CA2939101A1 - Transfert de chaleur efficace a partir de cartes de circuit imprime refroidies par conduction - Google Patents

Transfert de chaleur efficace a partir de cartes de circuit imprime refroidies par conduction Download PDF

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Publication number
CA2939101A1
CA2939101A1 CA2939101A CA2939101A CA2939101A1 CA 2939101 A1 CA2939101 A1 CA 2939101A1 CA 2939101 A CA2939101 A CA 2939101A CA 2939101 A CA2939101 A CA 2939101A CA 2939101 A1 CA2939101 A1 CA 2939101A1
Authority
CA
Canada
Prior art keywords
conduction
thermal management
management interface
chassis
wedgelock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA2939101A
Other languages
English (en)
Inventor
Randall J. Stutzman
Charles H. Dando, Iii
Clint Long
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lockheed Martin Corp
Original Assignee
Lockheed Martin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lockheed Martin Corp filed Critical Lockheed Martin Corp
Publication of CA2939101A1 publication Critical patent/CA2939101A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
    • B23K20/08—Explosive welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un ensemble carte refroidi par conduction (100) qui comprend un cadre de refroidissement par conduction (102), une carte de circuit imprimé (104) montée sur le cadre, et une pince de serrage (122). Le cadre de refroidissement par conduction présente une interface de gestion thermique (124) conçue pour transférer de la chaleur du cadre à un châssis (128), et la pince de serrage est conçue pour appuyer l'interface de gestion thermique du cadre de refroidissement par conduction contre un rail du châssis. L'ensemble possède également une ou plusieurs des caractéristiques suivantes : (a) l'interface de gestion thermique du cadre de refroidissement par conduction est principalement faite d'un premier matériau et une partie de l'interface de gestion thermique qui est conçue pour entrer en contact avec la pince de serrage ou le rail du châssis est faite d'un second matériau qui est plus mou que le premier matériau, et (b) la pince de serrage est principalement faite d'un premier matériau et une partie de la pince de serrage qui est conçue pour entrer en contact avec l'interface de gestion thermique ou un autre rail du châssis est faite d'un second matériau qui est plus mou que le premier matériau. Un châssis pour ensembles cartes refroidis par conduction est également décrit, qui comprend un boîtier et au moins des premier et second rails à l'intérieur du boîtier qui sont conçus pour recevoir entre eux un ensemble carte refroidi par conduction. Au moins un des premier et second rails est principalement fait d'un premier matériau et comprend une partie de surface faite d'un second matériau qui est plus mou que le premier matériau.
CA2939101A 2014-02-18 2015-02-13 Transfert de chaleur efficace a partir de cartes de circuit imprime refroidies par conduction Abandoned CA2939101A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/182,803 2014-02-18
US14/182,803 US9357670B2 (en) 2014-02-18 2014-02-18 Efficient heat transfer from conduction-cooled circuit cards
PCT/US2015/015769 WO2015126745A1 (fr) 2014-02-18 2015-02-13 Transfert de chaleur efficace à partir de cartes de circuit imprimé refroidies par conduction

Publications (1)

Publication Number Publication Date
CA2939101A1 true CA2939101A1 (fr) 2015-08-27

Family

ID=52595472

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2939101A Abandoned CA2939101A1 (fr) 2014-02-18 2015-02-13 Transfert de chaleur efficace a partir de cartes de circuit imprime refroidies par conduction

Country Status (5)

Country Link
US (1) US9357670B2 (fr)
EP (1) EP3108727A1 (fr)
AU (2) AU2015219268A1 (fr)
CA (1) CA2939101A1 (fr)
WO (1) WO2015126745A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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US11665856B2 (en) 2021-10-26 2023-05-30 Eagle Technology, Llc Electronic device having flexible, heat conductive layer and associated methods
US12075587B2 (en) 2022-02-17 2024-08-27 Hamilton Sundstrand Corporation Heat transfer interfaces for circuit card assembly (CCA) modules

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Also Published As

Publication number Publication date
AU2015219268A1 (en) 2016-08-18
AU2019261815A1 (en) 2019-12-05
US20150237763A1 (en) 2015-08-20
EP3108727A1 (fr) 2016-12-28
US9357670B2 (en) 2016-05-31
WO2015126745A8 (fr) 2015-11-05
WO2015126745A1 (fr) 2015-08-27

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Legal Events

Date Code Title Description
EEER Examination request

Effective date: 20200210

FZDE Discontinued

Effective date: 20210831

FZDE Discontinued

Effective date: 20210831