BR112019001161A2 - módulo de circuito integrado, cartão inteligente, métodos para fabricar os mesmos e fita portadora de circuito integrado - Google Patents
módulo de circuito integrado, cartão inteligente, métodos para fabricar os mesmos e fita portadora de circuito integradoInfo
- Publication number
- BR112019001161A2 BR112019001161A2 BR112019001161-7A BR112019001161A BR112019001161A2 BR 112019001161 A2 BR112019001161 A2 BR 112019001161A2 BR 112019001161 A BR112019001161 A BR 112019001161A BR 112019001161 A2 BR112019001161 A2 BR 112019001161A2
- Authority
- BR
- Brazil
- Prior art keywords
- integrated circuit
- module
- antenna
- link
- smart card
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000009429 electrical wiring Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14678—Contact-type imagers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49524—Additional leads the additional leads being a tape carrier or flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48111—Disposition the wire connector extending above another semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Pinball Game Machines (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
módulos de circuito integrado e cartões inteligentes incorporando os mesmos as modalidades da invenção fornecem um módulo de chip integrado (ic) tendo painéis de contato, que são acessíveis por orifícios de ligação única e painéis de contato da antena nos lados do módulo, que são acessíveis por orifícios de múltiplas ligações. cada um dos orifícios de múltiplas ligações é repartido por um encapsulamento em canais de ligação adjacentes para receber separadamente ligação(ões) de fio e elemento de conexão de antena. cada um dos painéis de contato de antena nos lados do módulo é repartido pelo encapsulamento em áreas de ligação adjacentes, porém conectados eletricamente, para permitir o estabelecimento de conexão elétrica de ambos ligação(ões) de fio e elemento de conexão de antena a um chip de ic.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2017/050423 WO2019045638A1 (en) | 2017-08-28 | 2017-08-28 | INTEGRATED CIRCUIT MODULES AND INTELLIGENT CARDS INCORPORATING THEM |
SGPCT/SG2017/050423 | 2017-08-28 | ||
PCT/SG2018/050074 WO2019045642A1 (en) | 2017-08-28 | 2018-02-15 | INTEGRATED CIRCUIT MODULES AND INTELLIGENT CARDS INCORPORATING THE SAME INTEGRATED CIRCUIT MODULES |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112019001161A2 true BR112019001161A2 (pt) | 2019-04-30 |
BR112019001161B1 BR112019001161B1 (pt) | 2021-11-09 |
Family
ID=65527291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112019001161-7A BR112019001161B1 (pt) | 2017-08-28 | 2018-02-15 | Módulo de circuito integrado, cartão inteligente, métodos para fabricar os mesmos e fita portadora de circuito integrado |
Country Status (17)
Country | Link |
---|---|
US (1) | US10565487B2 (pt) |
EP (2) | EP3723005B1 (pt) |
JP (1) | JP6653024B2 (pt) |
KR (1) | KR102047203B1 (pt) |
CN (1) | CN109729733B (pt) |
AU (1) | AU2018213981B2 (pt) |
BR (1) | BR112019001161B1 (pt) |
CA (1) | CA3015300C (pt) |
ES (1) | ES2816559T3 (pt) |
MX (1) | MX2018012180A (pt) |
PH (1) | PH12018501842A1 (pt) |
PL (1) | PL3475882T3 (pt) |
RU (1) | RU2715170C1 (pt) |
SG (1) | SG11201806717YA (pt) |
UA (1) | UA120809C2 (pt) |
WO (2) | WO2019045638A1 (pt) |
ZA (1) | ZA201805784B (pt) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
US11088087B2 (en) * | 2018-07-25 | 2021-08-10 | Stmicroelectronics, Inc. | Micro module with a support structure |
FR3098324B1 (fr) * | 2019-07-04 | 2021-09-24 | Smart Packaging Solutions | Module électronique pour carte à puce |
CN111626395A (zh) * | 2020-05-29 | 2020-09-04 | 东信和平科技股份有限公司 | 一种双界面安全芯片卡及制作方法 |
