CA3166227A1 - Light-emitting element and led display device including same - Google Patents
Light-emitting element and led display device including sameInfo
- Publication number
- CA3166227A1 CA3166227A1 CA3166227A CA3166227A CA3166227A1 CA 3166227 A1 CA3166227 A1 CA 3166227A1 CA 3166227 A CA3166227 A CA 3166227A CA 3166227 A CA3166227 A CA 3166227A CA 3166227 A1 CA3166227 A1 CA 3166227A1
- Authority
- CA
- Canada
- Prior art keywords
- light emitting
- emitting stack
- connection electrode
- stack
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/832—Electrodes
- H10H29/8321—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/962—Stacked configurations of light-emitting semiconductor components or devices, the components or devices emitting at different wavelengths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/80—Constructional details
- H10H29/832—Electrodes
- H10H29/8322—Electrodes characterised by their materials
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962954406P | 2019-12-28 | 2019-12-28 | |
| US62/954,406 | 2019-12-28 | ||
| US202063000044P | 2020-03-26 | 2020-03-26 | |
| US63/000,044 | 2020-03-26 | ||
| US17/133,623 US11688840B2 (en) | 2019-12-28 | 2020-12-23 | Light emitting device and led display apparatus having the same |
| US17/133,623 | 2020-12-23 | ||
| PCT/KR2020/019198 WO2021133140A1 (ko) | 2019-12-28 | 2020-12-28 | 발광 소자 및 그것을 갖는 led 디스플레이 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA3166227A1 true CA3166227A1 (en) | 2021-07-01 |
Family
ID=76546717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA3166227A Pending CA3166227A1 (en) | 2019-12-28 | 2020-12-28 | Light-emitting element and led display device including same |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11688840B2 (https=) |
| EP (1) | EP4084097A4 (https=) |
| JP (1) | JP7651578B2 (https=) |
| KR (1) | KR20220123640A (https=) |
| CN (2) | CN213878132U (https=) |
| CA (1) | CA3166227A1 (https=) |
| WO (1) | WO2021133140A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11688840B2 (en) * | 2019-12-28 | 2023-06-27 | Seoul Viosys Co., Ltd. | Light emitting device and led display apparatus having the same |
| US11476299B2 (en) * | 2020-08-31 | 2022-10-18 | Hong Kong Beida Jade Bird Display Limited | Double color micro LED display panel |
| JP7806539B2 (ja) * | 2022-02-16 | 2026-01-27 | 沖電気工業株式会社 | 発光装置 |
| CN115000273A (zh) * | 2022-05-25 | 2022-09-02 | 东莞市立德达光电科技有限公司 | 一种led封装结构及方法 |
| WO2023229194A1 (ko) * | 2022-05-27 | 2023-11-30 | 삼성전자주식회사 | 마이크로 발광 다이오드를 포함하는 디스플레이 모듈 |
| CN121038458B (zh) * | 2025-10-21 | 2026-03-06 | 上海显耀显示科技股份有限公司 | 一种微型led显示芯片 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07254732A (ja) * | 1994-03-15 | 1995-10-03 | Toshiba Corp | 半導体発光装置 |
| JPH07263752A (ja) * | 1994-03-18 | 1995-10-13 | Sony Corp | 半導体カラー発光素子 |
| FR2726126A1 (fr) * | 1994-10-24 | 1996-04-26 | Mitsubishi Electric Corp | Procede de fabrication de dispositifs a diodes electroluminescentes a lumiere visible |
| JPH08274376A (ja) * | 1995-03-15 | 1996-10-18 | Texas Instr Inc <Ti> | シリコンに格子整合したｉｉｉ−ｖ化合物半導体エミッター |
| KR100298205B1 (ko) * | 1998-05-21 | 2001-08-07 | 오길록 | 고집적삼색발광소자및그제조방법 |
| JP2002016312A (ja) | 2000-06-27 | 2002-01-18 | Sanyo Electric Co Ltd | 窒化物系半導体素子およびその製造方法 |
| JP4699704B2 (ja) | 2003-03-18 | 2011-06-15 | 日本特殊陶業株式会社 | 配線基板 |
| US20070170444A1 (en) * | 2004-07-07 | 2007-07-26 | Cao Group, Inc. | Integrated LED Chip to Emit Multiple Colors and Method of Manufacturing the Same |
| JP2007095844A (ja) | 2005-09-27 | 2007-04-12 | Oki Data Corp | 半導体発光複合装置 |
| JP4901241B2 (ja) | 2006-02-27 | 2012-03-21 | スタンレー電気株式会社 | 半導体発光素子及びその製造方法 |
| US7732253B1 (en) * | 2006-08-14 | 2010-06-08 | Rf Micro Devices, Inc. | Flip-chip assembly with improved interconnect |
| JP2008258459A (ja) | 2007-04-06 | 2008-10-23 | Toshiba Corp | 発光装置及びその製造方法 |
| JP2011100892A (ja) | 2009-11-06 | 2011-05-19 | Sumitomo Electric Ind Ltd | 電子機器、複合型電子機器、検出装置、受光素子アレイ、および、これらの製造方法 |
| JP2011159672A (ja) | 2010-01-29 | 2011-08-18 | Oki Data Corp | 半導体発光装置および画像表示装置 |
| JP2011176045A (ja) | 2010-02-23 | 2011-09-08 | Fujifilm Corp | 積層型半導体発光素子 |
| JP2013098514A (ja) | 2011-11-07 | 2013-05-20 | Seiko Epson Corp | 半導体装置の製造方法及び半導体装置、電子機器 |
| JP2015038910A (ja) | 2012-07-13 | 2015-02-26 | イビデン株式会社 | 配線板及びその製造方法 |
| KR101958419B1 (ko) | 2013-01-29 | 2019-03-14 | 삼성전자 주식회사 | 반도체 발광 소자 |
| JP6107680B2 (ja) | 2014-01-22 | 2017-04-05 | 豊田合成株式会社 | 発光装置およびその製造方法 |
| JP6332668B2 (ja) * | 2014-03-19 | 2018-05-30 | 新光電気工業株式会社 | 配線基板及びその製造方法と半導体装置 |
| KR102303983B1 (ko) * | 2014-09-22 | 2021-09-23 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법, 및 상기 반도체 장치를 포함하는 반도체 패키지 |
| KR102256591B1 (ko) | 2014-10-31 | 2021-05-27 | 서울바이오시스 주식회사 | 고효율 발광 장치 |
| KR102412409B1 (ko) | 2015-10-26 | 2022-06-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| DE102016104280A1 (de) * | 2016-03-09 | 2017-09-14 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
| KR102513080B1 (ko) | 2016-04-04 | 2023-03-24 | 삼성전자주식회사 | Led 광원 모듈 및 디스플레이 장치 |
| KR102530759B1 (ko) * | 2016-06-14 | 2023-05-11 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조방법 |
| KR102335714B1 (ko) | 2016-10-24 | 2021-12-06 | 글로 에이비 | 발광 다이오드, 디스플레이 소자 및 직시형 디스플레이 소자 |
| US11282981B2 (en) | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
| US11527519B2 (en) * | 2017-11-27 | 2022-12-13 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US11552057B2 (en) | 2017-12-20 | 2023-01-10 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US10804429B2 (en) | 2017-12-22 | 2020-10-13 | Lumileds Llc | III-nitride multi-wavelength LED for visible light communication |
| US10777531B2 (en) * | 2018-12-28 | 2020-09-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package contact structure, semiconductor package and manufacturing method thereof |
| CN110246953B (zh) | 2019-07-26 | 2023-08-18 | 厦门乾照半导体科技有限公司 | 一种Micro-LED芯片、显示设备及Micro-LED芯片的制作方法 |
| US11688840B2 (en) * | 2019-12-28 | 2023-06-27 | Seoul Viosys Co., Ltd. | Light emitting device and led display apparatus having the same |
-
2020
- 2020-12-23 US US17/133,623 patent/US11688840B2/en active Active
- 2020-12-28 CN CN202023221951.1U patent/CN213878132U/zh active Active
- 2020-12-28 JP JP2022540346A patent/JP7651578B2/ja active Active
- 2020-12-28 EP EP20906617.4A patent/EP4084097A4/en active Pending
- 2020-12-28 WO PCT/KR2020/019198 patent/WO2021133140A1/ko not_active Ceased
- 2020-12-28 KR KR1020227020544A patent/KR20220123640A/ko not_active Ceased
- 2020-12-28 CA CA3166227A patent/CA3166227A1/en active Pending
- 2020-12-28 CN CN202080090918.3A patent/CN114902434A/zh active Pending
-
2023
- 2023-05-16 US US18/197,729 patent/US20230282797A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021133140A1 (ko) | 2021-07-01 |
| US20230282797A1 (en) | 2023-09-07 |
| EP4084097A4 (en) | 2024-01-24 |
| JP7651578B2 (ja) | 2025-03-26 |
| KR20220123640A (ko) | 2022-09-08 |
| US11688840B2 (en) | 2023-06-27 |
| CN114902434A (zh) | 2022-08-12 |
| US20210202815A1 (en) | 2021-07-01 |
| JP2023510170A (ja) | 2023-03-13 |
| CN213878132U (zh) | 2021-08-03 |
| EP4084097A1 (en) | 2022-11-02 |
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