BR8904152A - Composicao,composicao curavel,verniz de laminacao,substrato,laminado e composicao de agente de cura - Google Patents
Composicao,composicao curavel,verniz de laminacao,substrato,laminado e composicao de agente de curaInfo
- Publication number
- BR8904152A BR8904152A BR898904152A BR8904152A BR8904152A BR 8904152 A BR8904152 A BR 8904152A BR 898904152 A BR898904152 A BR 898904152A BR 8904152 A BR8904152 A BR 8904152A BR 8904152 A BR8904152 A BR 8904152A
- Authority
- BR
- Brazil
- Prior art keywords
- composition
- curing
- laminate
- substrate
- curing agent
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/232,414 US4874669A (en) | 1988-08-15 | 1988-08-15 | Curable compositions containing an epoxy resin, a difunctional phenol and a polyfunctional phenol |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8904152A true BR8904152A (pt) | 1990-04-10 |
Family
ID=22873002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR898904152A BR8904152A (pt) | 1988-08-15 | 1989-08-14 | Composicao,composicao curavel,verniz de laminacao,substrato,laminado e composicao de agente de cura |
Country Status (7)
Country | Link |
---|---|
US (1) | US4874669A (pt) |
EP (1) | EP0355563A3 (pt) |
JP (1) | JP2882644B2 (pt) |
KR (1) | KR900003286A (pt) |
AU (1) | AU621926B2 (pt) |
BR (1) | BR8904152A (pt) |
MY (1) | MY104057A (pt) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4959425A (en) * | 1987-11-16 | 1990-09-25 | The Dow Chemical Company | Laminating varnish composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol and a solvent |
US5066735A (en) * | 1987-11-16 | 1991-11-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
EP0379468B1 (de) * | 1989-01-20 | 1995-03-01 | Ciba-Geigy Ag | Härtbare Epoxidharz-Stoffgemische enthaltend einen Thermoplast mit phenolischen Endgruppen |
JPH0314818A (ja) * | 1989-06-13 | 1991-01-23 | Yuka Shell Epoxy Kk | 半導体封止用エポキシ樹脂組成物 |
JPH03139519A (ja) * | 1989-10-25 | 1991-06-13 | Sumitomo Chem Co Ltd | エポキシ樹脂用硬化剤 |
JPH04103620A (ja) * | 1990-08-24 | 1992-04-06 | Dow Chem Nippon Kk | 硬化性樹脂組成物 |
CA2061801A1 (en) * | 1991-02-26 | 1992-08-27 | Yasushi Sawamura | Semiconductor device-encapsulating epoxy resin composition |
US5159030A (en) * | 1991-03-25 | 1992-10-27 | The Dow Chemical Company | Mesogenic alkenyl functional malemides and thermosets thereof |
US5208306A (en) * | 1991-03-25 | 1993-05-04 | The Dow Chemical Company | Mesogenic alkenyl functional maleimides and thermosets thereof |
US5364925A (en) * | 1992-01-27 | 1994-11-15 | The Dow Chemical Company | Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates |
JPH10321974A (ja) * | 1997-05-22 | 1998-12-04 | Matsushita Electric Ind Co Ltd | 回路形成用基板 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1138542B (de) * | 1959-11-23 | 1962-10-25 | Reichhold Chemie Ag | Formmassen, die Epoxydverbindungen und Novolake enthalten |
BE631287A (pt) * | 1962-04-20 | 1900-01-01 | ||
GB1115611A (en) * | 1964-08-27 | 1968-05-29 | Union Carbide Corp | Epoxy resins |
US3383433A (en) * | 1964-09-22 | 1968-05-14 | Union Carbide Corp | Epoxide resins cured with phenolic novolacs and triazoles or tetrazoles |
NL133216C (pt) * | 1964-09-22 | |||
US3687894A (en) * | 1970-07-23 | 1972-08-29 | William G Collings | A composition of a liquid epoxy resin, a polyhydroxyl material and a hardener |
US3738862A (en) * | 1971-11-08 | 1973-06-12 | Shell Oil Co | Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates |
US3931109A (en) * | 1972-03-13 | 1976-01-06 | The Dow Chemical Company | Process for coating substrates with high molecular weight epoxy resins |
US4322456A (en) * | 1972-03-13 | 1982-03-30 | The Dow Chemical Company | Process for coating substrates with high molecular weight epoxy resins |
JPS56159219A (en) * | 1980-05-13 | 1981-12-08 | Dainippon Ink & Chem Inc | Curing agent composition for flame-retardant epoxy resin |
US4368299A (en) * | 1980-08-07 | 1983-01-11 | Sumitomo Chemical Company, Limited | Epoxy resin compositions |
US4343731A (en) * | 1980-12-29 | 1982-08-10 | General Electric Company | Epoxy resin composition and process for production |
JPS5819322A (ja) * | 1981-07-27 | 1983-02-04 | Dainippon Ink & Chem Inc | 新規多官能エポキシ樹脂の製造方法 |
US4440914A (en) * | 1981-10-19 | 1984-04-03 | Ciba-Geigy Corporation | Solid epoxy resin systems |
US4552814A (en) * | 1984-05-21 | 1985-11-12 | The Dow Chemical Company | Advanced epoxy resins having improved impact resistance when cured |
JPS6119622A (ja) * | 1984-07-06 | 1986-01-28 | Sumitomo Chem Co Ltd | エポキシ樹脂含有組成物 |
US4604317A (en) * | 1984-10-05 | 1986-08-05 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
JPS61148228A (ja) * | 1984-12-20 | 1986-07-05 | Ajinomoto Co Inc | 一液性エポキシ樹脂組成物 |
JPS61148226A (ja) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | 塗料用及び積層板用固体状エポキシ樹脂 |
DE3508600A1 (de) * | 1985-03-11 | 1986-09-11 | Dynamit Nobel Ag, 5210 Troisdorf | Verfahren zur herstellung von mit harz impraegnierten substraten zur verwendung bei der herstellung von laminaten fuer gedruckte schaltungen und danach hergestellte prepregs und laminate |
US4710429A (en) * | 1985-04-15 | 1987-12-01 | The Dow Chemical Company | Laminates from epoxidized phenol-hydrocarbon adducts |
JPS61246228A (ja) * | 1985-04-24 | 1986-11-01 | Shin Kobe Electric Mach Co Ltd | 積層板用樹脂組成物 |
US4632971A (en) * | 1985-07-15 | 1986-12-30 | The Dow Chemical Company | Thermally stable capped thermoplastic phenolic resin |
JPS62135539A (ja) * | 1985-12-09 | 1987-06-18 | Sanyo Kokusaku Pulp Co Ltd | エポキシ樹脂積層物 |
US4684700A (en) * | 1986-02-14 | 1987-08-04 | The Dow Chemical Company | Advanced epoxy resins prepared from triglycidyl ethers and dihydri phenols |
CA1272345A (en) * | 1986-02-24 | 1990-07-31 | The Dow Chemical Company | Curable compositions containing a polyepoxide and a halogenated bisphenol |
AU608627B2 (en) * | 1987-08-10 | 1991-04-11 | Dow Chemical Company, The | Curing agent compositions, laminating varnishes containing same and laminates prepared therefrom |
US4868059A (en) * | 1987-11-16 | 1989-09-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
-
1988
- 1988-08-15 US US07/232,414 patent/US4874669A/en not_active Expired - Lifetime
-
1989
- 1989-07-26 MY MYPI89001020A patent/MY104057A/en unknown
- 1989-08-08 EP EP89114608A patent/EP0355563A3/en not_active Withdrawn
- 1989-08-14 BR BR898904152A patent/BR8904152A/pt not_active Application Discontinuation
- 1989-08-14 JP JP1208022A patent/JP2882644B2/ja not_active Expired - Lifetime
- 1989-08-14 KR KR1019890011565A patent/KR900003286A/ko not_active Application Discontinuation
- 1989-08-15 AU AU39950/89A patent/AU621926B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
US4874669A (en) | 1989-10-17 |
JPH02209917A (ja) | 1990-08-21 |
AU3995089A (en) | 1990-06-21 |
JP2882644B2 (ja) | 1999-04-12 |
AU621926B2 (en) | 1992-03-26 |
EP0355563A2 (en) | 1990-02-28 |
KR900003286A (ko) | 1990-03-26 |
EP0355563A3 (en) | 1990-08-29 |
MY104057A (en) | 1993-10-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FB19 | Grant procedure suspended (art. 19) | ||
FD3 | Appl. lapsed due to non-payment of renewal fee |