CA1238959A - Area-bonding tape - Google Patents

Area-bonding tape

Info

Publication number
CA1238959A
CA1238959A CA000486302A CA486302A CA1238959A CA 1238959 A CA1238959 A CA 1238959A CA 000486302 A CA000486302 A CA 000486302A CA 486302 A CA486302 A CA 486302A CA 1238959 A CA1238959 A CA 1238959A
Authority
CA
Canada
Prior art keywords
terminals
tape
array
external
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000486302A
Other languages
English (en)
French (fr)
Inventor
Robert R. Rohloff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Application granted granted Critical
Publication of CA1238959A publication Critical patent/CA1238959A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
CA000486302A 1984-08-09 1985-07-04 Area-bonding tape Expired CA1238959A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63949384A 1984-08-09 1984-08-09
US639,493 1984-08-09

Publications (1)

Publication Number Publication Date
CA1238959A true CA1238959A (en) 1988-07-05

Family

ID=24564327

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000486302A Expired CA1238959A (en) 1984-08-09 1985-07-04 Area-bonding tape

Country Status (7)

Country Link
EP (1) EP0171232B1 (OSRAM)
JP (1) JPS6170743A (OSRAM)
KR (1) KR930002909B1 (OSRAM)
CA (1) CA1238959A (OSRAM)
DE (1) DE3587244T2 (OSRAM)
HK (1) HK95894A (OSRAM)
SG (1) SG111194G (OSRAM)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1271819A (en) * 1986-08-05 1990-07-17 Walter Phelps Kern Electrically shielding
GB8719075D0 (en) * 1987-08-12 1987-09-16 Bicc Plc Surface mounted component adaptor
GB2212343A (en) * 1987-11-12 1989-07-19 Peter Elliott Electrical junction
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
KR900701042A (ko) * 1988-02-05 1990-08-17 원본미기재 단축 도전 물품의 이용
WO1989007338A1 (en) * 1988-02-05 1989-08-10 Raychem Limited Uses of uniaxially electrically conductive articles
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
EP0436652A1 (en) * 1988-09-30 1991-07-17 Raychem Limited Hybrid microchip bonding article
JPH0810744B2 (ja) * 1989-08-28 1996-01-31 三菱電機株式会社 半導体装置
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
US6407450B1 (en) 1999-07-15 2002-06-18 Altera Corporation Semiconductor package with universal substrate for electrically interfacing with different sized chips that have different logic functions
GB2356287B (en) * 1999-07-15 2004-03-24 Altera Corp Apparatus and method for packaging different sized semiconductor chips on a common substrate
EP1796443A1 (de) * 2005-12-09 2007-06-13 Delphi Technologies, Inc. Kontaktelement und elektrisches Verbindungssystem

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4731066U (OSRAM) * 1971-04-20 1972-12-08
US4048438A (en) * 1974-10-23 1977-09-13 Amp Incorporated Conductor patterned substrate providing stress release during direct attachment of integrated circuit chips
JPS55138794U (OSRAM) * 1979-03-23 1980-10-03
US4472876A (en) * 1981-08-13 1984-09-25 Minnesota Mining And Manufacturing Company Area-bonding tape
FR2518813A1 (fr) * 1981-12-22 1983-06-24 Socapex Support d'interconnexion d'un boitier de circuit integre sur un circuit imprime et systeme d'interconnexion utilisant un tel support
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치

Also Published As

Publication number Publication date
KR930002909B1 (ko) 1993-04-15
DE3587244T2 (de) 1993-09-02
JPS6170743A (ja) 1986-04-11
JPH0325021B2 (OSRAM) 1991-04-04
EP0171232A3 (en) 1987-12-02
EP0171232B1 (en) 1993-04-07
EP0171232A2 (en) 1986-02-12
HK95894A (en) 1994-09-16
SG111194G (en) 1994-11-25
KR860002143A (ko) 1986-03-26
DE3587244D1 (de) 1993-05-13

Similar Documents

Publication Publication Date Title
US4472876A (en) Area-bonding tape
CA1238959A (en) Area-bonding tape
US5343366A (en) Packages for stacked integrated circuit chip cubes
JP3335575B2 (ja) 半導体装置およびその製造方法
US6242932B1 (en) Interposer for semiconductor components having contact balls
KR100615024B1 (ko) 범프가 형성된 반도체 구성부품을 시험하기 위한 캐리어 및 시스템
US4692839A (en) Multiple chip interconnection system and package
US20020008529A1 (en) High density, area array probe card apparatus
US6025731A (en) Hybrid interconnect and system for testing semiconductor dice
JPH04233264A (ja) コンパクト型高密度接続構造
EP0702847A1 (en) Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US6236112B1 (en) Semiconductor device, connecting substrate therefor, and process of manufacturing connecting substrate
US5893727A (en) Method for manufacturing a massive parallel interconnection attachment using flexible circuit
US6256207B1 (en) Chip-sized semiconductor device and process for making same
WO1989012911A1 (en) Protected lead frame and method for fabricating lead frames
US6819127B1 (en) Method for testing semiconductor components using interposer
JP2004056135A (ja) １つの金属層を備え折り返されたテープ領域アレイ・パッケージ
RU2134498C1 (ru) Контактный узел
EP0521720A1 (en) Heat-dissipating multi-layer circuit board
JP2001007252A (ja) 半導体装置およびその製造方法
JP2002257898A (ja) 半導体装置検査用プローブ構造とその製造方法
JPH0425038A (ja) 半導体装置およびその製造方法ならびに半導体装置を用いた電子回路装置
JPH06347480A (ja) プローブ構造
KR100294835B1 (ko) 반도체 장치 시험용 기판 및 반도체 장치 시험방법
JP2733359B2 (ja) テストヘッド構造

Legal Events

Date Code Title Description
MKEX Expiry