CA1317050C - Easily peelable semiconductive resin composition - Google Patents

Easily peelable semiconductive resin composition

Info

Publication number
CA1317050C
CA1317050C CA000577055A CA577055A CA1317050C CA 1317050 C CA1317050 C CA 1317050C CA 000577055 A CA000577055 A CA 000577055A CA 577055 A CA577055 A CA 577055A CA 1317050 C CA1317050 C CA 1317050C
Authority
CA
Canada
Prior art keywords
vinyl acetate
parts
tion
easily peelable
ethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA000577055A
Other languages
English (en)
French (fr)
Inventor
Kiyoshi Watanabe
Hideki Yagyu
Takanori Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Application granted granted Critical
Publication of CA1317050C publication Critical patent/CA1317050C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0853—Ethylene vinyl acetate copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L91/00—Compositions of oils, fats or waxes; Compositions of derivatives thereof
    • C08L91/06—Waxes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
CA000577055A 1988-03-29 1988-09-09 Easily peelable semiconductive resin composition Expired - Fee Related CA1317050C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63075743A JPH01246708A (ja) 1988-03-29 1988-03-29 剥離容易性半導電性樹脂組成物
JP75743/88 1988-03-29

Publications (1)

Publication Number Publication Date
CA1317050C true CA1317050C (en) 1993-04-27

Family

ID=13585066

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000577055A Expired - Fee Related CA1317050C (en) 1988-03-29 1988-09-09 Easily peelable semiconductive resin composition

Country Status (5)

Country Link
US (1) US4933107A (enExample)
EP (1) EP0334992B1 (enExample)
JP (1) JPH01246708A (enExample)
CA (1) CA1317050C (enExample)
DE (1) DE3852541T2 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198205A (en) * 1988-07-21 1993-03-30 Tokai Carbon Co., Ltd. Carbon black for tire tread rubber
JPH0641539B2 (ja) * 1988-07-21 1994-06-01 東海カーボン株式会社 タイヤトレッドゴム配合用カーボンブラック
US5230878A (en) * 1989-10-02 1993-07-27 Tokai Carbon Co., Ltd. Carbon black for tire tread rubber
JP3029204B2 (ja) * 1990-04-16 2000-04-04 旭化成工業株式会社 高導電性ポリオキシメチレン系樹脂成形体
JP2886258B2 (ja) 1990-05-08 1999-04-26 昭和キャボット株式会社 カーボンブラック及びそれを含有するゴム組成物
US5236992A (en) * 1991-11-18 1993-08-17 Cabot Corporation Carbon blacks and their use in rubber applications
JPH06104794B2 (ja) * 1992-03-27 1994-12-21 信越ポリマー株式会社 プラスチック被覆用導電性組成物
US5472639A (en) * 1993-08-13 1995-12-05 The Dow Chemical Company Electroconductive foams
US5877250A (en) * 1996-01-31 1999-03-02 Cabot Corporation Carbon blacks and compositions incorporating the carbon blacks
US5770257A (en) * 1996-08-01 1998-06-23 Minnesota Mining And Manufacturing Company Method for altering cable semiconductive layer
JP3551755B2 (ja) * 1998-04-03 2004-08-11 日立電線株式会社 剥離容易性半導電性樹脂組成物及び電線・ケーブル
US6274066B1 (en) * 2000-10-11 2001-08-14 General Cable Technologies Corporation Low adhesion semi-conductive electrical shields
US6491849B1 (en) * 2001-01-22 2002-12-10 General Cable Technologies Corp. High performance power cable shield
WO2003027179A1 (en) * 2001-09-19 2003-04-03 Idemitsu Petrochemical Co., Ltd. Wrapping film and shrink film each comprising butene polymer
US6972099B2 (en) 2003-04-30 2005-12-06 General Cable Technologies Corporation Strippable cable shield compositions
KR100825347B1 (ko) * 2003-05-26 2008-04-28 듀폰-미츠이 폴리케미칼 가부시키가이샤 올레핀계 중합체 조성물 및 그것을 사용한 개봉용이성 실링재료
US7767299B2 (en) 2005-04-29 2010-08-03 General Cable Technologies Corporation Strippable cable shield compositions
US8080735B2 (en) 2007-09-25 2011-12-20 Dow Global Technologies Llc Styrenic polymers as blend components to control adhesion between olefinic substrates
US8287770B2 (en) 2010-03-05 2012-10-16 General Cable Technologies Corporation Semiconducting composition
CN101891915A (zh) * 2010-07-06 2010-11-24 苏州市双鑫新材料科技有限公司 交联电缆绝缘用可剥离半导电屏蔽料
CN101891916A (zh) * 2010-07-06 2010-11-24 苏州市双鑫新材料科技有限公司 交联电缆导体用过氧化物交联型半导电屏蔽料
KR20150058296A (ko) 2012-09-19 2015-05-28 제너럴 케이블 테크놀로지즈 코오포레이션 스트리퍼블 반도체 쉴드 조성물들
JP6347415B2 (ja) 2014-11-20 2018-06-27 日立金属株式会社 半導電性樹脂組成物およびそれを用いた送電ケーブル
JP6558564B2 (ja) * 2015-03-13 2019-08-14 日立金属株式会社 送電ケーブル
JP6429123B2 (ja) * 2015-03-13 2018-11-28 日立金属株式会社 送電ケーブル
JP2016170994A (ja) * 2015-03-13 2016-09-23 日立金属株式会社 送電ケーブル
JP6521362B2 (ja) * 2015-03-13 2019-05-29 日立金属株式会社 送電ケーブル
KR102513093B1 (ko) 2016-12-21 2023-03-24 다우 글로벌 테크놀로지스 엘엘씨 경화성 반도체성 조성물
CN110997794B (zh) 2017-08-29 2023-06-13 陶氏环球技术有限责任公司 具有树生长阻滞剂的聚乙烯组合物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2548371A1 (de) * 1975-10-29 1977-05-05 Daetwyler Ag Elektrisch halbleitende abschirmung fuer starkstrom- und nachrichtenkabel mit kunststoffisolation
SE440709B (sv) * 1976-06-10 1985-08-12 Asea Ab Sett att med anvendning av en strengsprutmaskin pa en med isolering av icke tverbunden eller tverbunden polyten forsedd kabelledare applicera ett ledande, avrivbart skikt
JPS5325886A (en) * 1976-08-21 1978-03-10 Sumitomo Electric Ind Ltd Brid ged polyolefine insulating hightension cable having outer semiconductor layers which can be treated off easily
JPS5662846A (en) * 1979-10-29 1981-05-29 Mitsubishi Petrochem Co Ltd Semiconductive resin composition
DE3034747C2 (de) * 1980-09-15 1985-01-17 kabelmetal electro GmbH, 3000 Hannover Verfahren zur Herstellung einer rußhaltigen Polymermischung sowie deren Verwendung für elektrische Kabel
JPS57126004A (en) * 1981-01-30 1982-08-05 Nippon Unicar Co Ltd Semiconductive polyolefin composition and cable using same
US4399060A (en) * 1981-02-10 1983-08-16 E. I. Du Pont De Nemours & Co. Semiconductive elastomeric composition
US4374227A (en) * 1981-05-15 1983-02-15 Union Carbide Corporation Extruded gloss improvement in pipe blends with low pressure low density polyethylene

