Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/60—Control of cameras or camera modules
  • H04N23/63—Control of cameras or camera modules by using electronic viewfinders
  • H04N23/631—Graphical user interfaces [GUI] specially adapted for controlling image capture or setting capture parameters
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/804—Containers or encapsulations
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/805—Coatings
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
  • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
  • H10F39/80—Constructional details of image sensors
  • H10F39/806—Optical elements or arrangements associated with the image sensors
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Definitions

• Another disadvantage is the cost and/or time required to prepare the glass covers.
• One method includes the steps of providing a unitary component substrate, providing a unitary transparent substrate, bonding the unitary transparent substrate to the unitary component substrate, separating the unitary transparent substrate to form the protective covers, and separating the unitary component substrate to form discrete component parts.
• the step of separating the unitary transparent substrate is distinct from the step of dividing the component substrate. For example, the transparent substrate can be divided prior to separating the component parts.
• the substrate including a plurality of individual component parts, and a unitary transparent substrate including a bottom surface that at least partially defines a plurality of discrete protective covers.
• Each of the protective covers are bonded to a respective one of the individual component parts.
• the discrete protective covers are at least partially defined by channels formed in the bottom surface of the unitary
• the unitary component substrate is an integrated circuit wafer.
• FIG. 2B is a cross-sectional view of the unitary transparent substrate of FIG. 1 with a patterned bonding material applied to the individual covers;
• FIG. 3 A is a cross-sectional view of the unitary transparent substrate of FIG. 2 A positioned over a unitary component substrate;
• FIG. 6 is a top plan view of an alternate unitary transparent substrate and an alternate 0 unitary component substrate
• FIG. 1OA shows material being removed from the top surface of an assembled camera module manufacturing workpiece (bottom surface of the unitary transparent substrate);
• FIG. 13 is a side view of the camera module manufacturing workpiece of FIG. 12 '.5 being separated into individual camera modules;
• FIG. 14 is a side view of an individual camera module of FIG. 13;
• FIG. 15 is a flowchart summarizing one particular method for manufacturing camera modules including image capture devices with protective covers mounted thereon;
• FIG. 16 is a flowchart summarizing one particular method for forming a unitary ⁇ 0 transparent substrate
• bonding agent 202 need not be an optical bonding agent, because the bonding agent 202 is not disposed in the optical paths through the centers 204 of protective covers 102. Therefore, the bonding agent can be selected solely based on its suitability (e.g., strength, durability, ease of application, cost, and so on) to hold protective covers 102 in place, without concern for the optical properties of bonding agent 202.
• Patterned bonding agent 202 can be conveniently applied as a laminate material.
• a single sheet of double-sided adhesive material can be applied over the entire top surface 110 of unitary transparent substrate 100. Then the desired pattern is cut into the sheet and the excess material is removed, leaving behind patterned bonding agent 202.
• the sheet can be cut and the excess material removed prior to applying the laminate to the protective covers 102.
• 5 component substrate 300 include 36 (6x6 array) individual protective covers 102 and devices 302, respectively, even though only one dimension of the array is shown.
• protective covers 102 A are exaggerated compared to the other components. Although protective covers 102 A appear to be about the same thickness as component substrate 300A, they are actually much thinner.
• FIG. 15 is a flowchart summarizing a method 1500 for manufacturing camera modules including image capture devices with protective covers mounted thereon.
• a unitary component substrate including a plurality of individual component parts is provided in a first step 1502 .
• a unitary transparent substrate is provided in a second step 1504.
• the unitary transparent substrate is bonded to the unitary component substrate.
• the unitary transparent substrate is divided into a plurality of discrete protective covers.
• the unitary component substrate is separated into component parts.
• the camera module assembly is completed.

Landscapes

• Engineering & Computer Science (AREA)
• Multimedia (AREA)
• Signal Processing (AREA)
• Human Computer Interaction (AREA)
• Solid State Image Pick-Up Elements (AREA)
• Transforming Light Signals Into Electric Signals (AREA)

Priority Applications (3)

Applications Claiming Priority (2)

Publications (2)

Family

ID=38574804

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (9)

Family Cites Families (56)

• 2006
  • 2006-04-11 US US11/402,196 patent/US20070236591A1/en not_active Abandoned
• 2007
  • 2007-04-09 EP EP07755070A patent/EP2014086B1/en not_active Not-in-force
  • 2007-04-09 JP JP2009505406A patent/JP2009533867A/ja active Pending
  • 2007-04-09 WO PCT/US2007/008668 patent/WO2007120587A2/en not_active Ceased
  • 2007-04-09 CA CA002649157A patent/CA2649157A1/en not_active Abandoned
  • 2007-04-09 EP EP11161782.5A patent/EP2337333B1/en not_active Not-in-force
• 2013
  • 2013-08-14 US US13/967,112 patent/US20140047711A1/en not_active Abandoned

Non-Patent Citations (1)

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