CA2649157A1 - Method for mounting protective covers on image capture devices and devices manufactured thereby - Google Patents

Method for mounting protective covers on image capture devices and devices manufactured thereby Download PDF

Info

Publication number
CA2649157A1
CA2649157A1 CA002649157A CA2649157A CA2649157A1 CA 2649157 A1 CA2649157 A1 CA 2649157A1 CA 002649157 A CA002649157 A CA 002649157A CA 2649157 A CA2649157 A CA 2649157A CA 2649157 A1 CA2649157 A1 CA 2649157A1
Authority
CA
Canada
Prior art keywords
protective covers
transparent substrate
camera modules
substrate
modules according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002649157A
Other languages
English (en)
French (fr)
Inventor
Samuel Waising Tam
Dongkai Shangguan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flextronics AP LLC
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2649157A1 publication Critical patent/CA2649157A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/63—Control of cameras or camera modules by using electronic viewfinders
    • H04N23/631—Graphical user interfaces [GUI] specially adapted for controlling image capture or setting capture parameters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CA002649157A 2006-04-11 2007-04-09 Method for mounting protective covers on image capture devices and devices manufactured thereby Abandoned CA2649157A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/402,196 2006-04-11
US11/402,196 US20070236591A1 (en) 2006-04-11 2006-04-11 Method for mounting protective covers over image capture devices and devices manufactured thereby
PCT/US2007/008668 WO2007120587A2 (en) 2006-04-11 2007-04-09 Method for mounting protective covers on image capture devices and devices manufactured thereby

Publications (1)

Publication Number Publication Date
CA2649157A1 true CA2649157A1 (en) 2007-10-25

Family

ID=38574804

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002649157A Abandoned CA2649157A1 (en) 2006-04-11 2007-04-09 Method for mounting protective covers on image capture devices and devices manufactured thereby

Country Status (5)

Country Link
US (2) US20070236591A1 (enExample)
EP (2) EP2014086B1 (enExample)
JP (1) JP2009533867A (enExample)
CA (1) CA2649157A1 (enExample)
WO (1) WO2007120587A2 (enExample)

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JP6584886B2 (ja) * 2015-09-14 2019-10-02 株式会社ディスコ 分割方法
CN106210704B (zh) * 2016-09-13 2018-03-30 北京清影机器视觉技术有限公司 一种基于工业数字相机矩阵的图像获取装置
US11049898B2 (en) 2017-04-01 2021-06-29 Ningbo Sunny Opotech Co., Ltd. Systems and methods for manufacturing semiconductor modules
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Also Published As

Publication number Publication date
US20140047711A1 (en) 2014-02-20
EP2014086A2 (en) 2009-01-14
EP2014086A4 (en) 2010-10-13
JP2009533867A (ja) 2009-09-17
EP2337333B1 (en) 2014-03-19
US20070236591A1 (en) 2007-10-11
EP2337333A2 (en) 2011-06-22
WO2007120587A3 (en) 2009-01-08
EP2337333A3 (en) 2012-03-14
EP2014086B1 (en) 2012-05-16
WO2007120587A2 (en) 2007-10-25

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued

Effective date: 20150721