FR3115904B1 (fr) * | 2020-10-30 | 2023-11-17 | Linxens Holding | Procédé de fabrication d’un module de carte à puce avec composant électronique soudé |
WO2022144508A1 (fr) | 2020-12-31 | 2022-07-07 | Smart Packaging Solutions | Module électronique pour carte à puce |
DE102021002072A1 (de) * | 2021-04-20 | 2022-10-20 | Giesecke+Devrient Mobile Security Gmbh | Chipmodul und Chipkarte sowie Verfahren zu deren Herstellung |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2788646B1 (fr) * | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
KR20020011361A (ko) | 2001-12-27 | 2002-02-08 | 최완균 | 집적회로 카드 및 이에 사용되는 회로 기판 |
DE102004028218B4 (de) * | 2004-06-09 | 2006-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines tragbaren Datenträgers |
FR2880160B1 (fr) * | 2004-12-28 | 2007-03-30 | K Sa As | Module electronique double face pour carte a puce hybride |
RU71477U1 (ru) * | 2007-08-22 | 2008-03-10 | Владимир Иванович Громов | Многовыводной матричный по размерам кристалла корпус большой интегральной схемы |
ES2415364T3 (es) * | 2007-09-14 | 2013-07-25 | Toppan Printing Co., Ltd. | Hoja de antena, transpondedor y libro |
US20150235122A1 (en) * | 2012-08-30 | 2015-08-20 | David Finn | Dual interface card with metallized layer |
US20150269474A1 (en) * | 2011-08-08 | 2015-09-24 | David Finn | Rfid transponder chip modules |
US9634391B2 (en) * | 2011-08-08 | 2017-04-25 | Féinics Amatech Teoranta | RFID transponder chip modules |
US9622359B2 (en) * | 2011-08-08 | 2017-04-11 | Féinics Amatech Teoranta | RFID transponder chip modules |
CN102446868A (zh) * | 2011-12-28 | 2012-05-09 | 上海长丰智能卡有限公司 | 一种新型双界面智能卡模块及其实现方式 |
US20150269477A1 (en) * | 2012-08-30 | 2015-09-24 | David Finn | Dual-interface hybrid metal smartcard with a booster antenna or coupling frame |
US9536188B2 (en) * | 2014-04-01 | 2017-01-03 | Nxp B.V. | Dual-interface IC card components and method for manufacturing the dual-interface IC card components |
EP3128890B1 (en) * | 2014-04-07 | 2019-09-11 | Tiger Tool International Incorporated | Power head for vacuum systems |
WO2015157659A1 (en) * | 2014-04-10 | 2015-10-15 | American Banknote Corporation | Integrated circuit module for a dual-interface smart card |
FR3021145B1 (fr) * | 2014-05-14 | 2018-08-31 | Linxens Holding | Procede de fabrication d'un circuit pour module de carte a puce et circuit pour module de carte a puce |
KR101576444B1 (ko) * | 2015-07-30 | 2015-12-10 | (주)와이솔 | 압전 소자를 이용한 버튼 장치 |
EP3151167B1 (en) * | 2015-09-30 | 2020-05-20 | Nxp B.V. | Dual-interface ic card module |
EP3159831B1 (en) * | 2015-10-21 | 2018-10-03 | Nxp B.V. | Dual-interface ic card |
CN205845082U (zh) * | 2016-06-17 | 2016-12-28 | 北京同方微电子有限公司 | 一种新型双界面智能卡条带 |
-
2017
- 2017-08-28 WO PCT/SG2017/050423 patent/WO2019045638A1/en active Application Filing
-
2018
- 2018-02-15 CN CN201880001499.4A patent/CN109729733B/zh active Active
- 2018-02-15 PL PL18755387T patent/PL3475882T3/pl unknown
- 2018-02-15 BR BR112019001161-7A patent/BR112019001161B1/pt active IP Right Grant
- 2018-02-15 EP EP20176638.3A patent/EP3723005B1/en active Active
- 2018-02-15 JP JP2018545149A patent/JP6653024B2/ja active Active
- 2018-02-15 ES ES18755387T patent/ES2816559T3/es active Active
- 2018-02-15 CA CA3015300A patent/CA3015300C/en active Active
- 2018-02-15 KR KR1020187025151A patent/KR102047203B1/ko active IP Right Grant
- 2018-02-15 RU RU2018133093A patent/RU2715170C1/ru active
- 2018-02-15 MX MX2018012180A patent/MX2018012180A/es unknown
- 2018-02-15 WO PCT/SG2018/050074 patent/WO2019045642A1/en active Application Filing
- 2018-02-15 UA UAA201809420A patent/UA120809C2/uk unknown
- 2018-02-15 AU AU2018213981A patent/AU2018213981B2/en active Active
- 2018-02-15 SG SG11201806717YA patent/SG11201806717YA/en unknown
- 2018-02-15 US US16/082,253 patent/US10565487B2/en active Active
