CA2377175C - Semiconductor memory chip module - Google Patents

Semiconductor memory chip module Download PDF

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Publication number
CA2377175C
CA2377175C CA002377175A CA2377175A CA2377175C CA 2377175 C CA2377175 C CA 2377175C CA 002377175 A CA002377175 A CA 002377175A CA 2377175 A CA2377175 A CA 2377175A CA 2377175 C CA2377175 C CA 2377175C
Authority
CA
Canada
Prior art keywords
chip
memory
chip module
chips
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002377175A
Other languages
English (en)
French (fr)
Other versions
CA2377175A1 (en
Inventor
Thomas Grassl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of CA2377175A1 publication Critical patent/CA2377175A1/en
Application granted granted Critical
Publication of CA2377175C publication Critical patent/CA2377175C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0657—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Semiconductor Memories (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Credit Cards Or The Like (AREA)
  • Dram (AREA)
  • Read Only Memory (AREA)
CA002377175A 1999-06-23 2000-06-19 Semiconductor memory chip module Expired - Fee Related CA2377175C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19928733.3 1999-06-23
DE19928733A DE19928733A1 (de) 1999-06-23 1999-06-23 Halbleiterspeicher-Chipmodul
PCT/EP2000/005625 WO2001001418A1 (de) 1999-06-23 2000-06-19 Halbleiterspeicher-chipmodul

Publications (2)

Publication Number Publication Date
CA2377175A1 CA2377175A1 (en) 2001-01-04
CA2377175C true CA2377175C (en) 2007-01-09

Family

ID=7912247

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002377175A Expired - Fee Related CA2377175C (en) 1999-06-23 2000-06-19 Semiconductor memory chip module

Country Status (12)

Country Link
US (1) US6721196B1 (enExample)
EP (1) EP1198797B1 (enExample)
JP (1) JP2003503834A (enExample)
KR (1) KR100708597B1 (enExample)
CN (1) CN1203486C (enExample)
AT (1) ATE239296T1 (enExample)
AU (1) AU5683500A (enExample)
BR (1) BR0011868A (enExample)
CA (1) CA2377175C (enExample)
DE (2) DE19928733A1 (enExample)
ES (1) ES2193968T3 (enExample)
WO (1) WO2001001418A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10139414A1 (de) * 2001-08-17 2003-02-27 Giesecke & Devrient Gmbh Halbleiterschaltungsanordnung mit biometrischem Sensor und Auswerteeinheit
KR100528464B1 (ko) * 2003-02-06 2005-11-15 삼성전자주식회사 스마트카드의 보안장치
DE10317147A1 (de) * 2003-04-14 2004-10-28 Nec Electronics (Europe) Gmbh Sicheres Speichersystem mit Flash-Speichern und Cache-Speicher
KR100689589B1 (ko) * 2004-12-30 2007-03-02 매그나칩 반도체 유한회사 반도체 소자 및 그 제조 방법
US7581678B2 (en) 2005-02-22 2009-09-01 Tyfone, Inc. Electronic transaction card
US7557597B2 (en) * 2005-06-03 2009-07-07 International Business Machines Corporation Stacked chip security
US7991158B2 (en) * 2006-12-13 2011-08-02 Tyfone, Inc. Secure messaging
US20080244208A1 (en) * 2007-03-30 2008-10-02 Narendra Siva G Memory card hidden command protocol
US9741027B2 (en) * 2007-12-14 2017-08-22 Tyfone, Inc. Memory card based contactless devices
US7961101B2 (en) 2008-08-08 2011-06-14 Tyfone, Inc. Small RFID card with integrated inductive element
US12147863B2 (en) 2008-08-08 2024-11-19 Icashe, Inc. Method and apparatus for transmitting data via NFC for mobile applications including mobile payments and ticketing
US20100033310A1 (en) * 2008-08-08 2010-02-11 Narendra Siva G Power negotation for small rfid card
US8451122B2 (en) 2008-08-08 2013-05-28 Tyfone, Inc. Smartcard performance enhancement circuits and systems
EP2401708A4 (en) * 2009-02-24 2012-08-15 Tyfone Inc CONTACTLESS DEVICE WITH MINIATURIZED ANTENNA
CN103632699B (zh) * 2012-08-22 2016-09-28 成都海存艾匹科技有限公司 含有地址/数据变换器芯片的三维存储器
TWI579856B (zh) 2014-09-12 2017-04-21 東芝股份有限公司 Semiconductor device
WO2019152877A1 (en) * 2018-02-04 2019-08-08 Hsu Fu Chang Methods and apparatus for memory cells that combine static ram and non-volatile memory

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908502A (en) * 1988-02-08 1990-03-13 Pitney Bowes Inc. Fault tolerant smart card
JPH025455A (ja) 1988-06-24 1990-01-10 Hitachi Ltd チップオンチップの半導体装置
JP2760062B2 (ja) * 1989-06-23 1998-05-28 自動車機器株式会社 液圧倍力装置
JP2591324B2 (ja) * 1990-10-29 1997-03-19 日本電気株式会社 半導体記憶集積回路
US5229647A (en) * 1991-03-27 1993-07-20 Micron Technology, Inc. High density data storage using stacked wafers
JP2622038B2 (ja) * 1991-06-03 1997-06-18 シャープ株式会社 半導体装置及びその製造方法
JPH0548000A (ja) * 1991-08-13 1993-02-26 Fujitsu Ltd 半導体装置
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
DE4219031C2 (de) 1992-06-10 1994-11-10 Siemens Ag Multi-Chip-Modul mit Kondensator, der auf dem Träger aus Silizium (monokristalines Substrat) realisiert ist
JP2605968B2 (ja) 1993-04-06 1997-04-30 日本電気株式会社 半導体集積回路およびその形成方法
WO1994024704A1 (en) * 1993-04-12 1994-10-27 Bolger Justin C Area bonding conductive adhesive preforms
US5514907A (en) * 1995-03-21 1996-05-07 Simple Technology Incorporated Apparatus for stacking semiconductor chips
DE19511775C1 (de) * 1995-03-30 1996-10-17 Siemens Ag Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile
JPH09510813A (ja) 1995-07-05 1997-10-28 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン チップ・カードにおいて長いメッセージを処理する方法及び装置
US5973396A (en) * 1996-02-16 1999-10-26 Micron Technology, Inc. Surface mount IC using silicon vias in an area array format or same size as die array
JP4011695B2 (ja) * 1996-12-02 2007-11-21 株式会社東芝 マルチチップ半導体装置用チップおよびその形成方法
US6037661A (en) * 1996-12-20 2000-03-14 International Business Machines Multichip module
US5915167A (en) * 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
KR100328062B1 (ko) * 1997-12-13 2002-06-29 이구택 일산화탄소농도에따른극저탄소강의정련방법

Also Published As

Publication number Publication date
DE50001991D1 (de) 2003-06-05
AU5683500A (en) 2001-01-31
EP1198797A1 (de) 2002-04-24
US6721196B1 (en) 2004-04-13
BR0011868A (pt) 2002-04-09
KR20020021137A (ko) 2002-03-18
WO2001001418A1 (de) 2001-01-04
ATE239296T1 (de) 2003-05-15
CN1358315A (zh) 2002-07-10
CN1203486C (zh) 2005-05-25
JP2003503834A (ja) 2003-01-28
KR100708597B1 (ko) 2007-08-10
ES2193968T3 (es) 2003-11-16
DE19928733A1 (de) 2001-01-04
EP1198797B1 (de) 2003-05-02
CA2377175A1 (en) 2001-01-04

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