WO1992022090A1 - Ensemble electronique thermoconducteur - Google Patents

Ensemble electronique thermoconducteur Download PDF

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Publication number
WO1992022090A1
WO1992022090A1 PCT/US1992/004215 US9204215W WO9222090A1 WO 1992022090 A1 WO1992022090 A1 WO 1992022090A1 US 9204215 W US9204215 W US 9204215W WO 9222090 A1 WO9222090 A1 WO 9222090A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
thermally conductive
electronic assembly
thermally
cavity
Prior art date
Application number
PCT/US1992/004215
Other languages
English (en)
Inventor
Robert F. Darveaux
William B. Mullen, Iii
Kenneth R. Thompson
Michael H. Bartlett
Original Assignee
Motorola, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola, Inc. filed Critical Motorola, Inc.
Publication of WO1992022090A1 publication Critical patent/WO1992022090A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32153—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate
    • H01L2224/32175—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic
    • H01L2224/32188—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being arranged next to each other, e.g. on a common substrate the item being metallic the layer connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
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    • H01L2924/01013—Aluminum [Al]
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
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    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Abstract

Un ensemble électronique thermoconducteur comprend un dispositif électronique (10) capable de produire de la chaleur pendant le fonctionnement ainsi qu'un substrat thermoconducteur (12). Le substrat est couplé au dispositif par un matériau thermoconducteur (13) qui présente une compliance à une température voisine ou inférieure à la température de fonctionnement des dispositifs. Le matériau thermoconducteur (13) est placé entre le dispositif (10) et le substrat (12) et est en contact direct à la fois avec le dispositif et avec le substrat de manière à conduire la chaleur émanant du dispositif. Un adhésif/matériau d'étanchéité (14) est prévu entre le dispositif (10) et le substrat (12) de manière à contenir le matériau thermoconducteur (13).
PCT/US1992/004215 1991-06-03 1992-05-19 Ensemble electronique thermoconducteur WO1992022090A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70925791A 1991-06-03 1991-06-03
US709,257 1991-06-03

Publications (1)

Publication Number Publication Date
WO1992022090A1 true WO1992022090A1 (fr) 1992-12-10

Family

ID=24849098

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/004215 WO1992022090A1 (fr) 1991-06-03 1992-05-19 Ensemble electronique thermoconducteur

Country Status (1)

Country Link
WO (1) WO1992022090A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716968A1 (fr) * 1994-03-02 1995-09-08 Suisse Electronique Microtech Procédé de fixation d'un dispositif sensible sur un support et produit obtenu par le procédé.
EP0682467A2 (fr) * 1994-05-10 1995-11-15 Hella KG Hueck & Co. Dispositif de commande à circuit de ventilateur d'automobile
EP0963142A2 (fr) * 1998-05-29 1999-12-08 Lucent Technologies Inc. Assemblage ayant une plaque arrière avec des inserts
EP1039526A2 (fr) * 1999-03-24 2000-09-27 Ford Motor Company Procédé et article pour attacher un composant électronique opérant à haute température
US6791839B2 (en) 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
EP1668697A2 (fr) * 2003-10-02 2006-06-14 Motorola, Inc. Systeme de circuit electrique et procedes d'assemblage correspondants
EP2063455A3 (fr) * 2007-11-12 2009-09-09 NEC Corporation Structure d'assemblage de dispositif et procédé d'assemblage de dispositif
DE112008000743B4 (de) * 2007-03-22 2013-12-24 Toyota Jidosha Kabushiki Kaisha Leistungsmodul und Wechselrichter für Fahrzeuge
DE102018220998A1 (de) * 2018-12-05 2020-06-10 Continental Automotive Gmbh Leistungselektronikanordnung mit einer effizienten Kühlung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129881A (en) * 1976-03-18 1978-12-12 Ckd Praha, Oborovy Podnik Heat sink cooled, semiconductor device assembly having liquid metal interface
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US5006923A (en) * 1989-09-14 1991-04-09 Litton Systems, Inc. Stackable multilayer substrate for mounting integrated circuits
US5010388A (en) * 1987-07-03 1991-04-23 Sumitomo Electric Industries, Ltd. Connection structure between components for semiconductor apparatus
US5094769A (en) * 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129881A (en) * 1976-03-18 1978-12-12 Ckd Praha, Oborovy Podnik Heat sink cooled, semiconductor device assembly having liquid metal interface
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
US5010388A (en) * 1987-07-03 1991-04-23 Sumitomo Electric Industries, Ltd. Connection structure between components for semiconductor apparatus
US5094769A (en) * 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound
US5001542A (en) * 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
US5006923A (en) * 1989-09-14 1991-04-09 Litton Systems, Inc. Stackable multilayer substrate for mounting integrated circuits

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716968A1 (fr) * 1994-03-02 1995-09-08 Suisse Electronique Microtech Procédé de fixation d'un dispositif sensible sur un support et produit obtenu par le procédé.
EP0682467A2 (fr) * 1994-05-10 1995-11-15 Hella KG Hueck & Co. Dispositif de commande à circuit de ventilateur d'automobile
EP0682467A3 (fr) * 1994-05-10 1997-02-26 Hella Kg Hueck & Co Dispositif de commande à circuit de ventilateur d'automobile.
EP0963142A2 (fr) * 1998-05-29 1999-12-08 Lucent Technologies Inc. Assemblage ayant une plaque arrière avec des inserts
EP0963142A3 (fr) * 1998-05-29 2000-04-05 Lucent Technologies Inc. Assemblage ayant une plaque arrière avec des inserts
US6292374B1 (en) 1998-05-29 2001-09-18 Lucent Technologies, Inc. Assembly having a back plate with inserts
EP1039526A2 (fr) * 1999-03-24 2000-09-27 Ford Motor Company Procédé et article pour attacher un composant électronique opérant à haute température
EP1039526A3 (fr) * 1999-03-24 2001-02-07 Ford Motor Company Procédé et article pour attacher un composant électronique opérant à haute température
US6791839B2 (en) 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use
EP1668697A2 (fr) * 2003-10-02 2006-06-14 Motorola, Inc. Systeme de circuit electrique et procedes d'assemblage correspondants
EP1668697A4 (fr) * 2003-10-02 2006-12-27 Motorola Inc Systeme de circuit electrique et procedes d'assemblage correspondants
DE112008000743B4 (de) * 2007-03-22 2013-12-24 Toyota Jidosha Kabushiki Kaisha Leistungsmodul und Wechselrichter für Fahrzeuge
DE112008000743B8 (de) * 2007-03-22 2014-03-13 Toyota Jidosha Kabushiki Kaisha Leistungsmodul und Wechselrichter für Fahrzeuge
EP2063455A3 (fr) * 2007-11-12 2009-09-09 NEC Corporation Structure d'assemblage de dispositif et procédé d'assemblage de dispositif
DE102018220998A1 (de) * 2018-12-05 2020-06-10 Continental Automotive Gmbh Leistungselektronikanordnung mit einer effizienten Kühlung
DE102018220998B4 (de) 2018-12-05 2023-09-28 Vitesco Technologies GmbH Leistungselektronikanordnung mit einer effizienten Kühlung

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