CA2113290C - Wafer sensing and clamping monitor - Google Patents

Wafer sensing and clamping monitor

Info

Publication number
CA2113290C
CA2113290C CA002113290A CA2113290A CA2113290C CA 2113290 C CA2113290 C CA 2113290C CA 002113290 A CA002113290 A CA 002113290A CA 2113290 A CA2113290 A CA 2113290A CA 2113290 C CA2113290 C CA 2113290C
Authority
CA
Canada
Prior art keywords
wafer
electrodes
capacitance
support
monitoring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002113290A
Other languages
English (en)
French (fr)
Other versions
CA2113290A1 (en
Inventor
Julian Gaskill Blake
Weilin Tu
Dale Keith Stone
Scott Carelton Holden
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Eaton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=21713775&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2113290(C) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Eaton Corp filed Critical Eaton Corp
Publication of CA2113290A1 publication Critical patent/CA2113290A1/en
Application granted granted Critical
Publication of CA2113290C publication Critical patent/CA2113290C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Jigs For Machine Tools (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
CA002113290A 1993-01-15 1994-01-13 Wafer sensing and clamping monitor Expired - Fee Related CA2113290C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/005,030 US5436790A (en) 1993-01-15 1993-01-15 Wafer sensing and clamping monitor
US005,030 1993-01-15

Publications (2)

Publication Number Publication Date
CA2113290A1 CA2113290A1 (en) 1994-07-16
CA2113290C true CA2113290C (en) 1999-11-30

Family

ID=21713775

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002113290A Expired - Fee Related CA2113290C (en) 1993-01-15 1994-01-13 Wafer sensing and clamping monitor

Country Status (7)

