BR112021022750A2 - Dispositivo de processamento de ranhura e método de processamento de ranhura - Google Patents

Dispositivo de processamento de ranhura e método de processamento de ranhura

Info

Publication number
BR112021022750A2
BR112021022750A2 BR112021022750A BR112021022750A BR112021022750A2 BR 112021022750 A2 BR112021022750 A2 BR 112021022750A2 BR 112021022750 A BR112021022750 A BR 112021022750A BR 112021022750 A BR112021022750 A BR 112021022750A BR 112021022750 A2 BR112021022750 A2 BR 112021022750A2
Authority
BR
Brazil
Prior art keywords
laser beam
slot processing
processing device
condensing portion
processing method
Prior art date
Application number
BR112021022750A
Other languages
English (en)
Inventor
Hideyuki Hamamura
Original Assignee
Nippon Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp filed Critical Nippon Steel Corp
Publication of BR112021022750A2 publication Critical patent/BR112021022750A2/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/12—Scanning systems using multifaceted mirrors
    • G02B26/125—Details of the optical system between the polygonal mirror and the image plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

dispositivo de processamento de ranhura e método de processamento de ranhura. um dispositivo de processamento de ranhura (100) que forma uma ranhura em uma superfície de um objeto usando um feixe de laser inclui: um dispositivo de fonte de luz (11) que emite o feixe de laser; um espelho poligonal (10) que reflete a saída do feixe de laser do dispositivo de fonte de luz (11); e um sistema óptico que é fornecido em um caminho óptico do feixe de laser refletido a partir do espelho poligonal (10) e inclui uma porção de condensação (13a) que transmite o feixe de laser refletido de uma superfície do espelho poligonal (10) de modo a ser focado na superfície do objeto e uma porção de não condensação (13b) que é fornecida fora da porção de condensação (13a) e transmite o feixe de laser refletido a partir de uma porção de canto, na qual duas superfícies adjacentes do espelho poligonal (10) se encontram, de modo a não focar na superfície do objeto.
BR112021022750A 2019-05-14 2020-05-13 Dispositivo de processamento de ranhura e método de processamento de ranhura BR112021022750A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019091044 2019-05-14
PCT/JP2020/019132 WO2020230821A1 (ja) 2019-05-14 2020-05-13 溝加工装置及び溝加工方法

Publications (1)

Publication Number Publication Date
BR112021022750A2 true BR112021022750A2 (pt) 2022-01-18

Family

ID=73289594

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112021022750A BR112021022750A2 (pt) 2019-05-14 2020-05-13 Dispositivo de processamento de ranhura e método de processamento de ranhura

Country Status (8)

Country Link
US (1) US20220219262A1 (pt)
EP (1) EP3970904B1 (pt)
JP (1) JP7197002B2 (pt)
KR (1) KR102616094B1 (pt)
CN (1) CN113825588B (pt)
BR (1) BR112021022750A2 (pt)
PL (1) PL3970904T3 (pt)
WO (1) WO2020230821A1 (pt)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07178581A (ja) * 1993-12-21 1995-07-18 Toshiba Corp レーザ加工装置
JPH07334602A (ja) * 1994-06-13 1995-12-22 Olympus Optical Co Ltd バーコード読み取り装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法
JP4340943B2 (ja) * 2000-09-11 2009-10-07 澁谷工業株式会社 レーザ照射装置
JP2002292484A (ja) 2001-03-30 2002-10-08 Nippon Steel Corp レーザによる溝加工装置
US6788445B2 (en) * 2002-01-14 2004-09-07 Applied Materials, Inc. Multi-beam polygon scanning system
KR100462359B1 (ko) * 2004-08-18 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치 및 방법
KR20080079828A (ko) * 2007-02-28 2008-09-02 주식회사 이오테크닉스 레이저 가공 장치 및 방법
US10131018B2 (en) * 2012-04-27 2018-11-20 Nippon Steel & Sumitomo Metal Corporation Grain-oriented magnetic steel sheet and method of producing the same
JP2014161899A (ja) * 2013-02-27 2014-09-08 Mitsuboshi Diamond Industrial Co Ltd レーザ加工装置
JP6434360B2 (ja) * 2015-04-27 2018-12-05 株式会社ディスコ レーザー加工装置
KR102630078B1 (ko) 2015-12-30 2024-01-26 엘지디스플레이 주식회사 화소, 이를 포함하는 표시 장치 및 그 제어 방법
DE112017004557T5 (de) * 2016-09-09 2019-05-23 Mitsubishi Electric Corporation Laserbearbeitungsvorrichtung
EP3412400A1 (en) * 2017-06-09 2018-12-12 Bystronic Laser AG Beam shaper and use thereof, device for laser beam treatment of a workpiece and use thereof, method for laser beam treatment of a workpiece
JP7178581B2 (ja) 2018-03-20 2022-11-28 パナソニックＩｐマネジメント株式会社 送り端子カバー及び分電盤

Also Published As

Publication number Publication date
KR20210150560A (ko) 2021-12-10
KR102616094B1 (ko) 2023-12-21
US20220219262A1 (en) 2022-07-14
CN113825588B (zh) 2023-12-22
JP7197002B2 (ja) 2022-12-27
CN113825588A (zh) 2021-12-21
EP3970904B1 (en) 2023-06-21
JPWO2020230821A1 (pt) 2020-11-19
EP3970904A4 (en) 2022-07-20
PL3970904T3 (pl) 2023-08-28
WO2020230821A1 (ja) 2020-11-19
EP3970904A1 (en) 2022-03-23

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Legal Events

Date Code Title Description
B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 13/05/2020, OBSERVADAS AS CONDICOES LEGAIS