Also Published As

Publication number Publication date
JPH01246708A (ja) 1989-10-02
US4933107A (en) 1990-06-12
JPH0577123B2 (enExample) 1993-10-26
EP0334992B1 (en) 1994-12-21
DE3852541T2 (de) 1995-05-04
DE3852541D1 (de) 1995-02-02
EP0334992A1 (en) 1989-10-04

Similar Documents

Publication Publication Date Title
US4933107A (en) Easily peelable semiconductive resin composition
CA1307366C (en) Semiconductive resin composition
US4286023A (en) Article of manufacture, the cross-linked product of a semi-conductive composition bonded to a crosslinked polyolefin substrate
US6395989B2 (en) Cross-linkable semiconductive composition, and an electric cable having a semiconductive coating
US4526707A (en) Semiconducting compositions and wires and cables using the same
CA2524252C (en) Improved strippable cable shield compositions
IL186992A (en) Strippable cable shield compositions
US4451536A (en) Heat distortion-resistant thermoplastic semi-conductive composition
JP2013519193A (ja) 加硫可能なコポリマー半導電性シールド組成物
US4246142A (en) Vulcanizable semi-conductive compositions
EP0179845B1 (en) Insulation composition for cables
CN111349286A (zh) 具有改善的耐高温老化性的电缆
CA3001160C (en) Semiconductive shield composition
CA2427259C (en) Power cable
AU6471798A (en) Tree resistant cable
CA2409175C (en) High performance power cable shield
CA1084696A (en) Insulated electrical conductors
JP3088055B2 (ja) 電力ケーブルの半導電層用組成物
JPS5846517A (ja) 架橋ポリオレフイン絶縁電力ケ−ブル
KR100291669B1 (ko) 고압 내열 케이블용 반도전 재료
CA1041189A (en) Styrene in dielectric layer of electric wires or cables
JPH11224533A (ja) 半導電性組成物
JPS58201204A (ja) 電力ケ−ブル
JPH06203651A (ja) 電力ケーブル

Legal Events

Date Code Title Description
MKLA Lapsed