Country Link
US (1) US5436790A (en, 2012)
EP (1) EP0607043B1 (en, 2012)
JP (1) JP3341221B2 (en, 2012)
KR (1) KR100284663B1 (en, 2012)
CA (1) CA2113290C (en, 2012)
DE (1) DE69400113T2 (en, 2012)
TW (1) TW231366B (en, 2012)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5463525A (en) * 1993-12-20 1995-10-31 International Business Machines Corporation Guard ring electrostatic chuck
GB2293689A (en) * 1994-09-30 1996-04-03 Nec Corp Electrostatic chuck
DE69530801T2 (de) * 1994-10-17 2004-03-11 Varian Semiconductor Equipment Associates Inc., Gloucester Montageelement und methode zum klemmen eines flachen, dünnen und leitfähigen werkstückes
US5671116A (en) * 1995-03-10 1997-09-23 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
US5670066A (en) * 1995-03-17 1997-09-23 Lam Research Corporation Vacuum plasma processing wherein workpiece position is detected prior to chuck being activated
US5754391A (en) * 1996-05-17 1998-05-19 Saphikon Inc. Electrostatic chuck
US6298737B1 (en) * 1996-05-29 2001-10-09 Integrated Device Technology, Inc. Ceramic ring undersize detection device
US5952060A (en) * 1996-06-14 1999-09-14 Applied Materials, Inc. Use of carbon-based films in extending the lifetime of substrate processing system components
US5812362A (en) * 1996-06-14 1998-09-22 Applied Materials, Inc. Method and apparatus for the use of diamond films as dielectric coatings on electrostatic chucks
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
JP3245369B2 (ja) * 1996-11-20 2002-01-15 東京エレクトロン株式会社 被処理体を静電チャックから離脱する方法及びプラズマ処理装置
US5886864A (en) * 1996-12-02 1999-03-23 Applied Materials, Inc. Substrate support member for uniform heating of a substrate
TW325148U (en) * 1997-01-23 1998-01-11 Taiwan Semiconductor Mfg Co Ltd Temperature processing device
GB9711273D0 (en) * 1997-06-03 1997-07-30 Trikon Equip Ltd Electrostatic chucks
US6075375A (en) 1997-06-11 2000-06-13 Applied Materials, Inc. Apparatus for wafer detection
US6205870B1 (en) 1997-10-10 2001-03-27 Applied Komatsu Technology, Inc. Automated substrate processing systems and methods
US5901030A (en) * 1997-12-02 1999-05-04 Dorsey Gage, Inc. Electrostatic chuck employing thermoelectric cooling
US5872694A (en) * 1997-12-23 1999-02-16 Siemens Aktiengesellschaft Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage
US5948986A (en) * 1997-12-26 1999-09-07 Applied Materials, Inc. Monitoring of wafer presence and position in semiconductor processing operations
US5886865A (en) * 1998-03-17 1999-03-23 Applied Materials, Inc. Method and apparatus for predicting failure of an eletrostatic chuck
US5969934A (en) * 1998-04-10 1999-10-19 Varian Semiconductor Equipment Associats, Inc. Electrostatic wafer clamp having low particulate contamination of wafers
TW432580B (en) * 1998-09-29 2001-05-01 Applied Materials Inc Piezoelectric method and apparatus for semiconductor wafer detection
US6113165A (en) * 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6454332B1 (en) 1998-12-04 2002-09-24 Applied Materials, Inc. Apparatus and methods for handling a substrate
US6215640B1 (en) 1998-12-10 2001-04-10 Applied Materials, Inc. Apparatus and method for actively controlling surface potential of an electrostatic chuck
US6430022B2 (en) 1999-04-19 2002-08-06 Applied Materials, Inc. Method and apparatus for controlling chucking force in an electrostatic
US6248642B1 (en) 1999-06-24 2001-06-19 Ibis Technology Corporation SIMOX using controlled water vapor for oxygen implants
US6423975B1 (en) 1999-08-18 2002-07-23 Ibis Technology, Inc. Wafer holder for simox processing
US6155436A (en) * 1999-08-18 2000-12-05 Ibis Technology Corporation Arc inhibiting wafer holder assembly
US6452195B1 (en) 1999-08-18 2002-09-17 Ibis Technology Corporation Wafer holding pin
US6433342B1 (en) 1999-08-18 2002-08-13 Ibis Technology Corporation Coated wafer holding pin
US6257001B1 (en) * 1999-08-24 2001-07-10 Lucent Technologies, Inc. Cryogenic vacuum pump temperature sensor
US6740853B1 (en) * 1999-09-29 2004-05-25 Tokyo Electron Limited Multi-zone resistance heater
WO2001024581A1 (en) * 1999-09-29 2001-04-05 Tokyo Electron Limited Multi-zone resistance heater
US6362946B1 (en) 1999-11-02 2002-03-26 Varian Semiconductor Equipment Associates, Inc. Electrostatic wafer clamp having electrostatic seal for retaining gas
US6538873B1 (en) 1999-11-02 2003-03-25 Varian Semiconductor Equipment Associates, Inc. Active electrostatic seal and electrostatic vacuum pump
US6307728B1 (en) * 2000-01-21 2001-10-23 Applied Materials, Inc. Method and apparatus for dechucking a workpiece from an electrostatic chuck
JP4615670B2 (ja) * 2000-04-19 2011-01-19 アプライド マテリアルズ インコーポレイテッド 静電チャックにおけるチャッキング力を制御する方法及び装置
KR100344221B1 (ko) 2000-09-22 2002-07-20 삼성전자 주식회사 웨이퍼 클램프 텐션 측정 장치
US6403322B1 (en) * 2001-03-27 2002-06-11 Lam Research Corporation Acoustic detection of dechucking and apparatus therefor
US7073383B2 (en) * 2001-06-07 2006-07-11 Tokyo Electron Limited Apparatus and method for determining clamping status of semiconductor wafer
US6998353B2 (en) 2001-11-05 2006-02-14 Ibis Technology Corporation Active wafer cooling during damage engineering implant to enhance buried oxide formation in SIMOX wafers
US6710360B2 (en) 2002-07-10 2004-03-23 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6900444B2 (en) * 2002-07-29 2005-05-31 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US6774373B2 (en) * 2002-07-29 2004-08-10 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter
US20040079289A1 (en) * 2002-10-23 2004-04-29 Kellerman Peter L. Electrostatic chuck wafer port and top plate with edge shielding and gas scavenging
US6740894B1 (en) 2003-02-21 2004-05-25 Axcelis Technologies, Inc. Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor
US20040187787A1 (en) * 2003-03-31 2004-09-30 Dawson Keith E. Substrate support having temperature controlled substrate support surface
US6828572B2 (en) * 2003-04-01 2004-12-07 Axcelis Technologies, Inc. Ion beam incident angle detector for ion implant systems
US6794664B1 (en) 2003-12-04 2004-09-21 Axcelis Technologies, Inc. Umbilical cord facilities connection for an ion beam implanter
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US6987272B2 (en) * 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
US7030395B2 (en) * 2004-08-06 2006-04-18 Axcelis Technologies, Inc. Workpiece support structure for an ion beam implanter featuring spherical sliding seal vacuum feedthrough
US7982195B2 (en) * 2004-09-14 2011-07-19 Axcelis Technologies, Inc. Controlled dose ion implantation
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7629597B2 (en) * 2006-08-18 2009-12-08 Axcelis Technologies, Inc. Deposition reduction system for an ion implanter
US7993465B2 (en) * 2006-09-07 2011-08-09 Applied Materials, Inc. Electrostatic chuck cleaning during semiconductor substrate processing
US7986146B2 (en) * 2006-11-29 2011-07-26 Globalfoundries Inc. Method and system for detecting existence of an undesirable particle during semiconductor fabrication
US20090181475A1 (en) * 2008-01-11 2009-07-16 Novellus Systems, Inc. Detecting the presence of a workpiece relative to a carrier head
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
US8169769B2 (en) * 2008-09-11 2012-05-01 Tel Epion Inc. Electrostatic chuck power supply
US7948734B2 (en) * 2008-09-11 2011-05-24 Tel Epion Inc. Electrostatic chuck power supply
US8514544B2 (en) * 2009-08-07 2013-08-20 Trek, Inc. Electrostatic clamp optimizer
JP6151028B2 (ja) * 2013-01-17 2017-06-21 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP6066084B2 (ja) * 2013-12-11 2017-01-25 日新イオン機器株式会社 基板保持装置、半導体製造装置及び基板吸着判別方法
US9543110B2 (en) 2013-12-20 2017-01-10 Axcelis Technologies, Inc. Reduced trace metals contamination ion source for an ion implantation system
DE112015000700T5 (de) 2014-02-07 2016-11-24 Trek, Inc. System und Verfahren zum Klemmen eines Werkstücks
US20150357151A1 (en) 2014-06-10 2015-12-10 Axcelis Technologies, Inc. Ion implantation source with textured interior surfaces
JP6942936B2 (ja) * 2017-08-25 2021-09-29 株式会社アルバック 真空装置、吸着電源
JP7419288B2 (ja) * 2021-03-30 2024-01-22 キヤノントッキ株式会社 制御装置、成膜装置、制御方法、及び電子デバイスの製造方法
CN113984788B (zh) * 2021-12-24 2022-03-15 北京凯世通半导体有限公司 一种通过光学检测仪器对超低温离子注入设备监测的方法
CN119008501B (zh) * 2024-10-21 2025-02-14 天津吉兆源科技有限公司 静电卡盘电源及控制方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4184188A (en) * 1978-01-16 1980-01-15 Veeco Instruments Inc. Substrate clamping technique in IC fabrication processes
US4261762A (en) * 1979-09-14 1981-04-14 Eaton Corporation Method for conducting heat to or from an article being treated under vacuum
US4384918A (en) * 1980-09-30 1983-05-24 Fujitsu Limited Method and apparatus for dry etching and electrostatic chucking device used therein
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
JPS6216540A (ja) * 1985-07-15 1987-01-24 Canon Inc ウエハ搬送装置
US4733632A (en) * 1985-09-25 1988-03-29 Tokyo Electron Limited Wafer feeding apparatus
DE3879295T2 (de) * 1987-04-14 1993-07-01 Abisare Kakegawa Kk Maschine-einheit mit einer statische elektrizitaet benutzenden haltevorrichtung.
JPS63257481A (ja) * 1987-04-14 1988-10-25 Abisare:Kk 静電保持装置
WO1988009054A1 (en) * 1987-05-06 1988-11-17 Labtam Limited Electrostatic chuck using ac field excitation
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
US5173834A (en) * 1989-06-02 1992-12-22 Roland Dg Corporation Electrostatic attraction apparatus
EP0460954B1 (en) * 1990-06-08 1994-09-21 Varian Associates, Inc. Clamping a workpiece
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5315473A (en) * 1992-01-21 1994-05-24 Applied Materials, Inc. Isolated electrostatic chuck and excitation method

Also Published As

Publication number Publication date
US5436790A (en) 1995-07-25
EP0607043B1 (en) 1996-03-27
KR100284663B1 (ko) 2001-04-02
DE69400113T2 (de) 1996-10-24
CA2113290A1 (en) 1994-07-16
TW231366B (en, 2012) 1994-10-01
DE69400113D1 (de) 1996-05-02
JP3341221B2 (ja) 2002-11-05
KR940018947A (ko) 1994-08-19
JPH077073A (ja) 1995-01-10
EP0607043A1 (en) 1994-07-20

Similar Documents

Publication Publication Date Title
CA2113290C (en) Wafer sensing and clamping monitor
US5444597A (en) Wafer release method and apparatus
CN101006630B (zh) 等离子体加工中确定正确的平均偏置补偿电压的方法
US6965506B2 (en) System and method for dechucking a workpiece from an electrostatic chuck
US5103367A (en) Electrostatic chuck using A.C. field excitation
KR100281935B1 (ko) 자기 바이어스 측정방법 및 그 장치와 정전 흡착장치
KR100487823B1 (ko) 캐소드페데스탈의dc전위를능동적으로제어하기위한장치및그방법
US5872694A (en) Method and apparatus for determining wafer warpage for optimized electrostatic chuck clamping voltage
US5948986A (en) Monitoring of wafer presence and position in semiconductor processing operations
JP2010062570A (ja) 真空プロセッサ中の誘電体工作物のための静電デチャッキング方法および装置
JPH06326176A (ja) 自己バイアス測定方法及び装置並びに静電吸着装置
WO2002080265A2 (en) Plasma processor and method for operating same
JP2002526935A5 (en, 2012)
JP4169792B2 (ja) 不平衡二極静電チャック電源供給装置およびその方法
JP4484883B2 (ja) 被吸着物の処理方法
US4649336A (en) Automatic, self sustaining probe for measuring the work function
JP3635463B2 (ja) 自己バイアス測定方法及び装置並びに静電吸着装置
US5917327A (en) Technique and apparatus for testing electrostatic chucks
JP2965176B2 (ja) 静電チャックの過渡特性評価方法
JP2000167467A (ja) ディスペンサ移動制御装置
JP3458548B2 (ja) ワーク電位の測定方法
JPH10127072A (ja) 静電吸着装置、静電吸着力測定方法
JP2007019524A (ja) 離脱状態判断方法及び真空処理装置
JPH11297802A (ja) 静電吸着装置およびこれを搭載した真空処理装置
JPH0721959A (ja) 荷電粒子ビーム照射装置

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed