BR9612770A - Composições materiais reticulados de base biólogica, método de obtenção do mesmo e estrutura feita a partir de tais materiais - Google Patents

Composições materiais reticulados de base biólogica, método de obtenção do mesmo e estrutura feita a partir de tais materiais

Info

Publication number
BR9612770A
BR9612770A BR9612770-8A BR9612770A BR9612770A BR 9612770 A BR9612770 A BR 9612770A BR 9612770 A BR9612770 A BR 9612770A BR 9612770 A BR9612770 A BR 9612770A
Authority
BR
Brazil
Prior art keywords
materials
bio
compositions
obtaining
structure made
Prior art date
Application number
BR9612770-8A
Other languages
English (en)
Inventor
Ali Afzali-Ardanki
Jeffrey D Gelorme
Laura L Kosbar
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR9612770A publication Critical patent/BR9612770A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08H—DERIVATIVES OF NATURAL MACROMOLECULAR COMPOUNDS
    • C08H6/00—Macromolecular compounds derived from lignin, e.g. tannins, humic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C08L97/005—Lignin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
  • Materials For Medical Uses (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Information Transfer Between Computers (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Hydrogenated Pyridines (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Epoxy Resins (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Lubricants (AREA)
  • Cosmetics (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

Patente de Invenção:<MU><B>"COMPOSIçõES DE MATERIAIS RETICULADOS DE BASE BIOLóGICA, MéTODO DE OBTENçAO DAS MESMAS E ESTRUTURA FEITA A PARTIR DE TAIS MATERIAIS"<D><MV>. Descrevem-se composições reticuladas, métodos de fabricação e estruturas, em particular, placas de circuito impresso de base biológica que utilizam as composições e os métodos de fabricação das estruturas. Materiais de base biológica, tais como lignina, óleos vegetais, resinas de madeira, taninos, polissacarídeos e suas combinações são reticulados, de preferência com o uso do calor, um agente reticulador e um iniciador. Os materiais fabricados possuem propriedades adequadas para placas de circuito impresso que são fabricadas pela impregnação de um tecido de fibra de vidro ou de base biológica com uma mistura do material de base biológica, agente reticulador e iniciador, que é processada por métodos convencionais, a fim de produzir uma placa de circuito impresso.
BR9612770-8A 1995-09-18 1996-09-12 Composições materiais reticulados de base biólogica, método de obtenção do mesmo e estrutura feita a partir de tais materiais BR9612770A (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US52993295A 1995-09-18 1995-09-18
US52984995A 1995-09-18 1995-09-18
US52988995A 1995-09-18 1995-09-18
PCT/GB1996/002246 WO1997011109A1 (en) 1995-09-18 1996-09-12 Cross-linked biobased materials and uses thereof

Publications (1)

Publication Number Publication Date
BR9612770A true BR9612770A (pt) 1999-12-07

Family

ID=27415034

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9612770-8A BR9612770A (pt) 1995-09-18 1996-09-12 Composições materiais reticulados de base biólogica, método de obtenção do mesmo e estrutura feita a partir de tais materiais

Country Status (15)

