BR9713936A - Composição adesiva termicamente retrabalhável para fixar matriz, e, processo para fixação de um dispositivo semi condutor a um substrato - Google Patents

Composição adesiva termicamente retrabalhável para fixar matriz, e, processo para fixação de um dispositivo semi condutor a um substrato

Info

Publication number
BR9713936A
BR9713936A BR9713936-0A BR9713936A BR9713936A BR 9713936 A BR9713936 A BR 9713936A BR 9713936 A BR9713936 A BR 9713936A BR 9713936 A BR9713936 A BR 9713936A
Authority
BR
Brazil
Prior art keywords
fixing
matrix
substrate
thermally
adhesive composition
Prior art date
Application number
BR9713936-0A
Other languages
English (en)
Inventor
Shridhar Ratnaswamy Iyer
Pui Kwan Wong
Original Assignee
Shell Int Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Int Research filed Critical Shell Int Research
Publication of BR9713936A publication Critical patent/BR9713936A/pt

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G67/00—Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing oxygen or oxygen and carbon, not provided for in groups C08G2/00 - C08G65/00
    • C08G67/02—Copolymers of carbon monoxide and aliphatic unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/49513—Lead-frames or other flat leads characterised by the die pad having bonding material between chip and die pad
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Landscapes

  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)

Abstract

"COMPOSIçãO ADESIVA TERMICAMENTE RETRABALHáVEL PARA FIXAR MATRIZ, E, PROCESSO PARA FIXAçãO DE UM DISPOSITIVO SEMI CONDUTOR A UM SUBSTRATO". é proporcionado uma nova composição adesiva termicamente retrabalhável para fixar matriz para a fixação de dispositivo semi condutor a um substrato. A composição compreende (a) uma resina termicamente retrabalhável com ligações cruzadas produzida pela reação de pelo menos uma dienofila possuindo uma funcionalidade maior que um e pelo menos um polímero contendo furano substituído por 2,5 -dialquil, e (b) pelo menos um material condutivo termicamente e/ou eletricamente presente em uma quantidade efetiva até 90% por peso da composição para fixar matriz para proporcionar um meio condutivo.
BR9713936-0A 1996-12-16 1997-12-15 Composição adesiva termicamente retrabalhável para fixar matriz, e, processo para fixação de um dispositivo semi condutor a um substrato BR9713936A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/767,057 US5912282A (en) 1996-12-16 1996-12-16 Die attach adhesive compositions
PCT/EP1997/007155 WO1998027177A1 (en) 1996-12-16 1997-12-15 Die attach adhesive compositions

Publications (1)

Publication Number Publication Date
BR9713936A true BR9713936A (pt) 2000-03-28

Family

ID=25078354

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9713936-0A BR9713936A (pt) 1996-12-16 1997-12-15 Composição adesiva termicamente retrabalhável para fixar matriz, e, processo para fixação de um dispositivo semi condutor a um substrato

Country Status (15)

Country Link
US (3) US5912282A (pt)
EP (1) EP0944685B1 (pt)
JP (1) JP2002503263A (pt)
KR (1) KR20000069471A (pt)
CN (1) CN1101438C (pt)
AU (1) AU729363B2 (pt)
BR (1) BR9713936A (pt)
CA (1) CA2275194A1 (pt)
DE (1) DE69733485D1 (pt)
HU (1) HUP0000802A3 (pt)
ID (1) ID21758A (pt)
IL (1) IL130145A0 (pt)
MY (1) MY117024A (pt)
WO (1) WO1998027177A1 (pt)
ZA (1) ZA9711198B (pt)

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US6274389B1 (en) 1997-01-17 2001-08-14 Loctite (R&D) Ltd. Mounting structure and mounting process from semiconductor devices
US6316528B1 (en) 1997-01-17 2001-11-13 Loctite (R&D) Limited Thermosetting resin compositions
JP4190611B2 (ja) * 1998-03-13 2008-12-03 パナソニック株式会社 部品装着方法、及び部品装着装置
WO1999054372A1 (en) * 1998-04-22 1999-10-28 Multicore Solders Limited Adhesive and encapsulating material with fluxing properties
US6350840B1 (en) * 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
SG78377A1 (en) * 1998-07-02 2001-02-20 Nat Starch Chem Invest Method of making electronic component using reworkable adhesives
SG85658A1 (en) * 1998-07-02 2002-01-15 Nat Starch Chem Invest Package encapsulants prepared from allylated amide compounds
US7019410B1 (en) * 1999-12-21 2006-03-28 Micron Technology, Inc. Die attach material for TBGA or flexible circuitry
US6271335B1 (en) * 2000-01-18 2001-08-07 Sandia Corporation Method of making thermally removable polymeric encapsulants
US6570245B1 (en) 2000-03-09 2003-05-27 Intel Corporation Stress shield for microelectronic dice
US6426552B1 (en) 2000-05-19 2002-07-30 Micron Technology, Inc. Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another and assemblies and packages including components secured to one another with such hybrid adhesive materials
US6421253B1 (en) 2000-09-08 2002-07-16 Powerwave Technologies, Inc. Durable laminated electronics assembly using epoxy preform
SG97938A1 (en) 2000-09-21 2003-08-20 Micron Technology Inc Method to prevent die attach adhesive contamination in stacked chips
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
JP2004307859A (ja) * 2003-04-05 2004-11-04 Rohm & Haas Electronic Materials Llc 電子デバイス製造
US7776940B2 (en) 2005-12-20 2010-08-17 3M Innovative Properties Company Methods for reducing bond strengths, dental compositions, and the use thereof
US8026296B2 (en) 2005-12-20 2011-09-27 3M Innovative Properties Company Dental compositions including a thermally labile component, and the use thereof
US7896650B2 (en) 2005-12-20 2011-03-01 3M Innovative Properties Company Dental compositions including radiation-to-heat converters, and the use thereof
US20080085572A1 (en) * 2006-10-05 2008-04-10 Advanced Chip Engineering Technology Inc. Semiconductor packaging method by using large panel size
WO2009123608A1 (en) * 2008-03-31 2009-10-08 National Starcha And Chemical Investment Multilayer uv-curable adhesive film
US20110018127A1 (en) * 2008-03-31 2011-01-27 Byoungchul Lee Multilayer UV-Curable Adhesive Film
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CN1101438C (zh) 2003-02-12
HUP0000802A2 (en) 2000-07-28
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AU5858798A (en) 1998-07-15
IL130145A0 (en) 2000-06-01
WO1998027177A1 (en) 1998-06-25
ZA9711198B (en) 1998-06-23
EP0944685B1 (en) 2005-06-08
CN1240470A (zh) 2000-01-05
DE69733485D1 (de) 2005-07-14
HUP0000802A3 (en) 2001-05-28
AU729363B2 (en) 2001-02-01
EP0944685A1 (en) 1999-09-29
JP2002503263A (ja) 2002-01-29
US6147141A (en) 2000-11-14
US5973052A (en) 1999-10-26
US5912282A (en) 1999-06-15
KR20000069471A (ko) 2000-11-25

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