BRPI0710241A2 - dispositivo e método para o revestimento eletrolìtico de pelo menos um substrato,e, uso do dispositivo - Google Patents

dispositivo e método para o revestimento eletrolìtico de pelo menos um substrato,e, uso do dispositivo Download PDF

Info

Publication number
BRPI0710241A2
BRPI0710241A2 BRPI0710241-0A BRPI0710241A BRPI0710241A2 BR PI0710241 A2 BRPI0710241 A2 BR PI0710241A2 BR PI0710241 A BRPI0710241 A BR PI0710241A BR PI0710241 A2 BRPI0710241 A2 BR PI0710241A2
Authority
BR
Brazil
Prior art keywords
substrate
strip
conductive
axes
electrically conductive
Prior art date
Application number
BRPI0710241-0A
Other languages
English (en)
Portuguese (pt)
Inventor
Rene Lochtman
Juergen Kaczun
Norbert Schneider
Juergen Pfister
Gert Pohl
Norbert Wagner
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Publication of BRPI0710241A2 publication Critical patent/BRPI0710241A2/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/14Electrodes, e.g. composition, counter electrode for pad-plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes
    • C25D5/06Brush or pad plating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/06Wires; Strips; Foils
    • C25D7/0614Strips or foils
    • C25D7/0621In horizontal cells
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
BRPI0710241-0A 2006-04-18 2007-04-17 dispositivo e método para o revestimento eletrolìtico de pelo menos um substrato,e, uso do dispositivo BRPI0710241A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06112723 2006-04-18
EP06112723.9 2006-04-18
PCT/EP2007/053707 WO2007118875A2 (de) 2006-04-18 2007-04-17 Vorrichtung und verfahren zur galvanischen beschichtung

Publications (1)

Publication Number Publication Date
BRPI0710241A2 true BRPI0710241A2 (pt) 2011-08-09

Family

ID=38236519

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0710241-0A BRPI0710241A2 (pt) 2006-04-18 2007-04-17 dispositivo e método para o revestimento eletrolìtico de pelo menos um substrato,e, uso do dispositivo

Country Status (11)

Country Link
US (1) US20090101511A1 (enExample)
EP (1) EP2010699A2 (enExample)
JP (1) JP2009534527A (enExample)
KR (1) KR20090009876A (enExample)
CN (1) CN101473072A (enExample)
BR (1) BRPI0710241A2 (enExample)
CA (1) CA2649786A1 (enExample)
IL (1) IL194754A0 (enExample)
RU (1) RU2420616C2 (enExample)
TW (1) TW200811316A (enExample)
WO (1) WO2007118875A2 (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2422455T3 (es) 2005-08-12 2013-09-11 Modumetal Llc Materiales compuestos modulados de manera composicional y métodos para fabricar los mismos
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
NL1035265C2 (nl) * 2008-04-07 2009-10-08 Meco Equip Eng Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten.
BR122013014461B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada
TW201121680A (en) * 2009-12-18 2011-07-01 Metal Ind Res & Dev Ct Electrochemical machining device and machining method and electrode unit thereof.
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
US20120231574A1 (en) * 2011-03-12 2012-09-13 Jiaxiong Wang Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
HK1220743A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 具有高硬度的镍铬纳米层压涂层
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN105189826B (zh) 2013-03-15 2019-07-16 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
EP2971264A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Nanolaminate coatings
EP2799939A1 (fr) * 2013-04-30 2014-11-05 Universo S.A. Support pour le traitement de pièces de micromécanique
KR101419276B1 (ko) * 2013-08-27 2014-07-15 (주)엠에스티테크놀로지 플라즈마 전해 산화에 의한 코팅 형성 방법
EP3194163A4 (en) 2014-09-18 2018-06-27 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
DE102015121349A1 (de) 2015-12-08 2017-06-08 Staku Anlagenbau Gmbh Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung
KR101681083B1 (ko) * 2016-06-26 2016-12-01 주식회사 지에스아이 곡면부를 포함하는 상대전극을 갖는 도금장치
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US12227869B2 (en) 2016-09-09 2025-02-18 Modumetal, Inc. Application of laminate and nanolaminate materials to tooling and molding processes
KR102412452B1 (ko) 2016-09-14 2022-06-23 모두메탈, 인크. 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN110952121B (zh) * 2018-12-17 2023-12-05 嘉兴瑞通智能装备有限公司 焊带制造装置和电镀机构及其电镀方法
CN110306218B (zh) * 2019-07-15 2024-11-08 中国石油天然气集团有限公司 一种发动机主轴孔自动控制式刷镀设备
CN113512749A (zh) * 2020-12-08 2021-10-19 郑州大学 一种电镀金刚石刀具实验装置
US20240200222A1 (en) * 2021-04-21 2024-06-20 Mitsubishi Electric Corporation Plating electrode and plating method that uses the plating electrode
CN113400698B (zh) * 2021-05-11 2022-12-20 重庆金美新材料科技有限公司 一种导电传动带及其制备方法、薄膜水电镀设备
CN115896907A (zh) * 2022-10-19 2023-04-04 重庆金美新材料科技有限公司 一种阴极导电机构和电镀系统
DE102023120210B4 (de) * 2023-07-28 2025-03-13 Ce Cell Engineering Gmbh Anlage zur elektrischen Kontaktierung von Wafersolarzellen, Inline-Produktionsvorrichtung und Herstellungsverfahren für eine Wafersolarzelle

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1756267U (de) * 1957-06-27 1957-11-14 Aschaffenburger Zellstoffwerke Polsterkissen fuer verpakkungszwecke und als sitzkissen geeignet.
DE1756267A1 (de) * 1968-04-27 1971-10-07 Carl Klingspor Galvanisiervorrichtung fuer Gewebe
LU80496A1 (fr) * 1978-11-09 1980-06-05 Cockerill Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole
SU1435668A1 (ru) * 1986-06-09 1988-11-07 Предприятие П/Я В-8657 Устройство дл двусторонней жидкостной обработки плоских изделий
DE4413149A1 (de) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
GB0005883D0 (en) * 2000-03-13 2000-05-03 Lowe John M Electro-plating apparatus and a method of electoplating
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Also Published As

Publication number Publication date
US20090101511A1 (en) 2009-04-23
TW200811316A (en) 2008-03-01
RU2008145108A (ru) 2010-05-27
WO2007118875A3 (de) 2008-08-07
IL194754A0 (en) 2009-08-03
CN101473072A (zh) 2009-07-01
RU2420616C2 (ru) 2011-06-10
CA2649786A1 (en) 2007-10-25
KR20090009876A (ko) 2009-01-23
EP2010699A2 (de) 2009-01-07
WO2007118875A2 (de) 2007-10-25
JP2009534527A (ja) 2009-09-24

Similar Documents

Publication Publication Date Title
BRPI0710241A2 (pt) dispositivo e método para o revestimento eletrolìtico de pelo menos um substrato,e, uso do dispositivo
BRPI0710662A2 (pt) dispositivo e método para o revestimento eletrolìtico de pelo menos um susbtrato eletricamente condutivo ou uma superfìcie eletricamente condutiva, e, uso do dispositivo
JP2009534527A5 (enExample)
JP6268769B2 (ja) 導電性細線の形成方法並びにこれに用いられる線及び基材
EP3101517B1 (en) Conductive substrate, conductive substrate laminate, method for producing conductive substrate, and method for producing conductive substrate laminate
TW548348B (en) Rotary element for making electric contact, array of at least two rotary elements, and method of placing board-shaped work electrolytically to be processed in electric contact in continuous processing plants
CN1717153B (zh) 用于电解地增大电介质衬底上导电图案的厚度的方法和设备、以及电介质衬底
TW575692B (en) Method for electroplating a strip of foam
JP2009534525A5 (enExample)
CN101437985A (zh) 供电方法、网状物的连续电解电镀装置及带有镀膜的塑料膜的制造方法
CN101473071A (zh) 用于以连续方式电镀衬底的设备和方法
JP4793720B2 (ja) めっき法2層回路基材の製造方法
CN102713019A (zh) 用于在电镀设备中电接触处理物的装置和方法
JP2017222907A (ja) めっき装置
KR101214418B1 (ko) 평탄한 작업편의 전해 처리 장치 및 방법
US20100129612A1 (en) Electrically conducting layer structure and process for the production thereof
JPH05247682A (ja) 電解めっき方法
HK1102970B (en) Device and method for electrolytically treating flat work pieces
HK1015422B (en) Process and device for the electrochemical treatment of items with a fluid

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2161 DE 05/06/2012.