BRPI0805314A2 - dispositivos de contato embutidos para filmes baseados em nitreto e produção dos mesmos - Google Patents

dispositivos de contato embutidos para filmes baseados em nitreto e produção dos mesmos

Info

Publication number
BRPI0805314A2
BRPI0805314A2 BRPI0805314-6A BRPI0805314A BRPI0805314A2 BR PI0805314 A2 BRPI0805314 A2 BR PI0805314A2 BR PI0805314 A BRPI0805314 A BR PI0805314A BR PI0805314 A2 BRPI0805314 A2 BR PI0805314A2
Authority
BR
Brazil
Prior art keywords
layer
contact
production
contact devices
nitride based
Prior art date
Application number
BRPI0805314-6A
Other languages
English (en)
Inventor
Kenneth Scott Alexander Butcher
Marie-Pierre Francoise Fouquet
Alanna Julia June Fernandes
Original Assignee
Gallium Entpr Pty Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from AU2007903940A external-priority patent/AU2007903940A0/en
Application filed by Gallium Entpr Pty Ltd filed Critical Gallium Entpr Pty Ltd
Publication of BRPI0805314A2 publication Critical patent/BRPI0805314A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/743—Making of internal connections, substrate contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • H01L21/746—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts for AIII-BV integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Lasers (AREA)
  • Bipolar Transistors (AREA)

Abstract

DISPOSITIVOS DE CONTATO EMBUTIDOS PARA FILMES BASEADOS EM NITRETO E PRODUçãO DOS MESMOS. A presente invenção refere-se a dispositivo semicondutor, que compreende: um substrato; um primeiro contato; uma primeira camada de material semicondutor dopado, depositada sobre o substrato; uma região de junção semicondutora, depositada sobre a primeira camada; uma segunda camada de material semicondutor dopado, depositada sobre a região de junção, sendo que a segunda camada tem uma polaridade de dopagem semicondutora oposta à da primeira camada; e um segundo contato; sendo que o segundo contato está em comunicação elétrica com a segunda camada e o primeiro contato está embutido dentro do dispositivo semicondutor entre o substrato e a região de junção e está em comunicação elétrica com a primeira camada; e processos para produção de um dispositivo semicondutor de contato embutido.
BRPI0805314-6A 2007-07-20 2008-07-21 dispositivos de contato embutidos para filmes baseados em nitreto e produção dos mesmos BRPI0805314A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU2007903940A AU2007903940A0 (en) 2007-07-20 Buried contact devices for a nitride-based films and manufacture thereof

Publications (1)

Publication Number Publication Date
BRPI0805314A2 true BRPI0805314A2 (pt) 2009-07-28

Family

ID=39884395

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0805314-6A BRPI0805314A2 (pt) 2007-07-20 2008-07-21 dispositivos de contato embutidos para filmes baseados em nitreto e produção dos mesmos

Country Status (12)

Country Link
US (1) US20090020768A1 (pt)
EP (1) EP2017884A3 (pt)
JP (1) JP2009044149A (pt)
KR (1) KR20090009761A (pt)
CN (1) CN101604665A (pt)
AU (1) AU2008203209A1 (pt)
BR (1) BRPI0805314A2 (pt)
CA (1) CA2638191A1 (pt)
RU (1) RU2394305C2 (pt)
SG (1) SG149774A1 (pt)
TW (1) TW200915476A (pt)
ZA (1) ZA200806479B (pt)

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Also Published As

Publication number Publication date
US20090020768A1 (en) 2009-01-22
JP2009044149A (ja) 2009-02-26
SG149774A1 (en) 2009-02-27
EP2017884A3 (en) 2011-03-23
EP2017884A2 (en) 2009-01-21
RU2008129818A (ru) 2010-01-27
TW200915476A (en) 2009-04-01
ZA200806479B (en) 2009-04-29
RU2394305C2 (ru) 2010-07-10
AU2008203209A1 (en) 2009-02-05
KR20090009761A (ko) 2009-01-23
CA2638191A1 (en) 2009-01-20
CN101604665A (zh) 2009-12-16

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

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