合物 |
US7994062B2 (en) * | 2009-10-30 | 2011-08-09 | Sachem, Inc. | Selective silicon etch process |
US9873833B2 (en) * | 2014-12-29 | 2018-01-23 | Versum Materials Us, Llc | Etchant solutions and method of use thereof |
-
0
- BE BE789090D patent/BE789090A/xx unknown
-
1971
- 1971-09-22 US US00182891A patent/US3738881A/en not_active Expired - Lifetime
-
1972
- 1972-05-19 CA CA142,580A patent/CA954425A/en not_active Expired
- 1972-09-11 SE SE7211667A patent/SE380543B/xx unknown
- 1972-09-16 KR KR7201398A patent/KR780000484B1/ko active
- 1972-09-18 NL NL7212612.A patent/NL166361C/xx not_active IP Right Cessation
- 1972-09-19 IT IT52846/72A patent/IT969438B/it active
- 1972-09-19 DE DE2245809A patent/DE2245809C3/de not_active Expired
- 1972-09-21 GB GB4367272A patent/GB1357831A/en not_active Expired
- 1972-09-21 FR FR7233501A patent/FR2153384B1/fr not_active Expired
- 1972-09-21 JP JP47094188A patent/JPS5212060B2/ja not_active Expired
- 1972-09-21 CH CH1382072A patent/CH582755A5/xx not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8021483B2 (en) | 2002-02-20 | 2011-09-20 | Hemlock Semiconductor Corporation | Flowable chips and methods for the preparation and use of same, and apparatus for use in the methods |
US6874713B2 (en) | 2002-08-22 | 2005-04-05 | Dow Corning Corporation | Method and apparatus for improving silicon processing efficiency |
US7270706B2 (en) | 2004-10-04 | 2007-09-18 | Dow Corning Corporation | Roll crusher to produce high purity polycrystalline silicon chips |
Also Published As
Publication number | Publication date |
---|---|
BE789090A (fr) | 1973-01-15 |
NL7212612A (ja) | 1973-03-26 |
CH582755A5 (ja) | 1976-12-15 |
GB1357831A (en) | 1974-06-26 |
JPS4840380A (ja) | 1973-06-13 |
FR2153384A1 (ja) | 1973-05-04 |
FR2153384B1 (ja) | 1976-10-29 |
US3738881A (en) | 1973-06-12 |
KR780000484B1 (en) | 1978-10-24 |
JPS5212060B2 (ja) | 1977-04-04 |
DE2245809B2 (de) | 1977-09-01 |
DE2245809A1 (de) | 1973-04-05 |
NL166361C (nl) | 1981-07-15 |
NL166361B (nl) | 1981-02-16 |
DE2245809C3 (de) | 1978-04-27 |
IT969438B (it) | 1974-03-30 |
SE380543B (sv) | 1975-11-10 |
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