Country Link
EP (1) EP0851885B1 (pt)
JP (3) JPH09143305A (pt)
CN (1) CN1114664C (pt)
AT (1) ATE188498T1 (pt)
BR (1) BR9612770A (pt)
CA (1) CA2184761A1 (pt)
CZ (1) CZ82298A3 (pt)
DE (1) DE69606052T2 (pt)
ES (1) ES2141530T3 (pt)
HK (1) HK1001021A1 (pt)
HU (1) HUP9900564A3 (pt)
PL (1) PL325633A1 (pt)
RU (1) RU2146686C1 (pt)
SG (1) SG47174A1 (pt)
WO (1) WO1997011109A1 (pt)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19720661A1 (de) * 1997-05-16 1998-11-19 Schurig Juergen Substrat für Leiterplatten
DE19852034C1 (de) * 1998-11-11 2000-04-20 Fraunhofer Ges Forschung Zusammensetzung zur Herstellung von Formkörpern und Verfahren zur Herstellung von Formkörpern aus einer solchen Zusammensetzung
JP4465433B2 (ja) * 2002-10-02 2010-05-19 独立行政法人科学技術振興機構 リグニン系マトリックスを有するガラス複合材料
DE10251518B4 (de) * 2002-11-04 2009-10-01 Deutsches Zentrum für Luft- und Raumfahrt e.V. Kontinuierliches Fertigungsverfahren zur Herstellung von Gegenständen aus Faserverbundwerkstoffen aus nachwachsenden Rohstoffen
US6913806B2 (en) 2002-12-20 2005-07-05 Nan Ya Plastics Corporation Copolyester composition for manufacturing large volume polyester bottle
JP4561242B2 (ja) * 2004-08-27 2010-10-13 株式会社明電舎 絶縁性高分子材料組成物
JP2006111599A (ja) * 2004-10-18 2006-04-27 Kansai Paint Co Ltd 防腐剤
JP2006111600A (ja) * 2004-10-18 2006-04-27 Kansai Paint Co Ltd 防蟻剤
JP4588551B2 (ja) * 2005-06-16 2010-12-01 富士通株式会社 レジスト組成物、レジストパターンの形成方法、半導体装置及びその製造方法
JP4862544B2 (ja) 2006-08-02 2012-01-25 株式会社明電舎 絶縁性高分子材料組成物
JP4862543B2 (ja) 2006-08-02 2012-01-25 株式会社明電舎 絶縁性高分子材料組成物
JP2008037921A (ja) 2006-08-02 2008-02-21 Meidensha Corp 絶縁性高分子材料組成物
JP5315606B2 (ja) 2006-12-01 2013-10-16 株式会社明電舎 絶縁性高分子材料組成物
JP5303840B2 (ja) 2007-02-09 2013-10-02 株式会社明電舎 絶縁性高分子材料組成物
JP4998018B2 (ja) * 2007-03-06 2012-08-15 トヨタ車体株式会社 繊維成形体の製造方法
JP5344515B2 (ja) * 2007-05-21 2013-11-20 国立大学法人 鹿児島大学 高分子タンニンゲルの製造方法
FR2924894B1 (fr) * 2007-12-10 2010-12-10 Eads Europ Aeronautic Defence Pieces en materiau composite electro-structural.
CA2709864A1 (en) * 2007-12-21 2009-07-02 Ralph Trksak Thermosetting polysaccharides
JP5532562B2 (ja) 2008-09-02 2014-06-25 株式会社明電舎 絶縁性高分子材料組成物
JP5168504B2 (ja) * 2009-04-22 2013-03-21 信越化学工業株式会社 有機樹脂難燃化用添加剤、難燃性樹脂組成物及びその成形品
JP5390250B2 (ja) * 2009-04-24 2014-01-15 パナソニック株式会社 植物由来組成物とその硬化物
JP2011219715A (ja) * 2010-02-10 2011-11-04 Hitachi Chem Co Ltd 成形用樹脂コンパウンド材料
DE102010028800A1 (de) * 2010-05-10 2011-11-10 Freie Universität Berlin Polymer-Zusammensetzungen auf Basis umweltfreundlicher pflanzlicher und/oder tierischer Öle als wärmeleitfähige Materialien
JP5754169B2 (ja) * 2011-02-25 2015-07-29 住友ベークライト株式会社 リグニン誘導体、リグニン二次誘導体、リグニン樹脂組成物、プリプレグおよび複合構造体
DE102011016918B4 (de) * 2011-04-13 2018-01-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Lösungsmittelfreie Epoxidharzmischung, Verfahren zu deren Herstellung sowie deren Verwendung
TWI448544B (zh) * 2011-04-26 2014-08-11 Ind Tech Res Inst 耐燃劑與耐燃材料
JP5822596B2 (ja) * 2011-08-09 2015-11-24 国立大学法人京都大学 リグニン樹脂成形材料
JP5750336B2 (ja) * 2011-08-09 2015-07-22 国立大学法人京都大学 リグニン樹脂組成物、プリプレグおよび複合構造体
JP6089453B2 (ja) * 2011-08-26 2017-03-08 住友ベークライト株式会社 硬化性リグニン樹脂組成物およびその製造方法
JP6217064B2 (ja) * 2012-09-25 2017-10-25 住友ベークライト株式会社 樹脂組成物および樹脂成形体
US20150344737A1 (en) * 2012-12-18 2015-12-03 Akzo Nobel Coatings International B.V. Lignin Based Coating Compositions
JP2014160710A (ja) * 2013-02-19 2014-09-04 Hitachi Chemical Co Ltd プリント配線板
DE102013219718A1 (de) * 2013-09-30 2015-04-02 Bayerische Motoren Werke Aktiengesellschaft Härtbare Harzzusammensetzung, Faserverbundmaterial, Kit zur Herstellung einer härtbaren Harzzusammensetzung und Verfahren zur Herstellung eines gehärteten Harzes sowie eines Faserverbundwerkstoffes
CZ2015398A3 (cs) * 2015-06-15 2017-02-08 Contipro A.S. Způsob síťování polysacharidů s využitím fotolabilních chránicích skupin
DE102016100083B4 (de) 2016-01-04 2019-02-14 Refractory Intellectual Property Gmbh & Co. Kg Feuerfeste Formkörper und Massen sowie Bindemittel und Verfahren zu deren Herstellung
CN106633027B (zh) * 2016-10-10 2018-06-08 太原理工大学 一种苯胺分子印迹聚合物的制备方法
FR3080627B1 (fr) * 2018-04-26 2021-02-26 Porcher Ind Composition d'adherisage pour textile et textile de renfort y relatif
JP2023550201A (ja) * 2020-10-15 2023-11-30 サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィック バイオベースの材料及びそれを調製するための方法
JP2023177577A (ja) * 2022-06-02 2023-12-14 住友化学株式会社 非対称ジアミンを含む剤及び樹脂並びにその使用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131573A (en) * 1977-02-04 1978-12-26 Westvaco Corporation Process for making lignin gels in bead form
US4769434A (en) * 1985-06-19 1988-09-06 South African Inventions Development Corporation Lignin derivative polymers
GB2281709B (en) * 1993-09-14 1998-04-08 Fujitsu Ltd Biodegradable resin moulded article