- 2018-02-15 EP EP18755387.0A patent/EP3475882B1/en active Active
- 2018-08-29 PH PH12018501842A patent/PH12018501842A1/en unknown
- 2018-08-29 ZA ZA2018/05784A patent/ZA201805784B/en unknown
Also Published As
Publication number | Publication date |
---|---|
CA3015300C (en) | 2019-07-09 |
EP3723005B1 (en) | 2024-05-29 |
EP3475882A4 (en) | 2019-09-04 |
EP3475882A1 (en) | 2019-05-01 |
PH12018501842B1 (en) | 2019-05-15 |
US10565487B2 (en) | 2020-02-18 |
CA3015300A1 (en) | 2019-02-15 |
US20190294943A1 (en) | 2019-09-26 |
JP2020505658A (ja) | 2020-02-20 |
SG11201806717YA (en) | 2019-04-29 |
UA120809C2 (uk) | 2020-02-10 |
WO2019045642A1 (en) | 2019-03-07 |
JP6653024B2 (ja) | 2020-02-26 |
CN109729733B (zh) | 2020-02-21 |
ZA201805784B (en) | 2019-05-29 |
RU2715170C1 (ru) | 2020-02-25 |
BR112019001161B1 (pt) | 2021-11-09 |
KR102047203B1 (ko) | 2019-11-21 |
EP3723005A1 (en) | 2020-10-14 |
KR20190087991A (ko) | 2019-07-25 |
CN109729733A (zh) | 2019-05-07 |
ES2816559T3 (es) | 2021-04-05 |
MX2018012180A (es) | 2019-07-01 |
PL3475882T3 (pl) | 2021-01-11 |
EP3475882B1 (en) | 2020-08-12 |
AU2018213981A1 (en) | 2019-03-28 |
WO2019045638A1 (en) | 2019-03-07 |
AU2018213981B2 (en) | 2019-07-11 |
PH12018501842A1 (en) | 2019-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BR112019001161A2 (pt) | módulo de circuito integrado, cartão inteligente, métodos para fabricar os mesmos e fita portadora de circuito integrado | |
ES2901301T3 (es) | Método de fabricación de un circuito para un módulo de tarjeta de circuito integrado y circuito para un módulo de tarjeta de circuito integrado | |
ATE522007T1 (de) | Kompaktantennensystem mit einem diversitätsgrad 2 | |
GB2525124A (en) | Connector assembly for an electronic device | |
WO2014131830A3 (de) | Chipkarte mit integrierten aktiven komponenten | |
BR112014015108A2 (pt) | etiqueta de identificação por radiofrequência | |
BR112013019548A2 (pt) | cartão inteligente de interface dupla | |
WO2007064430A3 (en) | Identification band using a conductive fastening for enhanced security and functionality | |
EP3483932A3 (en) | Ground via clustering for crosstalk mitigation | |
MY171050A (en) | Semiconductor component and method of manufacture | |
ATE206835T1 (de) | Chipkarte | |
PH12015500827A1 (en) | Simplified electronic module for a smart card with a dual communication interface | |
BR112019003310A2 (pt) | antena integrada de múltiplos sistemas | |
DE50015958D1 (de) | Chipkarte | |
EA201400820A1 (ru) | Бесконтактное устройство передачи данных, содержащий его защищенный от подделки и/или ценный документ и способ изготовления бесконтактного устройства передачи данных | |
WO2014066153A4 (en) | Multiple die stacking for two or more die | |
US20150373827A1 (en) | Chip Heat Dissipation Structure and Terminal Device | |
RU2015153023A (ru) | Устройство для защиты схемы и электронное устройство | |
BR112018016242A2 (pt) | métodos de fabricação de cartões com chip e dos suportes de antena de cartão com chip | |
BR112019003959A2 (pt) | plataforma estendida com slots de módulo de memória adicionais por soquete cpu | |
US20150156909A1 (en) | Power semiconductor module | |
EP3866260A4 (en) | ANTENNA MODULE COMPRISING A SIGNAL LINE EXPOSED EXTERIORLY THROUGH A PRINTED CIRCUIT BOARD FACE AND COMPRISING A CONDUCTIVE ELEMENT ELECTRICALLY CONNECTED TO A SIGNAL LINE, AND ELECTRONIC DEVICE COMPRISING THE SAME | |
MY197068A (en) | Method for producing a chip card module and a chip card | |
BR102012018139A2 (pt) | Pacote flip chip de dupla face | |
KR20110088885A (ko) | 핀 모듈을 포함하는 usb 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 15/02/2018, OBSERVADAS AS CONDICOES LEGAIS. |
|
B25G | Requested change of headquarter approved |
Owner name: SMARTFLEX TECHNOLOGY PTE LTD (SG) |