BRPI0717583A2 - Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. - Google Patents

Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. Download PDF

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Publication number
BRPI0717583A2
BRPI0717583A2 BRPI0717583-3A BRPI0717583A BRPI0717583A2 BR PI0717583 A2 BRPI0717583 A2 BR PI0717583A2 BR PI0717583 A BRPI0717583 A BR PI0717583A BR PI0717583 A2 BRPI0717583 A2 BR PI0717583A2
Authority
BR
Brazil
Prior art keywords
composition
catalyst
benzoxazine
formula
component
Prior art date
Application number
BRPI0717583-3A
Other languages
English (en)
Portuguese (pt)
Inventor
Sudo Atsushi
Endo Takeshi
Taden Andreas
Schönfeld Rainer
Huver Thomas
Original Assignee
Henkel Ag & Co. Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Ag & Co. Kgaa filed Critical Henkel Ag & Co. Kgaa
Publication of BRPI0717583A2 publication Critical patent/BRPI0717583A2/pt

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F10/00Homopolymers and copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C08G61/122Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/02Polyamines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12044OLED

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Nitrogen And Oxygen As The Only Ring Hetero Atoms (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
BRPI0717583-3A 2006-09-21 2007-09-18 Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura. BRPI0717583A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06019761.3 2006-09-21
EP06019761 2006-09-21
PCT/EP2007/059814 WO2008034814A2 (en) 2006-09-21 2007-09-18 Benzoxazine-containing formulations polymerizable/curable at low temperature

Publications (1)

Publication Number Publication Date
BRPI0717583A2 true BRPI0717583A2 (pt) 2013-10-29

Family

ID=38819382

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0717583-3A BRPI0717583A2 (pt) 2006-09-21 2007-09-18 Formulações contendo benzoxazina polimerizáveis / curáveis em baixa temperatura.

Country Status (7)

Country Link
US (1) US8318878B2 (cg-RX-API-DMAC7.html)
EP (1) EP2064260B1 (cg-RX-API-DMAC7.html)
JP (1) JP5658457B2 (cg-RX-API-DMAC7.html)
CN (1) CN101516922B (cg-RX-API-DMAC7.html)
BR (1) BRPI0717583A2 (cg-RX-API-DMAC7.html)
ES (1) ES2550540T3 (cg-RX-API-DMAC7.html)
WO (1) WO2008034814A2 (cg-RX-API-DMAC7.html)

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WO2008034753A1 (en) * 2006-09-21 2008-03-27 Henkel Ag & Co. Kgaa Catalytic low temperature polymerization
EP2152784A1 (en) 2007-05-25 2010-02-17 Henkel AG & Co. KGaA Benzoxazine-formulations with reduced outgassing behaviour
WO2009115488A1 (en) * 2008-03-19 2009-09-24 Henkel Ag & Co. Kgaa Copolymerization method
US8383706B2 (en) 2009-06-05 2013-02-26 3M Innovative Properties Company Benzoxazine-thiol adducts
US8389758B2 (en) 2009-06-05 2013-03-05 3M Innovative Properties Company Benzoxazine-thiol adducts
US20110054100A1 (en) * 2009-08-26 2011-03-03 3M Innovative Properties Company Polybenzoxazine composition
JP5654026B2 (ja) * 2009-10-15 2015-01-14 ヘンケル コーポレイションHenkel Corporation 嫌気硬化性組成物
EP2336221A1 (en) * 2010-12-10 2011-06-22 Henkel AG & Co. KGaA Curable compositions
KR102011258B1 (ko) * 2012-02-17 2019-08-16 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 벤족사진, 에폭시 및 무수물의 혼합물
WO2014179100A1 (en) * 2013-04-30 2014-11-06 3M Innovative Properties Company Process for preparing poly(benzoxazines)
WO2017072678A1 (en) 2015-10-26 2017-05-04 Oti Lumionics Inc. Method for patterning a coating on a surface and device including a patterned coating
CN108698082B (zh) * 2015-12-16 2022-12-06 索尔维特殊聚合物意大利有限公司 多层组件
BR112018073028B1 (pt) * 2016-05-10 2023-04-11 Huntsman Advanced Materials Americas Llc Sistema curável, artigo curado, e, método para produção de um prepreg ou towpreg
CN106047270A (zh) * 2016-05-26 2016-10-26 合肥市田源精铸有限公司 一种可用于低温的金属胶黏剂及其制备方法
KR102383690B1 (ko) 2016-06-30 2022-04-06 코오롱인더스트리 주식회사 벤족사진계 혼합물, 및 이의 용도
TW201829514A (zh) * 2016-09-15 2018-08-16 美商3M新設資產公司 苯并組成物
CN118215324B (zh) 2016-12-02 2025-08-15 Oti照明公司 包括设置在发射区域上面的导电涂层的器件及其方法
KR20240113977A (ko) 2017-05-17 2024-07-23 오티아이 루미오닉스 인크. 패턴화 코팅 위에 전도성 코팅을 선택적으로 증착시키는 방법 및 전도성 코팅을 포함하는 디바이스
CN108047870B (zh) * 2017-11-23 2019-11-22 中国航发北京航空材料研究院 一种用于钛合金紧固件外表面的防护涂料及其制备方法
US11751415B2 (en) 2018-02-02 2023-09-05 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
JP7320851B2 (ja) 2018-05-07 2023-08-04 オーティーアイ ルミオニクス インコーポレーテッド 補助電極を提供するための方法および補助電極を含むデバイス
CN117769309A (zh) 2018-11-23 2024-03-26 Oti照明公司 电致发光装置
WO2020169785A1 (en) 2019-02-22 2020-08-27 Universitat Autonoma De Barcelona Process for polymerizing 1,3-benzoxazines
KR20250160226A (ko) 2019-03-07 2025-11-11 오티아이 루미오닉스 인크. 핵생성 억제 코팅물 형성용 재료 및 이를 포함하는 디바이스
KR102831863B1 (ko) 2019-04-18 2025-07-10 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 형성용 물질 및 이를 포함하는 디바이스
WO2020225778A1 (en) 2019-05-08 2020-11-12 Oti Lumionics Inc. Materials for forming a nucleation-inhibiting coating and devices incorporating same
CN114097102B (zh) 2019-06-26 2023-11-03 Oti照明公司 包括具有光衍射特征的光透射区域的光电设备
KR20250090366A (ko) 2019-08-09 2025-06-19 오티아이 루미오닉스 인크. 보조 전극 및 파티션을 포함하는 광전자 디바이스
JP7403883B2 (ja) 2019-12-24 2023-12-25 オーティーアイ ルミオニクス インコーポレーテッド キャッピング層を含む発光デバイスおよびそれを製造するための方法
KR102858688B1 (ko) 2020-12-07 2025-09-12 오티아이 루미오닉스 인크. 핵 생성 억제 코팅 및 하부 금속 코팅을 사용한 전도성 증착 층의 패턴화

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JP3353847B2 (ja) * 1993-05-12 2002-12-03 日立化成工業株式会社 半導体封止用樹脂組成物及び樹脂封止型半導体装置
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JP4570419B2 (ja) * 2004-08-20 2010-10-27 ナミックス株式会社 液状の封止用樹脂組成物

Also Published As

Publication number Publication date
EP2064260A2 (en) 2009-06-03
WO2008034814A3 (en) 2008-07-03
US20100144964A1 (en) 2010-06-10
CN101516922B (zh) 2013-03-06
US8318878B2 (en) 2012-11-27
EP2064260B1 (en) 2015-08-26
ES2550540T3 (es) 2015-11-10
WO2008034814A2 (en) 2008-03-27
CN101516922A (zh) 2009-08-26
JP5658457B2 (ja) 2015-01-28
JP2010504386A (ja) 2010-02-12

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 17A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2792 DE 09-07-2024 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.