JP4862543B2 - 絶縁性高分子材料組成物 - Google Patents
絶縁性高分子材料組成物 Download PDFInfo
- Publication number
- JP4862543B2 JP4862543B2 JP2006210845A JP2006210845A JP4862543B2 JP 4862543 B2 JP4862543 B2 JP 4862543B2 JP 2006210845 A JP2006210845 A JP 2006210845A JP 2006210845 A JP2006210845 A JP 2006210845A JP 4862543 B2 JP4862543 B2 JP 4862543B2
- Authority
- JP
- Japan
- Prior art keywords
- polymer material
- material composition
- polymer
- insulating
- organic peroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/20—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances liquids, e.g. oils
Description
次に、本実施の形態における絶縁性高分子材料組成物の実施例を説明する。まず、本実施例では、エポキシ化大豆油に対して、硬化剤として酸無水物(日立化成工業社製のHN2200R)を化学量論量添加すると共に、その硬化促進剤として架橋剤A〜Eのうち何れかを後述の表1に示すように0.2phr〜20.0phrの範囲で添加して混練(添加量に応じた条件で混練)した後、その混練物に関して温度170℃で1時間熱処理し過酸化物加硫を施すことにより、三次元架橋された絶縁性高分子材料組成物の試料A1〜A6,B1〜B6,C1〜C6,D1〜D6,E1〜E6をそれぞれ作成した。
Claims (2)
- 電圧機器の絶縁構成に用いられるものであって、
エポキシ化大豆油に酸無水物,0.5phr〜16.0phrの有機過酸化物が添加された混練物から成り、
前記の混練物を熱処理により三次元架橋したことを特徴とする絶縁性高分子材料組成物。 - 前記の有機過酸化物は、ジクミルパーオキサイド、2,5ジメチル2,5ジ(t−ブチルペルオキシ)ヘキサン、2,5ジメチル2,5ジ(t−ブチルペルオキシ)ヘキサン−3、1−(2−t−ブチルパーオキシイソプロピル)−4−イソプロピルベンゼン、1−(2−t−ブチルパーオキシイソプロピル)−3−イソプロピルベンゼンのうち何れかであることを特徴とする請求項1記載の絶縁性高分子材料組成物。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006210845A JP4862543B2 (ja) | 2006-08-02 | 2006-08-02 | 絶縁性高分子材料組成物 |
US12/373,929 US20090198040A1 (en) | 2006-08-02 | 2007-08-02 | Insulating polymer material composition |
EP07791873.8A EP2048174B1 (en) | 2006-08-02 | 2007-08-02 | Insulating polymer material composition |
PCT/JP2007/065199 WO2008016120A1 (fr) | 2006-08-02 | 2007-08-02 | Composition de matériau polymère isolant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006210845A JP4862543B2 (ja) | 2006-08-02 | 2006-08-02 | 絶縁性高分子材料組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008037923A JP2008037923A (ja) | 2008-02-21 |
JP4862543B2 true JP4862543B2 (ja) | 2012-01-25 |
Family
ID=38997294
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006210845A Expired - Fee Related JP4862543B2 (ja) | 2006-08-02 | 2006-08-02 | 絶縁性高分子材料組成物 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090198040A1 (ja) |
EP (1) | EP2048174B1 (ja) |
JP (1) | JP4862543B2 (ja) |
WO (1) | WO2008016120A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009114935A1 (en) * | 2008-03-20 | 2009-09-24 | Lillian Peterson | Uv cured high alpha linolenic acid linseed oil epoxy |
US11208420B2 (en) * | 2016-11-22 | 2021-12-28 | Drexel University | Process to produce blended (meth)acrylate/vinyl ester resin cross-linkers |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5132399B2 (ja) * | 1972-07-03 | 1976-09-11 | ||
CH621811A5 (ja) * | 1976-06-17 | 1981-02-27 | Ciba Geigy Ag | |
US4040994A (en) * | 1976-11-26 | 1977-08-09 | Unitech Chemical Inc. | Cured epoxy resins |
DD133054A1 (de) * | 1977-09-16 | 1978-11-29 | Katharina Wieduwilt | Verfahren zur herstellung von epoxyverbindungen |
JPS6112334A (ja) * | 1984-06-29 | 1986-01-20 | 川崎製鉄株式会社 | 複合型制振積層体 |
JPS6128520A (ja) * | 1984-07-20 | 1986-02-08 | Nippon Oil & Fats Co Ltd | 熱硬化性樹脂組成物 |
JPH0681684B2 (ja) * | 1987-12-29 | 1994-10-19 | 大建工業株式会社 | 改質木材及びその製造方法 |
US5095050A (en) * | 1990-11-21 | 1992-03-10 | The Dow Chemical Company | Advanced epoxy compositions, curable compositions and cured products |
EP0692000B1 (en) * | 1993-03-30 | 1997-06-25 | Shell Internationale Researchmaatschappij B.V. | Epoxidized vegetable oil modification of epoxy esters |
SG47174A1 (en) | 1995-09-18 | 1998-03-20 | Ibm | Cross-linked biobased materials and fabricating methods thereof |
US6159913A (en) * | 1998-05-11 | 2000-12-12 | Waverly Light And Power | Soybean based transformer oil and transmission line fluid |
JP2001119129A (ja) * | 1999-10-20 | 2001-04-27 | Tomoegawa Paper Co Ltd | カバーレイフィルム |
JP2001334770A (ja) * | 2000-05-25 | 2001-12-04 | Fuji Photo Film Co Ltd | 平版印刷用版下シートの製造方法 |
JP4369642B2 (ja) | 2001-03-29 | 2009-11-25 | 三井化学株式会社 | 電気ケーブル及び高電圧電源用モールド |
DE602004009538T2 (de) * | 2003-01-08 | 2008-07-31 | Texas Tech University, Lubbock | Elastomere zusammensetzungen auf basis von rizinusöl/epoxidiertem sojabohnenöl |
JP2004331804A (ja) * | 2003-05-07 | 2004-11-25 | Chisso Corp | エポキシ化天然油および籠型構造を有するケイ素化合物からなるハイブリッド樹脂 |
JP2006241331A (ja) * | 2005-03-04 | 2006-09-14 | Osaka Univ | 硬化性油脂組成物 |
JP4961691B2 (ja) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | 絶縁性高分子材料硬化物 |
JP4961692B2 (ja) * | 2005-07-25 | 2012-06-27 | 株式会社明電舎 | 碍子 |
-
2006
- 2006-08-02 JP JP2006210845A patent/JP4862543B2/ja not_active Expired - Fee Related
-
2007
- 2007-08-02 EP EP07791873.8A patent/EP2048174B1/en not_active Not-in-force
- 2007-08-02 US US12/373,929 patent/US20090198040A1/en not_active Abandoned
- 2007-08-02 WO PCT/JP2007/065199 patent/WO2008016120A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2008016120A1 (fr) | 2008-02-07 |
EP2048174A1 (en) | 2009-04-15 |
EP2048174B1 (en) | 2014-10-08 |
JP2008037923A (ja) | 2008-02-21 |
US20090198040A1 (en) | 2009-08-06 |
EP2048174A4 (en) | 2010-04-21 |
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