BR112018011113A2 - estrutura de substrato tendo peças eletrônicas nele montadas e alojamento para acomodação do substrato - Google Patents

estrutura de substrato tendo peças eletrônicas nele montadas e alojamento para acomodação do substrato

Info

Publication number
BR112018011113A2
BR112018011113A2 BR112018011113A BR112018011113A BR112018011113A2 BR 112018011113 A2 BR112018011113 A2 BR 112018011113A2 BR 112018011113 A BR112018011113 A BR 112018011113A BR 112018011113 A BR112018011113 A BR 112018011113A BR 112018011113 A2 BR112018011113 A2 BR 112018011113A2
Authority
BR
Brazil
Prior art keywords
substrate
housing
electronic parts
parts mounted
accommodation
Prior art date
Application number
BR112018011113A
Other languages
English (en)
Inventor
Noboru Kaneko
Shin Kumagai
Masakazu Morimoto
Original Assignee
Nsk Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nsk Ltd filed Critical Nsk Ltd
Publication of BR112018011113A2 publication Critical patent/BR112018011113A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0231—Circuits relating to the driving or the functioning of the vehicle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Power Steering Mechanism (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Inverter Devices (AREA)
  • Steering Control In Accordance With Driving Conditions (AREA)

Abstract

estrutura de substrato tendo peças eletrônicas nele montadas e alojamento para acomodação do substrato [resumo] [problema] o objeto da presente invenção é dispor um substrato na proximidade de um alojamento tanto quanto possível para melhorar a radiação de calor, e manter o isolamento elétrico entre o substrato e o alojamento mesmo quando o substrato é deformado, no substrato com partes eletrônicas montado nele e um alojamento para alojar o substrato. [meios para resolver o problema] a presente invenção é uma estrutura de um alojamento para alojar um substrato tendo partes eletrônicas montadas sobre ele, em que um corpo de caixa 300 do alojamento tem uma superfície de colocação de substrato 310 para colocar o substrato 400, a superfície de colocação de substrato 310 é provida de uma porção saliente 330 sobressaem a partir dali, e o substrato 400 é fixado sobre o canal de substrato de superfície 310, por meio de um material de interface térmica tim disposto sobre a superfície de colocação de substrato 310 a partir de uma periferia da porção saliente 330. [figura designada] figura 4.
BR112018011113A 2015-12-02 2016-11-25 estrutura de substrato tendo peças eletrônicas nele montadas e alojamento para acomodação do substrato BR112018011113A2 (pt)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2015235688 2015-12-02
JP2016030939 2016-02-22
JP2016095232 2016-05-11
PCT/JP2016/084908 WO2017094601A1 (ja) 2015-12-02 2016-11-25 電子部品を実装した基板とその基板を収納するケースの構造

Publications (1)

Publication Number Publication Date
BR112018011113A2 true BR112018011113A2 (pt) 2019-02-05

Family

ID=58797341

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112018011113A BR112018011113A2 (pt) 2015-12-02 2016-11-25 estrutura de substrato tendo peças eletrônicas nele montadas e alojamento para acomodação do substrato

Country Status (6)

Country Link
US (1) US10225927B2 (pt)
EP (1) EP3361844A4 (pt)
JP (4) JP6350763B2 (pt)
CN (1) CN108293310B (pt)
BR (1) BR112018011113A2 (pt)
WO (1) WO2017094601A1 (pt)

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JP7056364B2 (ja) * 2018-05-11 2022-04-19 株式会社オートネットワーク技術研究所 回路構成体及び電気接続箱
JP2020004887A (ja) * 2018-06-29 2020-01-09 日本電産エレシス株式会社 回路基板
CN110857748A (zh) * 2018-08-24 2020-03-03 王磊 界面材料层及界面材料层的制作方法
KR102554431B1 (ko) * 2018-09-05 2023-07-13 삼성전자주식회사 반도체 장치 및 반도체 장치 제조 방법
JP2020144518A (ja) * 2019-03-05 2020-09-10 キオクシア株式会社 記憶システム、記憶装置および記憶方法
JP2020178479A (ja) * 2019-04-19 2020-10-29 日本電産エレシス株式会社 インバータユニット
CN110509984A (zh) * 2019-09-24 2019-11-29 联禾厚普（太仓）精密机械有限公司 一种电动转向系统ecu固定座
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Also Published As

Publication number Publication date
JP2018198317A (ja) 2018-12-13
JPWO2017094601A1 (ja) 2018-08-30
JP6642627B2 (ja) 2020-02-05
EP3361844A1 (en) 2018-08-15
US20180343737A1 (en) 2018-11-29
JP6350763B2 (ja) 2018-07-04
CN108293310B (zh) 2020-07-03
JP6558473B2 (ja) 2019-08-14
JP2018186276A (ja) 2018-11-22
JP6558474B2 (ja) 2019-08-14
WO2017094601A1 (ja) 2017-06-08
EP3361844A4 (en) 2019-11-20
US10225927B2 (en) 2019-03-05
JP2018186275A (ja) 2018-11-22
CN108293310A (zh) 2018-07-17

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B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements
B350 Update of information on the portal [chapter 15.35 patent gazette]