Also Published As

Publication number Publication date
HUP9900564A3 (en) 1999-11-29
JP3870039B2 (ja) 2007-01-17
DE69606052D1 (de) 2000-02-10
WO1997011109A1 (en) 1997-03-27
CZ82298A3 (cs) 1998-10-14
JPH09143305A (ja) 1997-06-03
CN1153797A (zh) 1997-07-09
PL325633A1 (en) 1998-08-03
JP3870038B2 (ja) 2007-01-17
EP0851885A1 (en) 1998-07-08
JP2002047375A (ja) 2002-02-12
JP2002053699A (ja) 2002-02-19
HK1001021A1 (en) 1998-05-15
RU2146686C1 (ru) 2000-03-20
CN1114664C (zh) 2003-07-16
EP0851885B1 (en) 2000-01-05
ES2141530T3 (es) 2000-03-16
HUP9900564A2 (hu) 1999-06-28
DE69606052T2 (de) 2000-07-13
CA2184761A1 (en) 1997-03-19
SG47174A1 (en) 1998-03-20
ATE188498T1 (de) 2000-01-15

Similar Documents

Publication Publication Date Title
BR9612770A (pt) Composições materiais reticulados de base biólogica, método de obtenção do mesmo e estrutura feita a partir de tais materiais
KR880007683A (ko) 경화성 조성물 및 접착성 결합을 만드는 방법
KR920018146A (ko) 열가소성 엘라스토머 조성물
ES2132684T3 (es) Producto para el revestimiento con, como minimo, tres componentes, procedimiento para su elaboracion asi como su utilizacion.
BR0317495A (pt) Composições de anidrido alquenil succìnico e método para uso das mesmas
BR9810195A (pt) Composições de polìmero de etileno, artigos fabricados a partir das mesmas e método para melhorar o desempenho de adesão de uma composição polimérica
BR0200311A (pt) Processo para preparar composição para revestimento, e, composição aquosa para revestimento
HU194930B (en) Poly/vinyl-chloride/ composition
SE8404842L (sv) Vattenbaserad bindemedelskomposition baserad pa hydroxyl-akryllatex och multiisocyanat
BRPI0401887A (pt) Método para esterificar madeira, e, produto de madeiragem dimensionalmente estabilizada
FI873047A (fi) Absorberande material foer fixering av vaevnader.
MY115836A (en) Methods of fabricating cross-linked biobased materials and structures fabricated therewith
MY111375A (en) Hydraulic binder composition and its uses
MY124470A (en) Cross-linked biobased materials and uses thereof
BR9914756A (pt) Compósito de polìmero condutor e processo para produzir o mesmo
TR24730A (tr) Polimer elyaf icin yuezey muamele maddesi
KR880005028A (ko) 개선된 폴리에스테르 섬유충전재
Sabri et al. Effect of compatibilizer on mechanical properties and water absorption behaviour of coconut fiber filled polypropylene composite
BR0308367A (pt) Materiais laminados com microesferas para modificar propriedades incorporadas, suspensão de microesferas modificadoras de propriedades de materiais e agente tensoativo para esta
BR9907824A (pt) Usos de homopolìmeros de epsilon-caprolactona de baixo peso molecular e de composições de polìmero vinìlico plastificadas, composição de polìmero vinìlico, e, processo de preparação de composições de polìmero vinìlico
KR100432803B1 (ko) 천연 옥 함유 다기능성 텐트지
Wascher et al. Plywood made from plasma-treated veneers: Shear strength after shrinkage-swelling stress
ES8801933A1 (es) Metodo para obtener un compuesto con propiedades mejoradas como agente de estanqueidad y revestimiento de substratos.
MY119902A (en) Structures fabricated with cross-linked biobased materials
EP0214939A2 (en) Padding material for use in clothing or furnishings

Legal Events

Date Code Title Description
FB36 Technical and formal requirements: requirement - article 36 of industrial property law
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
HHFG Granted patent or certificate of addition of invention: rectification

Free format text: REF. RPI 1710 DE 20031014 ITEM (72)

B24C Patent annual fee: request for for restoration

Free format text: REFERENTE 9A., 10A., 11A., 12A., 13A. E 14A. ANUIDADE(S).

B24H Lapse because of non-payment of annual fees (definitively: art 78 iv lpi)
B15K Others concerning applications: alteration of classification

Ipc: C08H 7/00 (2011.01), C08L 97/00 (2006.0

B24F Patent annual fee: publication cancelled

Free format text: ANULADA A PUBLICACAO CODIGO 24.8 NA RPI NO 2258 DE 15/04/2014 POR TER SIDO INDEVIDA.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE AS 9A, 10A, 11A, 12A, 13A E 14A ANUIDADES.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2607 DE 22-12-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.