CA1235528A - Radiateur pour composants electroniques portes par des substrats en matiere ceramique - Google Patents
Radiateur pour composants electroniques portes par des substrats en matiere ceramiqueInfo
- Publication number
- CA1235528A CA1235528A CA000489001A CA489001A CA1235528A CA 1235528 A CA1235528 A CA 1235528A CA 000489001 A CA000489001 A CA 000489001A CA 489001 A CA489001 A CA 489001A CA 1235528 A CA1235528 A CA 1235528A
- Authority
- CA
- Canada
- Prior art keywords
- electronic components
- heat
- ceramic
- ceramic substrate
- ceramic plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 41
- 239000000758 substrate Substances 0.000 title claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 title description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 4
- 229910001316 Ag alloy Inorganic materials 0.000 claims 1
- 229910001252 Pd alloy Inorganic materials 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 241000282320 Panthera leo Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10242—Metallic cylinders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65964884A | 1984-10-11 | 1984-10-11 | |
| US659,648 | 1984-10-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1235528A true CA1235528A (fr) | 1988-04-19 |
Family
ID=24646223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000489001A Expired CA1235528A (fr) | 1984-10-11 | 1985-08-19 | Radiateur pour composants electroniques portes par des substrats en matiere ceramique |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH0669119B2 (fr) |
| CA (1) | CA1235528A (fr) |
| DE (1) | DE3531729A1 (fr) |
| FR (1) | FR2571921B1 (fr) |
| GB (1) | GB2165704B (fr) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4682269A (en) * | 1984-10-11 | 1987-07-21 | Teradyne, Inc. | Heat dissipation for electronic components on a ceramic substrate |
| GB2198888A (en) * | 1986-12-09 | 1988-06-22 | Lucas Ind Plc | Cooling electronic components |
| DE3822890A1 (de) * | 1988-03-15 | 1989-09-28 | Siemens Ag | Kuehlanordnung fuer einen optischen zeichengenerator |
| US5158136A (en) * | 1991-11-12 | 1992-10-27 | At&T Laboratories | Pin fin heat sink including flow enhancement |
| DE4437971C2 (de) * | 1994-10-24 | 1997-09-11 | Siemens Ag | Kühleinrichtung für elektrische Baugruppen |
| KR20150031818A (ko) * | 2013-09-17 | 2015-03-25 | 삼성전자주식회사 | 온도감소가 가능한 휴대전자장치 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2137001A1 (fr) * | 1971-05-11 | 1972-12-29 | Thomson Csf | |
| JPS5647962Y2 (fr) * | 1976-02-03 | 1981-11-10 | ||
| US4034469A (en) * | 1976-09-03 | 1977-07-12 | Ibm Corporation | Method of making conduction-cooled circuit package |
| DE7821509U1 (de) * | 1978-07-18 | 1978-10-26 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Kühlvorrichtung für LSI-Plättchen |
| US4292647A (en) * | 1979-04-06 | 1981-09-29 | Amdahl Corporation | Semiconductor package and electronic array having improved heat dissipation |
| JPS56164559U (fr) * | 1980-05-09 | 1981-12-07 | ||
| DE3031912A1 (de) * | 1980-08-23 | 1982-04-01 | Brown, Boveri & Cie Ag, 6800 Mannheim | Anordnung zur potentialunabhaengigen waermeabfuehrung |
| FR2495838A1 (fr) * | 1980-12-05 | 1982-06-11 | Cii Honeywell Bull | Dispositif de refroidissement amovible pour supports de circuits integres |
| JPS57120390A (en) * | 1981-01-19 | 1982-07-27 | Mitsubishi Electric Corp | Ceramic circuit board |
| JPS5832313U (ja) * | 1981-08-20 | 1983-03-02 | トキコ株式会社 | 車高検出器 |
| US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
| US4546405A (en) * | 1983-05-25 | 1985-10-08 | International Business Machines Corporation | Heat sink for electronic package |
| DE3469827D1 (en) * | 1983-08-23 | 1988-04-14 | Bbc Brown Boveri & Cie | Ceramic-metallic element |
-
1985
- 1985-08-19 CA CA000489001A patent/CA1235528A/fr not_active Expired
- 1985-09-05 DE DE19853531729 patent/DE3531729A1/de active Granted
- 1985-09-26 JP JP60213621A patent/JPH0669119B2/ja not_active Expired - Lifetime
- 1985-10-08 GB GB8524805A patent/GB2165704B/en not_active Expired
- 1985-10-11 FR FR8515123A patent/FR2571921B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE3531729A1 (de) | 1986-04-17 |
| GB2165704B (en) | 1988-05-11 |
| JPS6195598A (ja) | 1986-05-14 |
| GB2165704A (en) | 1986-04-16 |
| GB8524805D0 (en) | 1985-11-13 |
| FR2571921B1 (fr) | 1989-02-03 |
| JPH0669119B2 (ja) | 1994-08-31 |
| DE3531729C2 (fr) | 1987-10-29 |
| FR2571921A1 (fr) | 1986-04-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4682269A (en) | Heat dissipation for electronic components on a ceramic substrate | |
| US4612601A (en) | Heat dissipative integrated circuit chip package | |
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| US5386341A (en) | Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape | |
| KR100217528B1 (ko) | 반도체 칩 패키지 및 그의 제조 방법 | |
| KR100343386B1 (ko) | 열전달 효율이 향상된 열전 모듈 및 그 제조 방법 | |
| EP0678917B1 (fr) | Elément de support pour moyens de refroidissement et boítier électronique utilisant un tel élément | |
| US5760469A (en) | Semiconductor device and semiconductor device mounting board | |
| JPH09512668A (ja) | テープ貼付けプラットフォームおよびその製造方法 | |
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| US6034437A (en) | Semiconductor device having a matrix of bonding pads | |
| CA1235528A (fr) | Radiateur pour composants electroniques portes par des substrats en matiere ceramique | |
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| JP3139523B2 (ja) | 放熱フィン | |
| GB2301937A (en) | IC package with a ball grid array on a single layer ceramic substrate | |
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| JP3432552B2 (ja) | 窒化アルミニウム多層基板 | |
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| JPH0514514Y2 (fr) | ||
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| JP2661230B2 (ja) | 混成集積回路装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |