KR20090009876A - 전해 도금 장치 및 방법 - Google Patents

전해 도금 장치 및 방법 Download PDF

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Publication number
KR20090009876A
KR20090009876A KR1020087028157A KR20087028157A KR20090009876A KR 20090009876 A KR20090009876 A KR 20090009876A KR 1020087028157 A KR1020087028157 A KR 1020087028157A KR 20087028157 A KR20087028157 A KR 20087028157A KR 20090009876 A KR20090009876 A KR 20090009876A
Authority
KR
South Korea
Prior art keywords
shaft
substrate
band
electrically conductive
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087028157A
Other languages
English (en)
Korean (ko)
Inventor
레네 로흐트만
위르겐 카춘
노르베르트 슈나이더
위르겐 피스터
게르트 폴
노르베르트 바그너
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20090009876A publication Critical patent/KR20090009876A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020087028157A 2006-04-18 2007-04-17 전해 도금 장치 및 방법 Withdrawn KR20090009876A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06112723 2006-04-18
EP06112723.9 2006-04-18

Publications (1)

Publication Number Publication Date
KR20090009876A true KR20090009876A (ko) 2009-01-23

Family

ID=38236519

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087028157A Withdrawn KR20090009876A (ko) 2006-04-18 2007-04-17 전해 도금 장치 및 방법

Country Status (11)

Country Link
US (1) US20090101511A1 (enExample)
EP (1) EP2010699A2 (enExample)
JP (1) JP2009534527A (enExample)
KR (1) KR20090009876A (enExample)
CN (1) CN101473072A (enExample)
BR (1) BRPI0710241A2 (enExample)
CA (1) CA2649786A1 (enExample)
IL (1) IL194754A0 (enExample)
RU (1) RU2420616C2 (enExample)
TW (1) TW200811316A (enExample)
WO (1) WO2007118875A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
KR101419276B1 (ko) * 2013-08-27 2014-07-15 (주)엠에스티테크놀로지 플라즈마 전해 산화에 의한 코팅 형성 방법
KR101681083B1 (ko) * 2016-06-26 2016-12-01 주식회사 지에스아이 곡면부를 포함하는 상대전극을 갖는 도금장치

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ES2422455T3 (es) 2005-08-12 2013-09-11 Modumetal Llc Materiales compuestos modulados de manera composicional y métodos para fabricar los mismos
TW200829726A (en) * 2006-11-28 2008-07-16 Basf Ag Method and device for electrolytic coating
KR20100126505A (ko) * 2008-03-13 2010-12-01 바스프 에스이 금속층을 기재에 도포하기 위한 방법 및 분산액 및 금속화가능한 열가소성 몰딩 화합물
NL1035265C2 (nl) * 2008-04-07 2009-10-08 Meco Equip Eng Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten.
BR122013014461B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada
TW201121680A (en) * 2009-12-18 2011-07-01 Metal Ind Res & Dev Ct Electrochemical machining device and machining method and electrode unit thereof.
US20120231574A1 (en) * 2011-03-12 2012-09-13 Jiaxiong Wang Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells
US10472727B2 (en) 2013-03-15 2019-11-12 Modumetal, Inc. Method and apparatus for continuously applying nanolaminate metal coatings
HK1220743A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 具有高硬度的镍铬纳米层压涂层
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN105189826B (zh) 2013-03-15 2019-07-16 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
EP2971264A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Nanolaminate coatings
EP2799939A1 (fr) * 2013-04-30 2014-11-05 Universo S.A. Support pour le traitement de pièces de micromécanique
EP3194163A4 (en) 2014-09-18 2018-06-27 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
DE102015121349A1 (de) 2015-12-08 2017-06-08 Staku Anlagenbau Gmbh Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US12227869B2 (en) 2016-09-09 2025-02-18 Modumetal, Inc. Application of laminate and nanolaminate materials to tooling and molding processes
KR102412452B1 (ko) 2016-09-14 2022-06-23 모두메탈, 인크. 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
CA3057836A1 (en) 2017-03-24 2018-09-27 Modumetal, Inc. Lift plungers with electrodeposited coatings, and systems and methods for producing the same
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN110952121B (zh) * 2018-12-17 2023-12-05 嘉兴瑞通智能装备有限公司 焊带制造装置和电镀机构及其电镀方法
CN110306218B (zh) * 2019-07-15 2024-11-08 中国石油天然气集团有限公司 一种发动机主轴孔自动控制式刷镀设备
CN113512749A (zh) * 2020-12-08 2021-10-19 郑州大学 一种电镀金刚石刀具实验装置
US20240200222A1 (en) * 2021-04-21 2024-06-20 Mitsubishi Electric Corporation Plating electrode and plating method that uses the plating electrode
CN113400698B (zh) * 2021-05-11 2022-12-20 重庆金美新材料科技有限公司 一种导电传动带及其制备方法、薄膜水电镀设备
CN115896907A (zh) * 2022-10-19 2023-04-04 重庆金美新材料科技有限公司 一种阴极导电机构和电镀系统
DE102023120210B4 (de) * 2023-07-28 2025-03-13 Ce Cell Engineering Gmbh Anlage zur elektrischen Kontaktierung von Wafersolarzellen, Inline-Produktionsvorrichtung und Herstellungsverfahren für eine Wafersolarzelle

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DE1756267U (de) * 1957-06-27 1957-11-14 Aschaffenburger Zellstoffwerke Polsterkissen fuer verpakkungszwecke und als sitzkissen geeignet.
DE1756267A1 (de) * 1968-04-27 1971-10-07 Carl Klingspor Galvanisiervorrichtung fuer Gewebe
LU80496A1 (fr) * 1978-11-09 1980-06-05 Cockerill Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole
SU1435668A1 (ru) * 1986-06-09 1988-11-07 Предприятие П/Я В-8657 Устройство дл двусторонней жидкостной обработки плоских изделий
DE4413149A1 (de) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
GB0005883D0 (en) * 2000-03-13 2000-05-03 Lowe John M Electro-plating apparatus and a method of electoplating
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen
DE10234705B4 (de) * 2001-10-25 2008-01-17 Infineon Technologies Ag Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen
DE10342512B3 (de) * 2003-09-12 2004-10-28 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103450B1 (ko) * 2010-07-27 2012-01-09 주식회사 케이씨텍 기판 도금 장치
KR101419276B1 (ko) * 2013-08-27 2014-07-15 (주)엠에스티테크놀로지 플라즈마 전해 산화에 의한 코팅 형성 방법
KR101681083B1 (ko) * 2016-06-26 2016-12-01 주식회사 지에스아이 곡면부를 포함하는 상대전극을 갖는 도금장치

Also Published As

Publication number Publication date
US20090101511A1 (en) 2009-04-23
TW200811316A (en) 2008-03-01
RU2008145108A (ru) 2010-05-27
BRPI0710241A2 (pt) 2011-08-09
WO2007118875A3 (de) 2008-08-07
IL194754A0 (en) 2009-08-03
CN101473072A (zh) 2009-07-01
RU2420616C2 (ru) 2011-06-10
CA2649786A1 (en) 2007-10-25
EP2010699A2 (de) 2009-01-07
WO2007118875A2 (de) 2007-10-25
JP2009534527A (ja) 2009-09-24

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20081118

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid