CA2017080A1 - Structure du conteneur pour un dispositif a semi-conducteur - Google Patents

Structure du conteneur pour un dispositif a semi-conducteur

Info

Publication number
CA2017080A1
CA2017080A1 CA2017080A CA2017080A CA2017080A1 CA 2017080 A1 CA2017080 A1 CA 2017080A1 CA 2017080 A CA2017080 A CA 2017080A CA 2017080 A CA2017080 A CA 2017080A CA 2017080 A1 CA2017080 A1 CA 2017080A1
Authority
CA
Canada
Prior art keywords
heat dissipation
semiconductor device
resin material
package structure
silicon chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2017080A
Other languages
English (en)
Other versions
CA2017080C (fr
Inventor
Akira Tanaka
Kazuji Yamada
Tadahiko Miyoshi
Kanji Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of CA2017080A1 publication Critical patent/CA2017080A1/fr
Application granted granted Critical
Publication of CA2017080C publication Critical patent/CA2017080C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CA002017080A 1989-05-20 1990-05-17 Structure du conteneur pour un dispositif a semi-conducteur Expired - Fee Related CA2017080C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1127556A JP2667510B2 (ja) 1989-05-20 1989-05-20 半導体装置およびこれを用いた電子装置
JP1-127556 1989-05-20

Publications (2)

Publication Number Publication Date
CA2017080A1 true CA2017080A1 (fr) 1990-11-20
CA2017080C CA2017080C (fr) 1995-04-18

Family

ID=14962939

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002017080A Expired - Fee Related CA2017080C (fr) 1989-05-20 1990-05-17 Structure du conteneur pour un dispositif a semi-conducteur

Country Status (5)

Country Link
EP (1) EP0399300B1 (fr)
JP (1) JP2667510B2 (fr)
KR (1) KR940008335B1 (fr)
CA (1) CA2017080C (fr)
DE (1) DE69031323T2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04354342A (ja) * 1991-05-31 1992-12-08 Kawasaki Steel Corp 半導体装置
USRE44685E1 (en) 1994-04-28 2013-12-31 Opentv, Inc. Apparatus for transmitting and receiving executable applications as for a multimedia system, and method and system to order an item using a distributed computing system
JP3367299B2 (ja) * 1994-11-11 2003-01-14 セイコーエプソン株式会社 樹脂封止型半導体装置およびその製造方法
US6189030B1 (en) 1996-02-21 2001-02-13 Infoseek Corporation Method and apparatus for redirection of server external hyper-link references
JP4492257B2 (ja) * 2004-08-26 2010-06-30 富士電機システムズ株式会社 半導体モジュールおよびその製造方法
JP5017332B2 (ja) * 2009-08-24 2012-09-05 株式会社日立製作所 インバータ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4132856A (en) * 1977-11-28 1979-01-02 Burroughs Corporation Process of forming a plastic encapsulated molded film carrier CML package and the package formed thereby
BE897058A (fr) * 1982-06-25 1983-12-16 Sandoz Sa Utilisation d'un derive du spiro-succinimide dans le traitement de la demence du type alzheimer
JPS60137042A (ja) * 1983-12-26 1985-07-20 Matsushita Electronics Corp 樹脂封止形半導体装置
US4890152A (en) * 1986-02-14 1989-12-26 Matsushita Electric Works, Ltd. Plastic molded chip carrier package and method of fabricating the same
JPS6454338U (fr) * 1987-09-30 1989-04-04

Also Published As

Publication number Publication date
JPH02306654A (ja) 1990-12-20
JP2667510B2 (ja) 1997-10-27
EP0399300A3 (fr) 1991-05-02
KR900019203A (ko) 1990-12-24
DE69031323T2 (de) 1998-01-29
CA2017080C (fr) 1995-04-18
DE69031323D1 (de) 1997-10-02
EP0399300A2 (fr) 1990-11-28
KR940008335B1 (ko) 1994-09-12
EP0399300B1 (fr) 1997-08-27

Similar Documents

Publication Publication Date Title
KR0119464B1 (en) Semiconductor device and lead frame
MY127063A (en) Method of manufacturing a semiconductor device
MY109101A (en) Thin type semiconductor device, module structure using the device and method of mounting the device on board
EP0399447A3 (fr) Dispositif semi-conducteur à encapsulation plastique
EP0247775A3 (en) Semiconductor package with high density i/o lead connection
KR970013236A (ko) 금속 회로 기판을 갖는 칩 스케일 패키지
JPS641269A (en) Semiconductor device
EP0755075A3 (fr) Empaquetage à bande de support
MY123034A (en) Semiconductor device and method of fabricating the same
EP0354708A3 (fr) Empaquetage général à trois dimensions
GB2136203B (en) Through-wafer integrated circuit connections
JPS5769765A (en) Sealed body of semiconductor device
CA2017080A1 (fr) Structure du conteneur pour un dispositif a semi-conducteur
KR900001004A (ko) 플라스틱 캡슐형 멀티칩 하이브리드 집적회로
SG66397A1 (en) Plastic pin grid array package
JPS56148857A (en) Semiconductor device
EP0401017A3 (fr) Procédé de fabrication d'un boítier pour circuit intégré présentant une cavité avec joint d'arrêt interne
WO1993017455A3 (fr) Configuration de boitier de circuit integre pour l'encapsulation d'une puce a circuit integre et procede d'encapsulation d'une puce a circuit integre
JPS57136352A (en) Semiconductor device of resin potted type
EP0081419A3 (fr) Support pour circuit intégré hermétique à nombre de conducteurs élevé reliés en masse
JPS5559746A (en) Semiconductor device and its mounting circuit device
JPS647628A (en) Semiconductor device and manufacture thereof
JPS6414942A (en) Resin sealed semiconductor integrated circuit device
JPS6453568A (en) Semiconductor package
JPS5483768A (en) Semiconductor device

Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed