BR8904152A - Composicao,composicao curavel,verniz de laminacao,substrato,laminado e composicao de agente de cura - Google Patents

Composicao,composicao curavel,verniz de laminacao,substrato,laminado e composicao de agente de cura

Info

Publication number
BR8904152A
BR8904152A BR898904152A BR8904152A BR8904152A BR 8904152 A BR8904152 A BR 8904152A BR 898904152 A BR898904152 A BR 898904152A BR 8904152 A BR8904152 A BR 8904152A BR 8904152 A BR8904152 A BR 8904152A
Authority
BR
Brazil
Prior art keywords
composition
curing
laminate
substrate
curing agent
Prior art date
Application number
BR898904152A
Other languages
English (en)
Inventor
Paul A Larson
Dale J Aldrich
Jody R Berman
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of BR8904152A publication Critical patent/BR8904152A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31518—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BR898904152A 1988-08-15 1989-08-14 Composicao,composicao curavel,verniz de laminacao,substrato,laminado e composicao de agente de cura BR8904152A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/232,414 US4874669A (en) 1988-08-15 1988-08-15 Curable compositions containing an epoxy resin, a difunctional phenol and a polyfunctional phenol

Publications (1)

Publication Number Publication Date
BR8904152A true BR8904152A (pt) 1990-04-10

Family

ID=22873002

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898904152A BR8904152A (pt) 1988-08-15 1989-08-14 Composicao,composicao curavel,verniz de laminacao,substrato,laminado e composicao de agente de cura

Country Status (7)

Country Link
US (1) US4874669A (pt)
EP (1) EP0355563A3 (pt)
JP (1) JP2882644B2 (pt)
KR (1) KR900003286A (pt)
AU (1) AU621926B2 (pt)
BR (1) BR8904152A (pt)
MY (1) MY104057A (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4959425A (en) * 1987-11-16 1990-09-25 The Dow Chemical Company Laminating varnish composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol and a solvent
US5066735A (en) * 1987-11-16 1991-11-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
EP0379468B1 (de) * 1989-01-20 1995-03-01 Ciba-Geigy Ag Härtbare Epoxidharz-Stoffgemische enthaltend einen Thermoplast mit phenolischen Endgruppen
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JPH03139519A (ja) * 1989-10-25 1991-06-13 Sumitomo Chem Co Ltd エポキシ樹脂用硬化剤
JPH04103620A (ja) * 1990-08-24 1992-04-06 Dow Chem Nippon Kk 硬化性樹脂組成物
CA2061801A1 (en) * 1991-02-26 1992-08-27 Yasushi Sawamura Semiconductor device-encapsulating epoxy resin composition
US5159030A (en) * 1991-03-25 1992-10-27 The Dow Chemical Company Mesogenic alkenyl functional malemides and thermosets thereof
US5208306A (en) * 1991-03-25 1993-05-04 The Dow Chemical Company Mesogenic alkenyl functional maleimides and thermosets thereof
US5364925A (en) * 1992-01-27 1994-11-15 The Dow Chemical Company Epoxy resin advanced with a dihydric phenol and further chain extended with an additional dihydric phenol for use in electrical laminates
JPH10321974A (ja) * 1997-05-22 1998-12-04 Matsushita Electric Ind Co Ltd 回路形成用基板

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1138542B (de) * 1959-11-23 1962-10-25 Reichhold Chemie Ag Formmassen, die Epoxydverbindungen und Novolake enthalten
BE631287A (pt) * 1962-04-20 1900-01-01
GB1115611A (en) * 1964-08-27 1968-05-29 Union Carbide Corp Epoxy resins
US3383433A (en) * 1964-09-22 1968-05-14 Union Carbide Corp Epoxide resins cured with phenolic novolacs and triazoles or tetrazoles
NL133216C (pt) * 1964-09-22
US3687894A (en) * 1970-07-23 1972-08-29 William G Collings A composition of a liquid epoxy resin, a polyhydroxyl material and a hardener
US3738862A (en) * 1971-11-08 1973-06-12 Shell Oil Co Process for preparing reinforced laminates in situ with epoxy-polyhydric phenol condensates
US3931109A (en) * 1972-03-13 1976-01-06 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
US4322456A (en) * 1972-03-13 1982-03-30 The Dow Chemical Company Process for coating substrates with high molecular weight epoxy resins
JPS56159219A (en) * 1980-05-13 1981-12-08 Dainippon Ink & Chem Inc Curing agent composition for flame-retardant epoxy resin
US4368299A (en) * 1980-08-07 1983-01-11 Sumitomo Chemical Company, Limited Epoxy resin compositions
US4343731A (en) * 1980-12-29 1982-08-10 General Electric Company Epoxy resin composition and process for production
JPS5819322A (ja) * 1981-07-27 1983-02-04 Dainippon Ink & Chem Inc 新規多官能エポキシ樹脂の製造方法
US4440914A (en) * 1981-10-19 1984-04-03 Ciba-Geigy Corporation Solid epoxy resin systems
US4552814A (en) * 1984-05-21 1985-11-12 The Dow Chemical Company Advanced epoxy resins having improved impact resistance when cured
JPS6119622A (ja) * 1984-07-06 1986-01-28 Sumitomo Chem Co Ltd エポキシ樹脂含有組成物
US4604317A (en) * 1984-10-05 1986-08-05 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol
JPS61148228A (ja) * 1984-12-20 1986-07-05 Ajinomoto Co Inc 一液性エポキシ樹脂組成物
JPS61148226A (ja) * 1984-12-21 1986-07-05 Toto Kasei Kk 塗料用及び積層板用固体状エポキシ樹脂
DE3508600A1 (de) * 1985-03-11 1986-09-11 Dynamit Nobel Ag, 5210 Troisdorf Verfahren zur herstellung von mit harz impraegnierten substraten zur verwendung bei der herstellung von laminaten fuer gedruckte schaltungen und danach hergestellte prepregs und laminate
US4710429A (en) * 1985-04-15 1987-12-01 The Dow Chemical Company Laminates from epoxidized phenol-hydrocarbon adducts
JPS61246228A (ja) * 1985-04-24 1986-11-01 Shin Kobe Electric Mach Co Ltd 積層板用樹脂組成物
US4632971A (en) * 1985-07-15 1986-12-30 The Dow Chemical Company Thermally stable capped thermoplastic phenolic resin
JPS62135539A (ja) * 1985-12-09 1987-06-18 Sanyo Kokusaku Pulp Co Ltd エポキシ樹脂積層物
US4684700A (en) * 1986-02-14 1987-08-04 The Dow Chemical Company Advanced epoxy resins prepared from triglycidyl ethers and dihydri phenols
CA1272345A (en) * 1986-02-24 1990-07-31 The Dow Chemical Company Curable compositions containing a polyepoxide and a halogenated bisphenol
AU608627B2 (en) * 1987-08-10 1991-04-11 Dow Chemical Company, The Curing agent compositions, laminating varnishes containing same and laminates prepared therefrom
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol

Also Published As

Publication number Publication date
US4874669A (en) 1989-10-17
JPH02209917A (ja) 1990-08-21
AU3995089A (en) 1990-06-21
JP2882644B2 (ja) 1999-04-12
AU621926B2 (en) 1992-03-26
EP0355563A2 (en) 1990-02-28
KR900003286A (ko) 1990-03-26
EP0355563A3 (en) 1990-08-29
MY104057A (en) 1993-10-30

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Legal Events

Date Code Title Description
FB19 Grant procedure suspended (art. 19)
FD3 Appl. lapsed due to non-payment of renewal fee